Patents by Inventor Ping Lu
Ping Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250150253Abstract: A phase-interpolator (PI) circuit generates an interpolated clock to capture data in a capture circuit at a target phase in a phase range between two reference clocks based on an interpolation code within a range of interpolation codes is described. A clamping circuit coupled to the PI circuit provides an interpolation code within a reduced range, where the integral non-linearity (INL) of the interpolated clocks is below a threshold, such that data capture based on the interpolated clock has a lower bit error rate (BER). As a result, the interpolated clock is generated within a reduced phase range corresponding to the reduced range of interpolation codes. When a target phase for an interpolated clock is outside the reduced phase range, the clamping circuit may adjust the target phase clock relative to a reference clock to adjust the target phase to be within the reduced phase range for improved BER.Type: ApplicationFiled: November 3, 2023Publication date: May 8, 2025Inventors: Ping LU, Minhan CHEN
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Publication number: 20250147468Abstract: A time-to-digital converter (TDC) circuit generates a digital output indicating a time, known as a phase difference, from a phase of the generated signal to a corresponding phase of a reference signal. The digital output is used by the digitally controlled oscillator (DCO) to correct for the phase/frequency difference to synchronize the generated signal with the reference signal. In an aspect, an adaptive TDC circuit generates a first digital indication in a coarse mode when the offset time is above a threshold and generates a second digital indication in a fine mode when the offset time is below the threshold. The first digital indication and the second digital indication each comprise a same number of bits, and the first digital indication is normalized to the second digital indication for the digital output of the adaptive TDC circuit. A fractional bit may be employed to compensate for a quantization error.Type: ApplicationFiled: January 13, 2025Publication date: May 8, 2025Inventors: Ping LU, Minhan CHEN
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Publication number: 20250141456Abstract: In a calibrated digital phase-locked-loop (DPLL) circuit, during a normal operating mode, a control value provided to a digitally controlled oscillator (DCO) is updated by a feedback circuit to keep an output clock generated by the DCO synchronized with a reference clock. The feedback circuit includes a time-to-digital converter (TDC) circuit to measure a phase difference as a time interval. In a calibration operating mode of the calibrated DPLL circuit, calibration of a resolution of a time measurement of the time interval measured by the TDC is performed in the feedback circuit while the control value provided to the DCO is kept constant. Calibrating the TDCs in each of the DPLLs in an integrated circuit (IC) to a nominal resolution in this manner improves synchronization of the clock domains. In some examples, the TDC circuit is a Vernier type circuit and calibration sets a delay difference to a nominal resolution.Type: ApplicationFiled: October 31, 2023Publication date: May 1, 2025Inventors: Ping LU, Minhan CHEN, Shaishav A. DESAI
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Publication number: 20250127783Abstract: Disclosed are methods of treating diseases or disorders mediated by dysregulated CDK4/6 and/or Pin 1 activity comprising co-administering a therapeutically effective amount of one or more CDK4/6 inhibitors, and a therapeutically effective amount of one or more Pin1 inhibitors, or a pharmaceutically acceptable salt or salts thereofType: ApplicationFiled: September 23, 2022Publication date: April 24, 2025Applicants: DANA-FARBER CANCER INSTITUTE, INC., BETH ISRAEL DEACONESS MEDICAL CENTER, INC., YEDA RESEARCH AND DEVELOPMENT CO. LTD.Inventors: Shizhong KE, Gerburg WULF, Xiao Zhen ZHOU, Nir LONDON, Wenyi WEI, Kun Ping LU, Nathanael S. GRAY, Behnam NABET
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Patent number: 12280414Abstract: A stamping assembly includes an upper die, a lower die, first pins and second pins. Each of the upper and lower dies has columns of depressions and columns of guiding holes. Each column of the guiding holes is disposed between two adjacent columns of the depressions. The depressions of one of the upper and lower dies are registered with the guiding holes of another one of the upper and lower dies. The first pins and second pins are respectively positioned in the guiding holes of the upper and lower dies and extend outwardly. The first pins and the second pins are respectively arranged into first and second matrices.Type: GrantFiled: June 24, 2021Date of Patent: April 22, 2025Assignees: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY, CERAM ENERGY TECHNOLOGY CO., LTD.Inventors: Sea-Fue Wang, Fan-Ping Chen, Hsi-Chuan Lu
