Abstract: A vehicle multimedia system includes one or more displays configured to output information at a vehicle, and a processor in communication with the one or more displays. The processor is programmed to access a user's social networking website, communicate post information associated with the user's social networking website, utilize a filter associated with the post information, wherein the filter is configured to ignore post information in response to one or more settings associated with the filter, and output filtered post information at the one or more displays at the vehicle, wherein the post information includes at least text associated with the post information and user information associated with the post information.

Abstract: Compounds of Formula (I): pharmaceutically acceptable salts thereof, deuterated derivatives of any of the foregoing, and metabolites of any of the foregoing are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed. Also disclosed are solid state forms of Compound 1 and salts and solvates thereof.

Abstract: The invention relates to a shared storage space access method, device and system and a storage medium. The product comprises a control module. The control module comprises an instruction cache unit, an instruction processing unit and a storage queue unit. The instruction caching unit is used for storing a calculation instruction associated with the artificial neural network operation; the instruction processing unit is used for analyzing the calculation instruction to obtain a plurality of operation instructions; the storage queue unit is used for storing an instruction queue, and the instruction queue comprises a plurality of operation instructions or calculation instructions to be executed according to the front-back sequence of the queue. Through the method or the product, the access efficiency of the storage space can be improved.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: Embodiments of the present disclosure provide for systems and methods for generating a platform-agnostic game shortcut that, upon selection, automatically launches a cloud gaming game instance of a game. In operation, a computing device may receive user credentials associated with a user account of a cloud gaming server, as well as user credentials associated with a user account of a gaining platform hosted on the cloud gaming server. The computing device may bind the user account of the cloud gaming server to the user account of the gaining platform using the received user credentials. Responsive to receiving a selection of a game associated with the gaming platform, the computing device may generate a platform-agnostic game shortcut of the selected game. Responsive to selecting the platform-agnostic game shortcut, the computing device may automatically launch a cloud gaming game instance of the game.

Abstract: An example method includes identifying one or more available virtual servers configured to provide cloud gaining service to a user device and designating one of the one or more available virtual servers as a connecting virtual server based at least on a comparison between user parameters of the user device and server parameters of the one or more available virtual servers. The example method also includes initiating a connection between the user device and the connecting server for the connecting server to provide cloud gaming services to the user device. The example method also includes transferring the connection between the user device and a connecting server to the user device and a new selected connecting server.

Abstract: Embodiments of the present disclosure provide for systems and methods for a connected arcade cabinet with cloud gaining and broadcasting capabilities. In operation, an arcade cabinet may receive user input indicative of user credentials for accessing the cloud gaming server. Responsive to receiving user input indicative of connecting to a cloud gaming server, the arcade cabinet may connect to the cloud gaming server. Responsive to receiving user input indicative of selecting a game instance of a game installed on the cloud gaming server, the arcade cabinet may receive a transmission of an encoded game play video of the game instance of the game installed on the cloud gaming server, from the cloud gaming server. The arcade cabinet may locally decode and display the encoded game play video of the game instance of the game installed on the cloud gaming server, at the arcade cabinet.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: Compounds of Formula (I): pharmaceutically acceptable salts thereof, deuterated derivatives of any of the foregoing, and metabolites of any of the foregoing are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.

Abstract: A vehicle system in a host vehicle, comprising a vehicle transceiver located in the host vehicle and configured to receive from a remote server a selectable maneuver in response to data indicative of a driving path of one or more remote vehicles identifying one or more hazards. The system may include a processor in communication the vehicle transceiver and programmed to output one or more selectable maneuvers responsive to the data indicative of the driving path of one or more remote vehicles in response to the data indicative of the driving path identifies one or more hazards in a vicinity of the host vehicle, and a display in communication with the processor and configured to display the one or more selectable maneuvers.

Abstract: A package structure includes a semiconductor device, a circuit substrate and a heat dissipating lid. The semiconductor device includes a semiconductor die. The circuit substrate is bonded to and electrically coupled to the semiconductor device. The heat dissipating lid is bonded to the circuit substrate and thermally coupled to the semiconductor device, where the semiconductor device is located in a space confined by the heat dissipating lid and the circuit substrate. The heat dissipating lid includes a cover portion and a flange portion bonded to a periphery of the cover portion. The cover portion has a first surface and a second surface opposite to the first surface, where the cover portion includes a recess therein, the recess has an opening at the second surface, and a thickness of the recess is less than a thickness of the cover portion, where the recess is part of the space.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A computer-implemented method for utilizing vehicle connectivity to facilitate payment account transactions, the method comprising one or more wireless transceivers in communication with a remote server and mobile device, a processor in communication with the wireless transceiver and transceiver, wherein the processor is programmed to identify a transaction option utilizing data sent to the vehicle computer system, wherein the data is associated with a point of interest (POI), in response to identifying the transaction option, outputting a prompt on a vehicle display, the prompt including the transaction option, and sending information regarding the transaction option to the remote server.

Abstract: One embodiment includes partially forming a first through via in a substrate of an interposer, the first through via extending into a first side of the substrate of the interposer. The method also includes bonding a first die to the first side of the substrate of the interposer. The method also includes recessing a second side of the substrate of the interposer to expose the first through via, the first through via protruding from the second side of the substrate of the interposer, where after the recessing, the substrate of the interposer is less than 50 ?m thick. The method also includes and forming a first set of conductive bumps on the second side of the substrate of the interposer, at least one of the first set of conductive bumps being electrically coupled to the exposed first through via.

Abstract: A package structure includes an interposer, a die over and bonded to the interposer, and a Printed Circuit Board (PCB) underlying and bonded to the interposer. The interposer is free from transistors therein (add transistor), and includes a semiconductor substrate, an interconnect structure over the semiconductor substrate, through-vias in the silicon substrate, and redistribution lines on a backside of the silicon substrate. The interconnect structure and the redistribution lines are electrically coupled through the through-vias.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: The present invention relates to a thermoplastic polyurethane fiber and a method for producing the same. A thermoplastic polyurethane material is firstly provided and subjected to a molten extruding process to form a fiber material. Next, an extension process is performed to the fiber material to obtain the thermoplastic polyurethane fiber of the present invention. The thermoplastic polyurethane fiber has a lower thermal shrinking property, thereby meeting requirements of the application.

Abstract: The present disclosure is relates to an artifical leather and a. manufacturing method thereof. The artifical leather includes a substrate, a TPU adhering layer, a TPU layer and a surface layer. The substrate includes a first surface and a second surface. The TPU adhering layer is disposed on the first surface of the substrate. The TPU layer is disposed on the TPU adhering layer. The density of the TPU layer is 0.6-0.9 g/cm3. The surface layer is disposed on the TPU layer. By utilizing the above density, the artifical leather of the present invention has high peeling strength to improve the property of the material. In addition, by using the TPU layer, the artifical leather of the present invention has a texture of leather.