Abstract: An integrated circuit structure in which a gate overlies channel region in an active area of a first transistor. The first transistor includes a channel region, a source region and a drain region. A conductive contact is coupled to the drain region of the first transistor. A second transistor that includes a channel region, a source region a drain region is adjacent to the first transistor. The gate of the second transistor is spaced from the gate of the first transistor. A conductive via passes through an insulation layer to electrically connect to the gate of the second transistor. An expanded conductive via overlays both the conductive contact and the conductive via to electrically connect the drain of the first transistor to the gate of the second transistor.

Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

Abstract: Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

Abstract: An optical lens assembly includes: a first element group, including a first lens group, a partial-reflective-partial-transmissive element and a first optical layer that is located on a visual-side surface of a lens of the first lens group closest to a visual side and includes, in order from the visual side to an image source side, a first absorptive polarizer, a reflective polarizer and a first phase retarder; a second element group, including a second lens group and an image source plane; and a second optical layer, located between the partial-reflective-partial-transmissive element and the image source plane and including, in order from the visual side to the image source side, a second phase retarder and a second absorptive polarizer. When the optical lens assembly satisfies a specific condition, the weight of the device can be reduced, the zoom function can be provided, and the image quality can be ensured.

Abstract: An optical lens assembly includes, in order from a visual side to an image source side: a first lens with positive refractive power; an optical element including, in order from the visual side to the image source side, an absorptive polarizer, a reflective polarizer and a first phase retarder; a second lens with positive refractive power; a partial-reflective-partial-transmissive element; a second phase retarder; and an image source plane. The optical lens assembly has a total of two lenses with refractive power. A focal length of the optical lens assembly is f, a maximum image-source height of the optical lens assembly is IMH, a focal length of the first lens is f1, a focal length of the second lens is f2, and following conditions are satisfied: 0.40<IMH/f<1.26 and 0.21<f2/f1<2.35. A head-mounted electronic device includes the optical lens assembly.

Abstract: An optical lens assembly includes, in order from a visual side to an image source side: a first group including a first lens group and an optical element, and the optical element including, in order from the visual side to the image source side: an absorptive polarizer, a reflective polarizer and a first phase retarder; a second group including, in order from the visual side to the image source side: a second lens group with positive refractive power and a partial-reflective-partial-transmissive element; and a third group including, in order from the visual side to the image source side: a second phase retarder and an image source plane. When the optical lens assembly satisfies certain conditions, the weight of the device can be reduced, the zooming function can be provided, and the image quality can be ensured.

Abstract: Methods for making laser-marked packaged surface acoustic wave devices are provided. The method may include directly marking a surface of a piezoelectric substrate, where the opposite surface of the piezoelectric substrate includes a package structure encapsulating a surface acoustic wave device. The method may include exposing the surface of the piezoelectric substrate to light from a deep ultraviolet laser. By using a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings may extend less than 1 micrometer into the piezoelectric substrate, and do not affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

Abstract: An optical imaging lens device includes, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element having an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, the object-side and image-side surfaces of the sixth lens element being provided with at least one inflection point, at least one of the object-side and image-side surfaces of the sixth lens element having a sagittal height in a first axis, a sagittal height in a second axis and a sagittal height in a third axis, and at least two of these sagittal heights being different. The optical imaging lens device may meet the needs of miniaturization, wide field of view and low distortion.

Abstract: Packaged surface acoustic wave devices are provided. The packaged surface acoustic wave devices are relatively thin and can have a height of less than 220 micrometers. The packaged surface acoustic wave device includes a photosensitive resin over a conductive structure which may be formed by a plating process. The conductive structure may overlie a cavity-defining structure encapsulating a surface acoustic wave device, the cavity-defining structure including walls and a roof. The photosensitive resin can include a phenol resin. The photosensitive resin can be relatively thin. Edge portions of a piezoelectric substrate can be free from the photosensitive resin.

