Abstract: The microcatheter may include an elongated shaft having a distal end and a proximal end. The elongated shaft may include an outer layer which may be formed from a polymer, a middle layer which may be formed of a braid having a plurality of strands having four filaments each, wherein the four filaments may be a round metal with an outer diameter of less than 0.0009”. The braid may achieve at least a 70% surface area coverage. The elongated shaft may include an inner layer which may be formed from a polymer, and a distal polymeric tip which may be attached to the distal end of the elongated shaft.

Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.

Abstract: A system may include a memory and a processor in communication with the memory. The processor may be configured to perform operations. The operations may include extracting a first multiple dimensional dataset and a second multiple dimensional dataset and encoding the first multiple dimensional dataset into a first encoded dataset and the second multiple dimensional dataset into a second encoded dataset. The operations may include combining the first encoded dataset and the second encoded dataset into a combined encoded dataset and conveying the combined encoded dataset to a user.

Abstract: A method of monitoring status information of devices is described. The method includes establishing a first connection to a hardware resource executing a cloud extension agent on a local network, over a wide area network external from the local network and separated by at least one firewall, using a standard internet protocol. The method further includes sending, via the first connection, a first set of instructions to manage a first set of mobile devices by one or more local servers on the local network; and receiving status information via the secure network connection, wherein the status information is from the one or more local servers on the local network associated with a plurality of devices that access the one or more local servers.

Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services. The cloud extension agent can reach the cloud based services through existing firewall infrastructure, thereby providing simple, secure deployment. Furthermore, the secure connection can enable substantially real-time communication with a cloud service to provide web-based, substantially real time control or management of resources on the customer premises via the cloud extension agent.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for assessing multiple versions of a data model in a pre-deployment environment to ensure that any subsequently deployed version will perform than a current version of the data model. In aspects, the tool extracts observed and predictive data for various versions and comparatively evaluates the performance measures of each version. The performance measures can be validated across the versions to determine and select a leading version that has demonstrated improve technological performance and predictive accuracy. The leading version can be deployed.

Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for aggregating computationally generated performance reports a machine-learning data model pipeline for technological performance and/or predictive accuracy. The tool may acquire multiple performance measure reports that that quantitatively asses the performance of a model pipeline based on a configuration file that facilitates validation of the technological performance and predictive accuracy of the model. Additionally, when the conditions defined by the configuration file are met for of the performance measure reports the tool may broadcast a notification to a predetermined system.

Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for assessing sub-models of a data model pipeline in a deployed or pre-deployment environment. The tool may compute a plurality of performance measures that quantitatively asses the performance of each sub-model in the data model pipeline based on a configuration file that facilitates validation of the technological performance and predictive accuracy of the sub-model. Additionally, multiple versions of a sub-model deployed in similar data model pipelines, or in a pre-deployment environment, may be comparatively evaluated. A leading version of the sub-model may be identified and deployed.

Abstract: A method, system, and computer program product for simulating potential consequences and possible solutions due to a release of stored energy using augmented reality. The method may include aggregating IoT feeds from devices in a surrounding area. The method may also include calculating amounts of stored energy in the surrounding area based on the IoT feeds. The method may also include predicting contextual situations that could result due to a release of the stored energy in the surrounding area. The method may also include determining one or more consequences for each of the contextual situations. The method may also include calculating a degree of severity of the one or more consequences for each contextual situation. The method may also include determining one or more proposed solutions based on the degree of severity. The method may also include transmitting a recommendation of at least one proposed solution for implementation.

Abstract: Example methods and systems are provided a network device to perform tunnel-based service insertion in a public cloud environment. An example method may comprise establishing a tunnel between the network device and a service path. The method may also comprise: in response to receiving a first encapsulated packet, identifying the service path specified by a service insertion rule; generating and sending a second encapsulated packet over the tunnel to cause the service path to process an inner packet according to one or more services. The method may further comprise: in response to receiving, from the service path via the tunnel, a third encapsulated packet that includes the inner packet processed by the service path, sending the inner packet processed by the service path, or a fourth encapsulated packet, towards a destination address of the inner packet.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.

Abstract: A tamper resistant plug that has particular application for sealing a fill port in a hermetically sealed and gas-insulated tank associated with medium-voltage switchgear. The plug includes a body portion and a top annular rim defining a central recess and having an internal surface facing the recess, where the internal surface has a polygon shape with only rounded edges. In one embodiment, the polygon shape is a trilobe.

Abstract: Example methods are provided a network device to perform service insertion in a public cloud environment that includes a first virtual network and a second virtual network. In one example method, in response to receiving a first encapsulated packet from a first virtualized computing instance located in the first virtual network, the network device may generate a decapsulated packet by performing decapsulation to remove, from the first encapsulated packet. The method may also comprise identifying a service path specified by a service insertion rule, and sending the decapsulated packet to the service path to cause the service path to process the decapsulated packet according to one or more services. The method may further comprise: in response to the network device receiving the decapsulated packet processed by the service path, sending the decapsulated packet, or generating and sending a second encapsulated packet, towards a destination address.

Abstract: A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.