Abstract: Apparatuses, methods, and systems for closing open loops of a wireless mesh network are disclosed. One method includes determining a representation of a wireless mesh network including nodes, and wireless links between the nodes, identifying end-site nodes of the wireless mesh network, determining open loops of the wireless mesh network that include the identified end-site nodes, generating a list of potential nodes for closing each of the open loops with the identified end-site node, testing one or more of the potential nodes, comprising testing performance of a wireless connection between each end-site node and the one or more potential nodes, wherein the performance includes a number of wireless hops around each closed loop formed including the end-site node and each potential node, selecting a closing node based on the testing, and providing a wireless link connection between one or more of the end-site nodes and the closing node.

Abstract: A system comprising a plurality of nodes communicatively coupled to one another via at least one wireless link and a controller communicatively coupled to at least one of the nodes, wherein the controller (1) coordinates at least one scan that measures interference introduced into the wireless link, (2) identifies, based at least in part on the scan, one or more characteristics of the wireless link, (3) determines, based at least in part on the characteristics of the wireless link, that the node is eligible for a tapered codebook that, when implemented, modifies at least one feature of an antenna array that supports the wireless link in connection with the node, and then (4) directs the node to implement the tapered codebook. Various other apparatuses, systems, and methods are also disclosed.

Abstract: In one embodiment, a method includes receiving SRS received from a plurality of UEs associated with the base station from an RU associated with the base station, estimating strengths or signal-to-noise ratios (SNRs) for pre-determined beams for each of the plurality of UEs based on the received SRS, selecting a subset of the plurality of UEs to which downlink data is to be transmitted for a RBG in a TTI based on the estimated strengths or SNRs of the pre-determined beams for the plurality of UEs, computing a precoding matrix for the RBG based on the selected subset, preparing multi-layered UE data for the RBG based on the selected subset and the computed precoding matrix, sending the multi-layered UE data and the precoding matrix for the RBG to the RU, where the RU transmits pre-coded multi-layered UE data to the UEs in the subset using MIMO technologies.

Abstract: A system comprising a plurality of nodes communicatively coupled to one another via at least one wireless link and a controller communicatively coupled to at least one of the nodes, wherein the controller (1) coordinates at least one scan that measures interference introduced into the wireless link, (2) identifies, based at least in part on the scan, one or more characteristics of the wireless link, (3) determines, based at least in part on the characteristics of the wireless link, that the node is eligible for a tapered codebook that, when implemented, modifies at least one feature of an antenna array that supports the wireless link in connection with the node, and then (4) directs the node to implement the tapered codebook. Various other apparatuses, systems, and methods are also disclosed.

Abstract: In one embodiment, a method includes sending SRS received from a plurality of UEs associated with the base station to a DU associated with the base station, receiving information regarding a subset of the plurality of UEs selected for downlink data transmissions for an RBG, multi-user data to be transmitted to UEs in the subset, and identities of selected beams among a plurality of pre-determined beams to be associated with the UEs in the subset from the DU, where each of the plurality of pre-determined beams corresponds to a DFT vector, computing a precoding matrix for the RBG based on IDFT vectors corresponding to the selected beams, preparing pre-coded multi-user data by applying the precoding matrix to the multi-user data, and transmitting the pre-coded multi-user data to the UEs in the subset for the RBG using MIMO technologies.

Abstract: A resonant control device and a resonant control method thereof is provided. The resonant control device includes a feedback controller and a processor. The feedback controller receives a reference voltage and an output voltage and use the reference voltage to perform voltage compensation on the output voltage to generate a control parameter. The processor generates pulse modulation signals according to the control parameter and a switching parameter and uses the pulse modulation signals to drive the resonant converter to regulate the output voltage. The pulse modulation signal has the maximum frequency and the minimum frequency. The pulse modulation signals control the frequency according to the control parameter and the switching parameter when the control parameter is larger than or equal to the switching parameter. Otherwise, the pulse modulation signals control the resonant converter to operate for a fixed period within each cycle of the pulse modulation signal.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