Abstract: A liquid control valve includes a base, a liquid stopper, an adjusting rod, and a linkage. The base includes a first chamber and a second chamber intercommunicating with each other. The base further includes an inner face having an upper stop portion. The liquid stopper includes a valve body movably received in the first chamber and a seal for abutting against the upper stop portion. The adjusting rod includes a fixing arm and an adjusting arm, which are connected to each other by a conical hole and a cone. An end of the fixing arm is pivotably connected to a first pivotal portion of the base. The linkage includes a driving arm and a connecting arm which are pivotably connected. An end of the driving arm is pivotably connected to a second pivotal portion of the base. An end of the connecting arm is pivotably connected to the fixing arm.

Abstract: A liquid control valve includes a base, a liquid stopper, an adjusting rod, and a linkage. The base includes a first chamber and a second chamber intercommunicating with each other. The base further includes an inner face having an upper stop portion. The liquid stopper includes a valve body movably received in the first chamber and a seal for abutting against the upper stop portion. The adjusting rod includes a fixing arm and an adjusting arm, which are connected to each other by a conical hole and a cone. An end of the fixing arm is pivotably connected to a first pivotal portion of the base. The linkage includes a driving arm and a connecting arm which are pivotably connected. An end of the driving arm is pivotably connected to a second pivotal portion of the base. An end of the connecting arm is pivotably connected to the fixing arm.

Abstract: The present disclosure provides a large-scale malware classification system, comprising a client for unloading malware and a server for receiving and classifying the malware, wherein the server comprises a deep learning module for classifying the malware.

Abstract: An elbow joint rehabilitation system and an elbow joint rehabilitation method are provided. The elbow joint rehabilitation system includes a support member, a motor, a torque sensing unit, a first electromyography sensor, a second electromyography sensor and a motor control device. In the elbow joint rehabilitation method, the support member is configured to support an arm of a patient. Thereafter, the torque sensing unit is configured to sense the torque applied on the support member to obtain a sensed arm torque signal. Then, the first electromyography sensor and the second electromyography sensor are configured to sense the muscle activities of biceps and triceps of the patient to obtain electromyography signals. Thereafter, the motor is controlled to drive the support member to perform rehabilitation in accordance with the sensed arm torque signal, the electromyography signals and a current support member position provided by the motor.

Abstract: An optical imaging lens device includes, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element having an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, the object-side and image-side surfaces of the sixth lens element being provided with at least one inflection point, at least one of the object-side and image-side surfaces of the sixth lens element having a sagittal height in a first axis, a sagittal height in a second axis and a sagittal height in a third axis, and at least two of these sagittal heights being different. The optical imaging lens device may meet the needs of miniaturization, wide field of view and low distortion.

Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

Abstract: A method of preparing an electret by saturating a nonwoven fabric with a liquid, such as water, and removing the liquid via suction to generate charges by friction between the fabric fibers and the liquid is described. The saturating can be carried out, for example, by impinging the bottom side of the fabric with a jet or jets of water while the fabric is being pulled under a solid roller. Excess water can also be applied during a water quenching step of a meltblowing or spunbonding process. An apparatus for preparing an electret according to the presently disclosed methods is also described.

Abstract: The present disclosure provides a large-scale malware classification system, comprising a client for unloading malware and a server for receiving and classifying the malware, wherein the server comprises a deep learning module for classifying the malware.

Abstract: The present invention provides a method for in-depth profile control and displacement of low-permeability oil reservoirs, comprising: sequentially injecting a flexible and elastic particle-containing pre-slug, a polymer microsphere-containing main slug and a flexible and elastic particle-containing protective slug into an oil layer, and the three slugs have a volume ratio of total injection amount of 1-2:6-8:1-2. The invention provides a method for in-depth profile control and displacement by using styrene-based flexible and elastic particles in combination with the polyacrylamide polymer microsphere, wherein the flexible elastic particles can block cracks and large pore channels of the oil layer, and the polymer microsphere can displace the remaining oil in the oil layer. In the present invention, different slugs of profile control and displacement system are combined to achieve the objective of blocking cracks and large pore channels, displacing crude oil, and improving oil well recovery.