Abstract: Over-molded IC package assemblies including an in-mold capacitor. In some embodiments, an over-molded package assembly includes a IC chip or die coupled to one or more metal distribution layer or package substrate. A molding compound encapsulates at least the IC chip and one or more capacitors are fabricated within the molding compound. The capacitors may include two or more metal plates separated by an intervening dielectric material, all of which are embedded within a trench in the molding compound. Individual ones of the capacitor plates may physically contact a conductive land of the package redistribution layer or package substrate, for example to tie the plates to a ground plane and power plane, or two supply rails, in a decoupling capacitor application.

Abstract: A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.

Abstract: Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.

Abstract: Embodiments of the invention provide methods, systems, computer program products for managing a call waiting in a queue during a request for staff services provided by a call center. According to the method, a first voice segment received in a call made by a device is recorded first. Next, whether a part of the first voice segment is related to a first predefined voice segment is determined. The volume of device is adjusted in response to the part of the first voice segment being related to the first predefined voice segment. A user of the device is alerted in response to the part of the first voice segment being not related to the first predefined voice segment.

Abstract: A stacked-die and stacked-capacitor package vertically arranged capacitors to mirror a semiconductive-device stack. The stacked capacitor can be electrically coupled to one or more semiconductive devices in the stacked architecture.

Abstract: A computer-implemented method, a computer program product, and a computer system for parallel task management. A computer system receives a new task that requests to access a resource may be received. In response to an access workload being above a first threshold, the computer system dispatches the new task to at least one predefined processing unit, wherein the access workload may be associated with the resource that is in parallel accessed by a plurality of existing tasks.

Abstract: According to an embodiment of the present disclosure, there is provided a method for a distributed transaction processing environment. The method includes in response to determining that a state of a first node acting as a first coordinating node is not performing properly, selecting a second node from a first plurality of participating nodes communicatively coupled to the first node. The method further includes activating the selected second node to be a second coordinating node while deactivating the first node to be a participating node. In addition, the method includes performing a transaction based on a cooperation between the first and second nodes.

Abstract: According to an embodiment of the present disclosure, there is provided a method for a distributed transaction processing environment. The method includes in response to determining that a state of a first node acting as a first coordinating node is not performing properly, selecting a second node from a first plurality of participating nodes communicatively coupled to the first node. The method further includes activating the selected second node to be a second coordinating node while deactivating the first node to be a participating node. In addition, the method includes performing a transaction based on a cooperation between the first and second nodes.

Abstract: A stacked-die and stacked-capacitor package vertically arranged capacitors to mirror a semiconductive-device stack. The stacked capacitor can be electrically coupled to one or more semiconductive devices in the stacked architecture.

Abstract: A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.

Abstract: Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.

Abstract: Embodiments of the present invention provide a computer-implemented method for generating an API difference description file that describes the differences between multiple API versions to assist in migrating an application program from a first version to a second version. The method includes receiving a first API description file of a first version of a web API, receiving a second API description file of a second version of the web API, generating an API difference description file that describes differences between the first and second API description files, and then updating an application program using the API difference description file.

Abstract: Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a base package, an ancillary package, and an electrically isolated metal layer. The base package may include a base die. The ancillary package may include an ancillary component. The ancillary package may be located on top of the base package. The electrically isolated metal layer may be located at least partially within a layer of the base package such that a portion of the electrically isolated metal layer contacts at least one surface of the base die and is located in between the base die and the ancillary component.

Abstract: Over-molded IC package assemblies including an embedded voltage reference plane and/or heat spreader. In some embodiments, an over-molded package assembly includes a IC chip or die coupled to one or more metal distribution layer or package substrate. A molding compound encapsulates at least the IC chip and one or more conductive layers are embedded within the molding compound. The conductive layers may include an interior portion located over the IC chip and a peripheral portion located over the redistribution layers or package substrate. The interior portion may comprise one or more heat conductive features, which may physically contact a surface of the IC chip. In some further embodiments, the peripheral portion comprises one or more electrically conductive features, which may physically contact a surface of the package redistribution layers or package substrate to convey a reference voltage.

Abstract: Embodiments of the present invention provide a computer-implemented method for generating an API difference description file that describes the differences between multiple API versions to assist in migrating an application program from a first version to a second version. The method includes receiving a first API description file of a first version of a web API, receiving a second API description file of a second version of the web API, generating an API difference description file that describes differences between the first and second API description files, and then updating an application program using the API difference description file.

Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

Abstract: An electronic circuit including a substrate having a first dielectric characteristic. The substrate can include a first side and a second side. An intermediary material can be disposed within the substrate. For instance, the intermediary material can be located between the first side and the second side. The intermediary material can include a second dielectric characteristic, where the second dielectric characteristic is different than the first dielectric characteristic. A first conductive layer can be disposed on the first side, and a second conductive layer can be disposed on the second side. A conductive path can be electrically coupled between the first conductive layer and the second conductive layer. The conductive path can be in contact with at least a portion of the intermediary material.

Abstract: A semiconductor package substrate includes a composite and stacked vertical interconnect on a land side of the substrate. The composite and stacked vertical interconnect includes a smaller contact end against the semiconductor package substrate, and a larger contact end for board mounting.

Abstract: Embodiments of the present invention provide a computer-implemented method for generating an API difference description file that describes the differences between multiple API versions to assist in migrating an application program from a first version to a second version. The method includes receiving a first API description file of a first version of a web API, receiving a second API description file of a second version of the web API, generating an API difference description file that describes differences between the first and second API description files, and then updating an application program using the API difference description file.

Abstract: Embodiments of the present disclosure are directed toward a stacked package assembly for embedded dies and associated techniques and configurations. In one embodiment, stacked package assembly may comprise a first die package and a second die package stacked one upon the other with plural interconnections between them; and a voltage reference plane embedded in at least one of the first and second die packages in proximity and generally parallel to the other of the first and second die packages.