Patents by Inventor Pu Wang

Pu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10809400
    Abstract: A technique includes receiving data acquired by an acoustic measurement tool in a well, where the data represents multiple acoustic modes, including a first order formation flexural acoustic mode and a higher order formation flexural acoustic mode. The technique includes processing the data to identify the higher order formation flexural acoustic mode; and determining a shear slowness based at least in part on slowness values that are associated with the identified higher order formation flexural acoustic mode.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: October 20, 2020
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Pu Wang, Sandip Bose, Bikash Sinha
  • Patent number: 10795151
    Abstract: An encoder of a terahertz (THz)-based absolute positioning system used for decoding patterns from THz-band measurements. The encoder includes a scale with a multi-layer reflective/transmissive structure having a matrix with rows. Each row of the matrix corresponds to a plurality of patterns, such that each pattern is used to form a measurement. An emitter emits a THz waveform to the scale. A receiver is used to measure amplitudes of the THz waveform reflected from the scale. A memory stores data including predetermined positions of the emitter based on the patterns of the layers from the scale. Wherein one or more processors can determine a position of the emitter from the measurements of the amplitudes received by the receiver, based on the stored data. An output interface can be used to render the position of the emitter.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: October 6, 2020
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Haoyu Fu, Philip Orlik, Toshiaki Koike-Akino, Rui Ma, Bingnan Wang
  • Patent number: 10783163
    Abstract: The present application discloses an instance-based distributed data recovery method. A specific implementation of the method includes: detecting a non-master down node; allocating multiple secondary storage units corresponding to the down node to at least one online node; performing hash grouping on instances stored on logs and allocating the instances to multiple threads; and recovering data of multiple primary storage units in parallel inside the online node. Embodiments of the present invention recover data of a down node in a distributed database in parallel in nodes.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: September 22, 2020
    Assignee: Beijing Baidu Netcom Science and Technology Co., Ltd.
    Inventors: Chunbo Lai, Yingfei Xue, Pu Wang, Bo Zhao
  • Publication number: 20200241200
    Abstract: An anti-resonant hollow core optical fiber having multiple resonant layers. The optical fiber comprises a low-refractive index core region (1) and a high-refractive index cladding region. The high-refractive index cladding region comprises an inner cladding region (4) and an outer cladding region (5). The outer cladding region (5) clads the inner cladding region (4) and the core region (1). The inner cladding region (4) comprises a first anti-resonant layer (2) and a second anti-resonant layer (3), and the first anti-resonant layer (2) and the second anti-resonant layer (3) surround the core region (1); and the first anti-resonant layer (2) comprises several layers of microcapillary tubes, and the second anti-resonant layer (3) supports the first anti-resonant layer (2). The optical fiber adopts a double-cladding structure and uses two or more anti-resonant layers such that theoretically simulated loss is reduced to 0.
    Type: Application
    Filed: March 27, 2018
    Publication date: July 30, 2020
    Inventors: Pu Wang, Shoufei Gao, Yingying Wang
  • Publication number: 20200237811
    Abstract: The invention is to provide a hydrogen sulfide sustained releasing dressing and a manufacturing method thereof. The hydrogen sulfide sustained releasing dressing includes a hydrocolloid, a surfactant and sodium hydro sulfide. The manufacturing method includes (a) heating and stirring a hydrocolloid material; (b) adding a surfactant and sodium hydrosulfide into the hydrocolloid material; and (c) injecting the hydrocolloid material containing the surfactant and the sodium hydrosulfide into a mold for thermoforming a hydrogen sulfide sustained releasing dressing.
    Type: Application
    Filed: December 5, 2019
    Publication date: July 30, 2020
    Inventors: Lie-Sian YAP, Chih-Yuan CHAO, Yu-Pu WANG
  • Publication number: 20200229730
    Abstract: Devices, systems and methods for a brain-computer interface (BCI) system for correlating brain activity of a user to a predetermined physiological response, a predetermined classification of a user intention or a predetermined mental state to control, for actuating a control action. The BCI system including an input interface to receive brain signals indicative of an activity of a brain of the user. An encoder to encode the received brain signals to produce a sparse connectivity map of correlations among active regions of the brain. Wherein the sparse connectivity map specifies more zero correlations than non-zero correlations between various active regions of the brain. A classifier to classify the sparse connectivity map as an intended predetermined physiological response intended by the user. A controller to communicate a control signal for actuating the control action according to the intended predetermined physiological response to a device.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 23, 2020
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Toshiaki Koike-Akino, Ye Wang
  • Patent number: 10681419
    Abstract: Various embodiment(s) of a digital device and a method for controlling the same are disclosed in this specification. Herein, the method for controlling a digital device according to an exemplary embodiment of the present invention may include f receiving a signal requesting for outputting a recommended content page, receiving recommended content page data of a most recently update version from a cloud server, and displaying the recommended content page received from the cloud server, wherein the recommended content page may include a first window including broadcast content information and a second window including VOD content information, and wherein the first window and the second window may include thumbnail images of each content.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: June 9, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Daegu Kim, Alan Thomas Shen, David Kempe, Itai Vonshak, Molly Davis, Liron Damir, Danielle Zimmerman, Herbert Han-pu Wang, Brian Behnke
  • Publication number: 20200152610
    Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: JING-CHENG LIN, YING-CHING SHIH, PU WANG, CHEN-HUA YU
  • Patent number: 10606806
    Abstract: A method and apparatus for storing time series data are disclosed. A method may include: saving an index value of time series data to a time interval data table according to a time point of the time series data, wherein the time series data includes: a time point and an index value associated with the time point, and each data row in the time interval data table records index values associated with at least one time point within a time interval of a predetermined length; performing data compression processing on a storage area having no written data, to obtain compressed time interval data; and writing the compressed time interval data to a magnetic disk.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: March 31, 2020