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Publication number: 20250125189Abstract: A method for manufacturing an interconnect structure includes: forming a first dielectric layer; forming a mask; patterning the first dielectric layer through the mask to form a trench, an inner surface of the trench having two first portions opposite to each other along an X direction, two second portions opposite to each other along a Y direction, and a bottom portion; forming a second dielectric layer over the mask and the patterned first dielectric layer, and along an inner surface of the trench; etching the second dielectric layer by directing an etchant in a predetermined direction such that a first part of the second dielectric layer on the two first portions and the bottom portion is removed, and a second part of the second dielectric layer on the second portions of the trench remains and is formed into two reinforcing spacers; and forming a trench-filling element.Type: ApplicationFiled: October 13, 2023Publication date: April 17, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Hao LIAO, Hsi-Wen TIEN, Chih-Wei LU, Hwei-Jay CHU, Yu-Teng DAI, Hsin-Chieh YAO, Yung-Hsu WU, Li-Ling SU, Chia-Wei SU, Hsin-Ping CHEN
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Publication number: 20250125251Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, strained layers, source/drain contact patterns, a gate contact via, and source/drain contact vias. The gate structure is disposed over the semiconductor substrate. The strained layers are disposed aside the gate structure. The source/drain contact patterns are disposed on and electrically connected to the strained layers. Top surfaces of the source/drain contact patterns are coplanar with a top surface of the gate structure. The gate contact via is disposed on and electrically connected to the gate structure. The source/drain contact vias are disposed on and electrically connected to the source/drain contact patterns.Type: ApplicationFiled: October 16, 2023Publication date: April 17, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Li-Ling Su, Chia-Wei Su, Tsu-Chun Kuo, Wei-Hao Liao, Hsin-Ping Chen, Yung-Hsu Wu, Ming-Han Lee, Shin-Yi Yang, Chih Wei LU, Hsi-Wen Tien, Meng-Pei Lu
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Publication number: 20250119726Abstract: According to an aspect, there is provided a method performed by a network function consumer, NFC. The method comprises sending (701) a request (401) to a network function producer, NFP, wherein the request (401) is for context information for a first wireless device, and wherein the request (401) comprises one or more filter values identifying a subset of context information for the first wireless device required by the NFC. The subset of context information for the first wireless device required by the NF consumer is related to specific Protocol Data Unit, PDU, sessions.Type: ApplicationFiled: February 6, 2023Publication date: April 10, 2025Applicant: Telefonaktiebolaget LM Ericsson (publ)Inventors: Ping ZHOU, Cheng WANG, Jianxin MA, Yunjie LU, Chunbo WANG
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Publication number: 20250110307Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: December 12, 2024Publication date: April 3, 2025Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Publication number: 20250112087Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.Type: ApplicationFiled: October 3, 2023Publication date: April 3, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hwei-Jay CHU, Hsi-Wen TIEN, Wei-Hao LIAO, Yu-Teng DAI, Hsin-Chieh YAO, Tzu-Hui WEI, Chih Wei LU, Chan-Yu LIAO, Li-Ling SU, Chia-Wei SU, Yung-Hsu WU, Hsin-Ping CHEN
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Patent number: 12267963Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.Type: GrantFiled: January 31, 2024Date of Patent: April 1, 2025Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: Li-Ping Wang, Yung-Ping Lin, Yong-Kang Zhang, Qiu-Ri Zhang, You-Zhi Lu
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Patent number: 12264133Abstract: Certain substituted urea derivatives selectively modulate the cardiac sarcomere, for example by potentiating cardiac myosin, and are useful in the treatment of systolic heart failure including congestive heart failure.Type: GrantFiled: October 22, 2021Date of Patent: April 1, 2025Assignee: CYTOKINETICS, INCORPORATEDInventors: Bradley Paul Morgan, Alex Muci, Pu-Ping Lu, Todd Tochimoto, David J. Morgans, Jr., Erica Anne Kraynack
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Publication number: 20250107242Abstract: A semiconductor structure includes a semiconductor substrate, an epitaxy layer, a dielectric layer, a semiconductor layer, a first semiconductor device and a second semiconductor device. The semiconductor substrate has first region and a second region. The epitaxy layer is disposed on and within the first region of the semiconductor substrate. The dielectric layer is disposed on and within the second region of the semiconductor substrate. The semiconductor layer is disposed on the dielectric layer and within the second region. The first semiconductor device is formed on the epitaxy layer. The second semiconductor device is formed on the semiconductor layer.Type: ApplicationFiled: September 24, 2024Publication date: March 27, 2025Applicant: Invention and Collaboration Laboratory, Inc.Inventors: Chao-Chun LU, Li-Ping HUANG
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Patent number: 12259296Abstract: An apparatus, method and system are set forth for detection of fluids using Bragg grating sensors, wherein the Bragg grating sensing element comprises an optical fiber having a Bragg grating inscribed therein characterized by optical properties that are dependent upon the periodicity and effective refractive index of the grating, and a package for subjecting the Bragg grating to a change in strain when contacted by a fluid such that periodicity and effective refractive index of the grating changes, whereby when interrogated with laser light any such change in periodicity and effective refractive index may be detected.Type: GrantFiled: January 10, 2020Date of Patent: March 25, 2025Assignee: NATIONAL RESEARCH COUNCIL OF CANADAInventors: Cyril Hnatovsky, Dan Grobnic, Stephen Mihailov, Ping Lu, Kasthuri De Silva, Huimin Ding, David Coulas, Robert Walker
