Abstract: A system for railway applications using beamforming transmission in a millimeter wave spectrum between antennas of a Communications Based Train Control (CBTC) system and devices in an environment. Performing a beam training with a target device of the devices located in the environment to measure beam signal values and environmental responses for different beams transmitted over the different beam angles using control circuitry connected with the antennas. Control circuitry selects, in response to the beam training, at least one dominant angle for a beamforming communication with the target device. Access stored fingerprinting data that includes values indicative of link attributes associated with beam signal measurements with states of devices and states of environments. Estimating from the mapping stored fingerprinting data, a state of the target device and/or a state of the environment, corresponding to environmental responses for different beams estimated during the beam training.

Abstract: A system for keyless entry applications using beamforming transmission in a millimeter wave spectrum in an environment. A memory with data including values indicative of link attributes associated with beam signal measurements with states of devices and states of environments. The states of the devices for each device including types of user behavior, locations and poses in each environment. Control circuitry performs beam training with a target device associated with at least one keyless entry application in the environment to measure beam signal values and environmental responses for different beams transmitted over the different beam angles. Selects, in response to the beam training, at least one dominant angle for a beamforming communication with the target device. Estimates, a state of the target device associated with the at least one keyless entry application or a state of the environment, corresponding to environmental responses for different beams estimated during the beam training.

Abstract: An anti-resonant hollow core optical fiber having multiple resonant layers. The optical fiber comprises a low-refractive index core region (1) and a high-refractive index cladding region. The high-refractive index cladding region comprises an inner cladding region (4) and an outer cladding region (5). The outer cladding region (5) clads the inner cladding region (4) and the core region (1). The inner cladding region (4) comprises a first anti-resonant layer (2) and a second anti-resonant layer (3), and the first anti-resonant layer (2) and the second anti-resonant layer (3) surround the core region (1); and the first anti-resonant layer (2) comprises several layers of microcapillary tubes, and the second anti-resonant layer (3) supports the first anti-resonant layer (2). The optical fiber adopts a double-cladding structure and uses two or more anti-resonant layers such that theoretically simulated loss is reduced to 0.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A digital television includes a memory storing one or more applications; an interface to receive control signals; a display; and a controller to display an application execution screen of an application among the one or more applications, in response to receiving, via the interface, a first control signal, display a first menu including one or more icons related to the first control signal, in response to receiving, via the interface, a second control signal selecting an adding menu icon in the first menu, and receiving a third control signal selecting an icon included in the one or more icons in the first menu, display the selected icon and a left direction key and a right direction key around the selected icon with a second menu, and in response to receiving, via the interface, a fourth control signal, add the selected icon to the second menu.

Abstract: A frequency modulation continuous wave (FMCW)-based system includes an emitter to transmit at least one linearly modulated wave of radiation to a scene and a receiver to receive a reflection of the transmitted wave from one or multiple objects located at different locations in the scene. The system interferes a copy of the wave outputted by the emitter with the reflection of the transmitted wave received by the receiver to produce a beat signal with spectrum peaks corresponding to reflections from the different locations at the scene. The beat signal is distorted due to the non-linearity of the modulation.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a semiconductor package, a thermal conductive gel, a thermal conductive film, and a heat spreader. The semiconductor package has an uneven top surface. The thermal conductive gel covers the uneven top surface of the semiconductor package. The thermal conductive film is over the uneven top surface of the semiconductor package. A thermal conductivity of the thermal conductive film is higher than a thermal conductivity of the thermal conductive gel. The heat spreader is disposed over the thermal conductive film.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: A scanner for image reconstruction of a structure of a target object uses a neural network trained to classify each segment of a sequence of segments of a modified wave into one or multiple classes. The sequence of segments corresponds to the sequence of layers of the target object, such that a segment of modified wave corresponds to a layer having the same index in the sequence of layers as an index of the segment in the sequence of segments. The scanner executes the neural network for each wave modified by penetration through the layers of the target object to produce the classes of segments of the modified waves. Next, the scanner selects the classes of segments of different modified waves corresponding to the same layer to produce an image of the layer of the target object with pixel values being functions of labels of the selected classes.