    Inventors: Yingfei Xue, Chunbo Lai, Pu Wang, Bo Zhao, Feng Zheng
  • Publication number: 20200091131
    Abstract: A semiconductor package includes a first package component include a first side, a second side opposite to the first side, and a plurality of recessed corners over the first side. The semiconductor package further includes a plurality of first stress buffer structures disposed at the recessed corners, and each of the first stress buffer structures has a curved surface. The semiconductor package further includes a second package component connected to the first package component and a plurality of connectors disposed between the first package component and the second package component. The connectors are electrically coupled the first package component and the second package component. The semiconductor package further includes an underfill material between the first package component and the second package component, and at least a portion of the curved surface of the first stress buffer structures is in contact with and embedded in the underfill material.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Inventors: HSIEN-JU TSOU, CHIH-WEI WU, PU WANG, YING-CHING SHIH, SZU-WEI LU, JING-CHENG LIN
  • Patent number: 10586763
    Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: March 10, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10541839
    Abstract: A receiver for use in a wireless communication system to receive signals transmitted over a wireless channel. The receiver includes a plurality of radio-frequency (RF) chains coupled a plurality of antennas. Each RF chain has at least one-bit analog-to-digital converter (ADC) to convert each measurement of an analog signal received by the antenna into at least one bit of information representing a result of a comparison of the measurement with a randomly selected threshold to produce a sequence of bits and a corresponding sequence of thresholds. Each bit in the sequence of bits represents a relative value of the measurement of the analog signal with respect to a threshold from the corresponding sequence of thresholds. A processor coupled to the plurality of RF chains estimates parameters of the wireless channel using the sequences of bits and the corresponding sequences of thresholds received from the plurality of RF chains.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Milutin Pajovic, Philip Orlik, Petros Boufounos
  • Patent number: 10535639
    Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jing-Cheng Lin, Ying-Ching Shih, Pu Wang, Chen-Hua Yu
  • Patent number: 10529690
    Abstract: An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: January 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu
  • Publication number: 20200006225
    Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10510732
    Abstract: Provided are a PoP device and a method of manufacturing the same. The PoP device includes a first package structure and a second package structure. The first package structure includes a die, a through integrated fan-out via (TIV), an encapsulant, and a film. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The film is over the TIV and the encapsulant, and aside the die. The second package structure is connected to the first package structure through a connector. The connector penetrates through the film to electrically connected to the TIV.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10497690
    Abstract: A semiconductor package includes a first package component include a first side, a second side opposite to the first side, and a plurality of recessed corners over the first side. The semiconductor package further includes a plurality of first stress buffer structures disposed at the recessed corners, and each of the first stress buffer structures has a curved surface. The semiconductor package further includes a second package component connected to the first package component and a plurality of connectors disposed between the first package component and the second package component. The connectors are electrically coupled the first package component and the second package component. The semiconductor package further includes an underfill material between the first package component and the second package component, and at least a portion of the curved surface of the first stress buffer structures is in contact with and embedded in the underfill material.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: December 3, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin
  • Publication number: 20190360937
    Abstract: A microsecond-scale stimulated Raman spectroscopic imaging system having a light source, such as a laser output that provides two femtosecond laser beams and a modulator to modulate the laser intensity at frequency between about 1 and about 100 megahertz. The system can further include a medium that chirps the two femtosecond beams to generate a spectral focus in a specimen, and a galvo mirror or resonant mirror pair to scan the two femtosecond beams in two dimension on the specimen. An objective lens can focus the two laser beams into a specimen or sample and a resonant delay scanner configured to produce an optical delay to the pair of chirped beams in said specimen and a tuned amplifier or lock-in amplifier can be used to extract the stimulated Raman-signal shift at the aforementioned modulation frequency.
    Type: Application
    Filed: December 14, 2017
    Publication date: November 28, 2019
    Inventors: Chien-Sheng Liao, Pu WANG, Ji-Xin CHENG
  • Patent number: 10474968
    Abstract: Systems and methods are provided for performing data mining and statistical learning techniques on a big data set. More specifically, systems and methods are provided for linear regression using safe screening techniques. Techniques may include receiving a plurality of time series included in a prediction hierarchy for performing statistical learning to develop an improved prediction hierarchy. It may include pre-processing data associated with each of the plurality of time series, wherein the pre-processing includes tasks performed in parallel using a grid-enabled computing environment. For each time series, the system may determine a classification for the individual time series, a pattern group for the individual time series, and a level of the prediction hierarchy at which the each individual time series comprises an need output amount greater than a threshold amount.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: November 12, 2019
    Assignee: SAS INSTITUTE INC.
    Inventors: Yung-Hsin Chien, Pu Wang, Yue Li
  • Publication number: 20190339359
    Abstract: A frequency modulation continuous wave (FMCW)-based system includes an emitter to transmit at least one linearly modulated wave of radiation to a scene and a receiver to receive a reflection of the transmitted wave from one or multiple objects located at different locations in the scene. The system interferes a copy of the wave outputted by the emitter with the reflection of the transmitted wave received by the receiver to produce a beat signal with spectrum peaks corresponding to reflections from the different locations at the scene. The beat signal is distorted due to the non-linearity of the modulation.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 7, 2019
    Inventors: Pu Wang, David Millar, Chungwei Lin, Kieran Parsons, Philip Orlik