Patents by Inventor Rahul Jain

Rahul Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11196591
    Abstract: Some embodiments provide a centralized overlay-network cloud gateway and a set of centralized services in a transit virtual private cloud (VPC) connected to multiple other compute VPCs hosting compute nodes (VMs, containers, etc.) that are part of (belong to) the overlay network. The centralized overlay-network cloud gateway provides connectivity between compute nodes of the overlay network (e.g., a logical network spanning multiple VPCs) and compute nodes in external networks. Some embodiments use the centralized overlay-network cloud gateway to provide transitive routing (e.g., routing through a transit VPC) in the absence of direct peering between source and destination VPCs. The overlay network, of some embodiments, uses the same subnetting and default gateway address for each compute node as the cloud provider network provided by the virtual private cloud provider.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 7, 2021
    Assignee: VMWARE, INC.
    Inventors: Mukesh Hira, Su Wang, Rahul Jain, Ganesan Chandrashekhar, Sandeep Siroya
  • Patent number: 11177978
    Abstract: A system and method for connecting virtual computer networks in a public cloud computing environment using a transit virtual computer network uses a cloud gateway device in the transit virtual computer network that includes a first-tier logical router and a plurality of second-tier logical routers connected to the virtual computer networks. A source Internet Protocol (IP) address of outgoing data packets from a particular virtual computer network is translated at a particular second-tier logical router of the cloud gateway device from an IP address of the particular virtual computer network to an internal IP address from a particular pool of IP addresses. The outgoing data packets are then routed to the first-tier logical router of the cloud gateway device, where the outgoing data packets are transmitted a destination network from a particular interface of the first-tier logical router of the cloud gateway device.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: November 16, 2021
    Assignee: VMWARE, INC.
    Inventors: Rahul Jain, Mukesh Hira
  • Patent number: 11165639
    Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: November 2, 2021
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Patent number: 11165640
    Abstract: A software upgrade to be deployed by a cloud extension agent is received by a remote network management platform, the cloud extension agent running locally on a network and initiating an outbound connection to the remote network management platform through a firewall of the network. A command is generated for the software upgrade, the command comprising an identification of a source of the software upgrade. The command is provided to the cloud extension agent, wherein providing the command causes the cloud extension agent to acquire the software upgrade from the identified source and deploy the software upgrade.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 2, 2021
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Patent number: 11158558
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 26, 2021
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun K. Jen, Vipul V. Mehta, Ashish Dhall, Sri Chaitra J. Chavali, Rahul N. Manepalli, Amruthavalli P. Alur, Sai Vadlamani
  • Patent number: 11139264
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Ji Yong Park, Kyu Oh Lee
  • Publication number: 20210256443
    Abstract: A computerized method for implementing an optimal supply chain configuration includes the step of implementing an optimal supply chain configuration for a business. The method includes the step of modelling costs for minimization in an optimal supply chain configuration. The method includes the step of modelling constraints in an optimal supply chain configuration. The method includes the step of, based on the modelled cost for minimization and the modelled constraints, optimizing a supply chain for the business.
    Type: Application
    Filed: November 19, 2020
    Publication date: August 19, 2021
    Inventors: SHASHANK SRIVASTAVA, RAHUL JAIN, GEET GARG, CHAITANYA SANGANI, KEVIN ABRAHAM
  • Publication number: 20210219380
    Abstract: Various aspects include methods for Transmission Control Protocol (TCP)/Internet Protocol (IP) (TCP/IP) packet transmission and compression of headers for TCP/IP packet transmission. Various embodiments may include a packet data convergence protocol (PDCP) layer of a processing device applying least significant bit (LSB) encoding to a TCP Timestamp (TS) option of a TCP/IP packet using an offset parameter of zero to generate a compressed header in response to determining that a TCP TS field of the TCP/IP packet and a TCP TS field of a last TCP/IP packet transmitted have a same value. In some embodiments, a Timestamp Value (TSVal) field or a Timestamp Echo Reply (TSEcho) field of the TCP TS option of the compressed header may have a size of one byte.