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Patent number: 12261133Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.Type: GrantFiled: April 8, 2024Date of Patent: March 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Yang Hsieh, Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo, Chih-Ai Huang
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Patent number: 12254610Abstract: A detection method includes acquiring a first shot image of a long-side weld of a battery cell under detection by using a first structured light camera on a long side of the battery cell under detection, acquiring a second shot image of a short-side weld of the battery cell under detection by using a second structured light camera on the short side of the battery cell under detection, detecting a defect of the long-side weld of the battery cell under detection based on the first shot image, and detecting a defect of the short-side weld of the battery cell under detection based on the second shot image.Type: GrantFiled: August 2, 2023Date of Patent: March 18, 2025Assignee: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITEDInventors: Lin Ma, Ziyang Shen, Zhipeng Zhang, Ping Jiang, Gaofeng Lu
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Patent number: 12255205Abstract: A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substrate and first and second pair of gate structures disposed on the first and second fin portions. The second pair of gate structures is electrically isolated from the first pair of gate structures. The semiconductor device further includes a first isolation structure interposed between the first pair of gate structures and a second isolation structure interposed between the second pair of gate structures. The first isolation structure includes a first nitride liner and a first oxide fill layer. The second isolation structure includes a second nitride liner and a second oxide fill layer. The second nitride layer is thicker than the first nitride layer.Type: GrantFiled: May 27, 2022Date of Patent: March 18, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chieh-Ping Wang, Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui
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Publication number: 20250064345Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.Type: ApplicationFiled: October 18, 2024Publication date: February 27, 2025Applicant: Industrial Technology Research InstituteInventors: Je-Ping Hu, Keng-Hsun Lin, Shih-Fang Yang Mao, Pin-Chou Li, Jian-Hong Wu, Szu-Ju Li, Hui-Yu Cho, Yu-Chang Chen, Yen-Nien Lu, Jyun-Siang Hsu, Nien-Ya Lee, Kuan-Ting Ho, Ming-Chieh Tsai, Ching-Yu Huang
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Patent number: 12216434Abstract: A time-to-digital converter (TDC) circuit generates a digital output indicating a time, known as a phase difference, from a phase of the generated signal to a corresponding phase of a reference signal. The digital output is used by the digitally controlled oscillator (DCO) to correct for the phase/frequency difference to synchronize the generated signal with the reference signal. In an aspect, an adaptive TDC circuit generates a first digital indication in a coarse mode when the offset time is above a threshold and generates a second digital indication in a fine mode when the offset time is below the threshold. The first digital indication and the second digital indication each comprise a same number of bits, and the first digital indication is normalized to the second digital indication for the digital output of the adaptive TDC circuit. A fractional bit may be employed to compensate for a quantization error.Type: GrantFiled: May 31, 2022Date of Patent: February 4, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Ping Lu, Minhan Chen
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Publication number: 20250039338Abstract: Example systems and method for providing a spatial chat view within a messaging platform are provided. A processing device provides a spatial chat user interface (UI) for each of a plurality of participants within a messaging session. The spatial chat UI comprises a virtual background, a plurality of spatialized visual representations, and a message composing component. A portion of the virtual background corresponds to a physical space. Each of the plurality of spatialized visual representations is a representation of one of the plurality of participants overlaid on the virtual background. The plurality of spatialized visual representations is positioned in a spatialized fashion throughout a length and width of the virtual background. An initial location of a spatialized visual representation corresponds to a physical location associated with a corresponding participant in the physical space. The processing device determines an availability status for each of the plurality of participants.Type: ApplicationFiled: October 10, 2024Publication date: January 30, 2025Applicant: Zoom Video Communications, Inc.Inventors: Oded Gal, Andrew Law, Sally Lu, Ping Luo, Sharvari Nerurkar, Archil Vardidze, Zheng Yuan