Abstract: A digital television includes a memory storing one or more applications; an interface to receive control signals; a display; and a controller to display an application execution screen of an application among the one or more applications, in response to receiving, via the interface, a first control signal, display a first menu including one or more icons related to the first control signal, in response to receiving, via the interface, a second control signal selecting an adding menu icon in the first menu, and receiving a third control signal selecting an icon included in the one or more icons in the first menu, display the selected icon and a left direction key and a right direction key around the selected icon with a second menu, and in response to receiving, via the interface, a fourth control signal, add the selected icon to the second menu.

Abstract: A microsecond-scale stimulated Raman spectroscopic imaging system having a light source, such as a laser output that provides two femtosecond laser beams and a modulator to modulate the laser intensity at frequency between about 1 and about 100 megahertz. The system can further include a medium that chirps the two femtosecond beams to generate a spectral focus in a specimen, and a galvo mirror or resonant mirror pair to scan the two femtosecond beams in two dimension on the specimen. An objective lens can focus the two laser beams into a specimen or sample and a resonant delay scanner configured to produce an optical delay to the pair of chirped beams in said specimen and a tuned amplifier or lock-in amplifier can be used to extract the stimulated Raman-signal shift at the aforementioned modulation frequency.

Abstract: A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.

Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for image reconstruction. Actions include receiving an image acquired by an endoscopic system including an optical fiber bundle with multiple optical fibers, each optical fiber being surrounded by cladding, determining in the image fiber core locations corresponding to the optical fibers, reconstructing missing information from the image using interpolation performed in accordance with the fiber core locations, the missing information corresponding to artifacts in the acquired image that result from the cladding, and providing a fiber-pattern removed image, in which the artifacts in the acquired image are removed using the missing information.

Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for image reconstruction. Actions include receiving an image acquired by an endoscopic system including an optical fiber bundle with multiple optical fibers, each optical fiber being surrounded by cladding, determining in the image fiber core locations corresponding to the optical fibers, reconstructing missing information from the image using interpolation performed in accordance with the fiber core locations, the missing information corresponding to artifacts in the acquired image that result from the cladding, and providing a fiber-pattern removed image, in which the artifacts in the acquired image are removed using the missing information.

Abstract: An encoder including an emitter to emit a waveform to a scene including a structure. A receiver to receive the waveform reflected from the scene and to measure phases of the received waveform for a period of time. A memory to store a signal model relating phase measurements of the received waveform with phase parameters, and to store a state model relating the phase parameters with a state of the encoder. Wherein the signal model includes a motion-induced polynomial phase signal (PPS) component and a sinusoidal frequency modulated (FM) component. Wherein the PPS component is a polynomial function of the phase parameters, and wherein the FM component is a sinusoidal function of the phase parameters. A processor to determine the phase parameters using non-linear mapping of the phase measurements on the signal model and to determine the state of the encoder by submitting the phase parameters into the state model.

Abstract: An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A method for forming a semiconductor package structure includes stacking chips to form a chip stack over an interposer. The method also includes disposing a semiconductor die over the interposer. The method also includes filling a first encapsulating layer between the chips and surrounding the chip stack and the semiconductor die. The method also includes forming a second encapsulating layer covering the chip stack and the semiconductor die. The first encapsulating layer fills the gap between the chip stack and the semiconductor die.

Abstract: A technique includes receiving data acquired by an acoustic measurement tool in a well, where the data represents multiple acoustic modes, including a first order formation flexural acoustic mode and a higher order formation flexural acoustic mode. The technique includes processing the data to identify the higher order formation flexural acoustic mode; and determining a shear slowness based at least in part on slowness values that are associated with the identified higher order formation flexural acoustic mode.