Abstract: The present invention relates to a method for forming a 3D optical component comprising the steps of: forming over a substrate a liquid layer of a polymer in a solvent, drying said polymer for removing at least a portion of said solvent and thereby creating a layer having a first dissolution rate, exposing by multi-photon absorption using an electromagnetic radiation source a predefined volume of said layer, thereby causing the volume to have a second dissolution rate which is different to said first dissolution rate, dissolve the non-exposed areas with a liquid solution for forming the 3D optical component, wherein said polymer is Hydrogen silsesquioxane, HSQ, and said dried layer having a thickness of at least 1 ?m.

Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.

Abstract: An illustrative method includes obtaining a three-dimensional (3D) mesh of a subject, obtaining a mesh model, and generating a hybrid mesh of the subject. The generating includes replacing a portion of the 3D mesh with the mesh model such that the hybrid mesh includes a non-replaced portion of the 3D mesh represented at a first resolution and the mesh model representing the replaced portion of the 3D mesh at a second resolution.

Abstract: A foldable display device includes a first panel having a first flat portion and a first bending portion at one side of the first flat portion. The first bending portion has a first bending axis around which the first bending portion rotates. The foldable display device also includes a second panel having a second flat portion and a second bending portion at one side of the second flat portion. The second bending portion has a second bending axis around which the second bending portion rotates. The first bending portion and the second bending portion are arranged adjacent to each other.

Abstract: A linked hinge mechanism includes a first member, a second member, a hinge unit and a passive unit. The hinge unit is connected to the first member and the second member, wherein the first member is adapted to be rotated relative to the second member via the hinge unit. The passive unit is adapted to be moved by the movement of the hinge unit, wherein the passive unit is adapted to be rotated by the movement of the hinge unit in only a portion of the whole rotation range of the hinge unit.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

Abstract: The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.

Abstract: The present invention discloses a method for detecting skin conditions, and the method includes the steps of: capturing a skin image from a suspected subject; decomposing the skin image into an RBX image through RBX color-space transformation; and determining skin condition of the subject according to a parameter of a color model of the RBX image.

Abstract: Apparatuses, methods, and systems for synchronizing nodes of a wireless network are disclosed. One method includes identifying synchronization paths between synchronization reference nodes of the wireless network and each non-reference node of the wireless network, wherein each synchronization path includes one or more wireless hops between the synchronization reference nodes and the non-reference node, determining a number of timing slots needed for supporting each of the identified synchronization paths, and selecting at least one of the synchronization paths between each non-reference node and at least one of the synchronization reference nodes based on a number of wireless hops of each of the identified synchronization paths and the determined number of timing slots needed to support each of the identified synchronization paths.

Abstract: An illustrative method includes obtaining a three-dimensional (3D) mesh of a subject, obtaining a mesh model, and generating a hybrid mesh of the subject. The generating includes replacing a portion of the 3D mesh with the mesh model such that the hybrid mesh includes a non-replaced portion of the 3D mesh represented at a first resolution and the mesh model representing the replaced portion of the 3D mesh at a second resolution.

Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.

Abstract: Systems and methods relate to encoded video streams including geometric-data streams transmitted to a receiver for rendering of a viewpoint-adaptive 3D persona. A method includes obtaining a three-dimensional (3D) mesh of a subject generated from depth-camera-captured information about the subject, obtaining a facial-mesh model, locating a facial portion of the obtained 3D mesh of the subject, computing a geometric transform based on the facial portion and the facial-mesh model, the geometric transform determined in response to one or more aggregated error differences between a plurality of feature points on the facial-mesh model and a plurality of corresponding feature points on the facial portion of the obtained 3D mesh, generating a transformed facial-mesh model using the geometric transform and generating a hybrid mesh of the subject at least in part by combining the transformed facial-mesh model and at least a portion of the obtained 3D mesh.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.