Abstract: An encoder including an emitter to emit a waveform to a scene including a structure. A receiver to receive the waveform reflected from the scene and to measure phases of the received waveform for a period of time. A memory to store a signal model relating phase measurements of the received waveform with phase parameters, and to store a state model relating the phase parameters with a state of the encoder. Wherein the signal model includes a motion-induced polynomial phase signal (PPS) component and a sinusoidal frequency modulated (FM) component. Wherein the PPS component is a polynomial function of the phase parameters, and wherein the FM component is a sinusoidal function of the phase parameters. A processor to determine the phase parameters using non-linear mapping of the phase measurements on the signal model and to determine the state of the encoder by submitting the phase parameters into the state model.

Abstract: An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A method for forming a semiconductor package structure includes stacking chips to form a chip stack over an interposer. The method also includes disposing a semiconductor die over the interposer. The method also includes filling a first encapsulating layer between the chips and surrounding the chip stack and the semiconductor die. The method also includes forming a second encapsulating layer covering the chip stack and the semiconductor die. The first encapsulating layer fills the gap between the chip stack and the semiconductor die.

Abstract: A technique includes receiving data acquired by an acoustic measurement tool in a well, where the data represents multiple acoustic modes, including a first order formation flexural acoustic mode and a higher order formation flexural acoustic mode. The technique includes processing the data to identify the higher order formation flexural acoustic mode; and determining a shear slowness based at least in part on slowness values that are associated with the identified higher order formation flexural acoustic mode.

Abstract: An encoder of a terahertz (THz)-based absolute positioning system used for decoding patterns from THz-band measurements. The encoder includes a scale with a multi-layer reflective/transmissive structure having a matrix with rows. Each row of the matrix corresponds to a plurality of patterns, such that each pattern is used to form a measurement. An emitter emits a THz waveform to the scale. A receiver is used to measure amplitudes of the THz waveform reflected from the scale. A memory stores data including predetermined positions of the emitter based on the patterns of the layers from the scale. Wherein one or more processors can determine a position of the emitter from the measurements of the amplitudes received by the receiver, based on the stored data. An output interface can be used to render the position of the emitter.

Abstract: The present application discloses an instance-based distributed data recovery method. A specific implementation of the method includes: detecting a non-master down node; allocating multiple secondary storage units corresponding to the down node to at least one online node; performing hash grouping on instances stored on logs and allocating the instances to multiple threads; and recovering data of multiple primary storage units in parallel inside the online node. Embodiments of the present invention recover data of a down node in a distributed database in parallel in nodes.

Abstract: The invention is to provide a hydrogen sulfide sustained releasing dressing and a manufacturing method thereof. The hydrogen sulfide sustained releasing dressing includes a hydrocolloid, a surfactant and sodium hydro sulfide. The manufacturing method includes (a) heating and stirring a hydrocolloid material; (b) adding a surfactant and sodium hydrosulfide into the hydrocolloid material; and (c) injecting the hydrocolloid material containing the surfactant and the sodium hydrosulfide into a mold for thermoforming a hydrogen sulfide sustained releasing dressing.

Abstract: An anti-resonant hollow core optical fiber having multiple resonant layers. The optical fiber comprises a low-refractive index core region (1) and a high-refractive index cladding region. The high-refractive index cladding region comprises an inner cladding region (4) and an outer cladding region (5). The outer cladding region (5) clads the inner cladding region (4) and the core region (1). The inner cladding region (4) comprises a first anti-resonant layer (2) and a second anti-resonant layer (3), and the first anti-resonant layer (2) and the second anti-resonant layer (3) surround the core region (1); and the first anti-resonant layer (2) comprises several layers of microcapillary tubes, and the second anti-resonant layer (3) supports the first anti-resonant layer (2). The optical fiber adopts a double-cladding structure and uses two or more anti-resonant layers such that theoretically simulated loss is reduced to 0.

Abstract: Devices, systems and methods for a brain-computer interface (BCI) system for correlating brain activity of a user to a predetermined physiological response, a predetermined classification of a user intention or a predetermined mental state to control, for actuating a control action. The BCI system including an input interface to receive brain signals indicative of an activity of a brain of the user. An encoder to encode the received brain signals to produce a sparse connectivity map of correlations among active regions of the brain. Wherein the sparse connectivity map specifies more zero correlations than non-zero correlations between various active regions of the brain. A classifier to classify the sparse connectivity map as an intended predetermined physiological response intended by the user. A controller to communicate a control signal for actuating the control action according to the intended predetermined physiological response to a device.

Abstract: Various embodiment(s) of a digital device and a method for controlling the same are disclosed in this specification. Herein, the method for controlling a digital device according to an exemplary embodiment of the present invention may include f receiving a signal requesting for outputting a recommended content page, receiving recommended content page data of a most recently update version from a cloud server, and displaying the recommended content page received from the cloud server, wherein the recommended content page may include a first window including broadcast content information and a second window including VOD content information, and wherein the first window and the second window may include thumbnail images of each content.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: A method and apparatus for storing time series data are disclosed. A method may include: saving an index value of time series data to a time interval data table according to a time point of the time series data, wherein the time series data includes: a time point and an index value associated with the time point, and each data row in the time interval data table records index values associated with at least one time point within a time interval of a predetermined length; performing data compression processing on a storage area having no written data, to obtain compressed time interval data; and writing the compressed time interval data to a magnetic disk.

Abstract: A semiconductor package includes a first package component include a first side, a second side opposite to the first side, and a plurality of recessed corners over the first side. The semiconductor package further includes a plurality of first stress buffer structures disposed at the recessed corners, and each of the first stress buffer structures has a curved surface. The semiconductor package further includes a second package component connected to the first package component and a plurality of connectors disposed between the first package component and the second package component. The connectors are electrically coupled the first package component and the second package component. The semiconductor package further includes an underfill material between the first package component and the second package component, and at least a portion of the curved surface of the first stress buffer structures is in contact with and embedded in the underfill material.

Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.

Abstract: A receiver for use in a wireless communication system to receive signals transmitted over a wireless channel. The receiver includes a plurality of radio-frequency (RF) chains coupled a plurality of antennas. Each RF chain has at least one-bit analog-to-digital converter (ADC) to convert each measurement of an analog signal received by the antenna into at least one bit of information representing a result of a comparison of the measurement with a randomly selected threshold to produce a sequence of bits and a corresponding sequence of thresholds. Each bit in the sequence of bits represents a relative value of the measurement of the analog signal with respect to a threshold from the corresponding sequence of thresholds. A processor coupled to the plurality of RF chains estimates parameters of the wireless channel using the sequences of bits and the corresponding sequences of thresholds received from the plurality of RF chains.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.

Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.