    Type: Application
    Filed: January 9, 2020
    Publication date: July 15, 2021
    Inventors: Rahul JAIN, Deepak SAH, Ganesh Babu KAMMA
  • Patent number: 11062294
    Abstract: An example operation may include one or more of identifying, via a cognitive system, that a change in a creditworthiness attribute of a cardholder has occurred with respect to a previous creditworthiness of the cardholder, in response to identifying the change in the creditworthiness attribute of the cardholder, dynamically determining a custom interchange value for the cardholder to be used in payment transactions based on a current credit data of the cardholder, transmitting the dynamically determined custom interchange value for the cardholder to one or more blockchain peer nodes, and storing the dynamically determined custom interchange value in a hash-linked chain of blocks via a distributed ledger.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: July 13, 2021
    Assignee: International Business Machines Corporation
    Inventor: Rahul Jain
  • Publication number: 20210209682
    Abstract: A computer-implemented method implemented by an AI onboarding system for performing trading partner onboarding. The method performs artificial intelligence (AI) training to learn onboarding information requirements. The method submits a transaction proposal to a blockchain business network (BBN) for obtaining a new business trading partner that requires trading partner onboarding. The method sends a business trading partner survey to the new business trading partner. The method monitors for queries regarding the business trading partner survey from the new business trading partner. The method provides responses to the queries based on the AI training. The method verifies using the AI training that the business trading partner survey is completed correctly by the new business trading partner.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 8, 2021
    Inventors: Rahul Jain, Manjit Singh Sodhi
  • Publication number: 20210194807
    Abstract: Example methods and systems are provided a network device to perform tunnel-based service insertion in a public cloud environment. An example method may comprise establishing a tunnel between the network device and a service path. The method may also comprise: in response to receiving a first encapsulated packet, identifying the service path specified by a service insertion rule; generating and sending a second encapsulated packet over the tunnel to cause the service path to process an inner packet according to one or more services. The method may further comprise: in response to receiving, from the service path via the tunnel, a third encapsulated packet that includes the inner packet processed by the service path, sending the inner packet processed by the service path, or a fourth encapsulated packet, towards a destination address of the inner packet.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 24, 2021
    Inventors: Rahul Jain, Kantesh Mundaragi, Pierluigi Rolando, Jayant Jain, Mukesh Hira
  • Patent number: 11032162
    Abstract: Example methods and computer systems are provided for east-west service insertion in a public cloud environment. An example method may comprise detecting an egress packet that is destined for a second endpoint located in the same virtual network as a first endpoint. The method may also comprise: in response to determination that service insertion is required, identifying a service path based on a service insertion rule; generating an encapsulated packet by encapsulating the egress packet with an outer header that is addressed from the first endpoint to a network device; and sending the encapsulated packet to cause the network device to send the egress packet towards the service path, thereby steering the egress packet towards the service path for processing.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: June 8, 2021
    Assignee: VMWARE, INC.
    Inventors: Rahul Jain, Mukesh Hira, Su Wang
  • Patent number: 11023733
    Abstract: A system for analyzing a video file in a shortened time frame, said system comprising: a receiver (VFR) to receive a video file (VF) as an input; a Time Splitter (TR) to split the received video file according to set intervals of time depending on how fast said video is to be analyzed; a Frame splitter (FP) to split a Video Viewing Program (R) into a plurality of frames (F1, F2, . . . Fn); a Key Frame Identification mechanism (KFI) to identify key frames; and linking mechanism (LM) to cause a link to be formed with pre-populated databases and in-house libraries of images (D), of frames, which frames comprising associated tags, thereby determining a score of similar tags per video file in order to determine said genre, thereby determining multiplicity of instances for said time splitter.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: June 1, 2021
    Assignee: Flickstree Productions Pvt Ltd
    Inventors: Nagender Sangra, Saurabh Singh, Rahul Jain
  • Publication number: 20210151393
    Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Inventors: Brandon C Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally, Jeremy D Ecton
  • Patent number: 10999497
    Abstract: A system-on-chip (SoC) includes first and second processing circuits and a data exchange circuit such that the first processing circuit is configured to process image lines based on corresponding sets of processing attributes. The first processing circuit is further configured to continuously receive and process the image lines one after the other to generate corresponding output data, and the second processing circuit is configured to continuously receive by way of the data exchange circuit, the generated output data for processing the generated output data. The data exchange circuit is thus configured to control data flow between the first processing circuit and the second processing circuit such that the first processing circuit and the second processing circuit parallelly process corresponding data associated with same or different image lines.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: May 4, 2021
    Assignee: NXP USA, INC.
    Inventors: Chanpreet Singh, Stephan Matthias Herrmann, Gaurav Gupta, Rahul Jain
  • Publication number: 20210111088
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 29, 2016
    Publication date: April 15, 2021
    Applicant: INTEL CORPORATION
    Inventors: Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun K. Jen, Vipul V. Mehta, Ashish Dhall, Sri Chaitra J. Chavali, Rahul N. Manepalli, Amruthavalli P. Alur, Sai Vadlamani
  • Publication number: 20210102728
    Abstract: Aspects of the present disclosure include a damper control system having a casing configured to detachably couple from a conventional air register having a damper assembly movably controllable by a manual lever, a motor assembly mounted to the casing, an actuating linkage assembly movably attached to the motor assembly and configured to detachably couple with the manual lever that controls the damper assembly, wherein one or more dampers of the damper assembly are in a closed position when the actuating linkage assembly is in a first position and in an open position when the actuating linkage assembly is in a second position, a memory mounted within the casing, and one or more processors communicatively coupled with the memory and mounted within the casing, the one or more processors being configured to cause the motor assembly to drive the actuating linkage assembly between the first position and the second position.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 8, 2021
    Inventors: Eric Wayne PALMBOS, Vikas Ashok PATIL, Satyendra KUMAR, Rahul JAIN
  • Patent number: 10971492
    Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji Yong Park, Sai Vadlamani, Junnan Zhao
  • Publication number: 20210092489
    Abstract: According to an embodiment of the present disclosure, a method comprises playing, by the media player, a 360-degree video. The method further comprises recording, by the media player, one or more viewing angles corresponding to a user's viewing of the 360-degree video. Further, the method comprises detecting, by the media player, a video seek event to a seek point of the 360-degree video. The method further comprises playing, by the media player, the 360-degree video from the seek point according to a viewing angle determined based on at least one of (a) a recorded viewing angle and (b) a view mode.
    Type: Application
    Filed: November 26, 2018
    Publication date: March 25, 2021
    Inventors: Bhaskar DUTTA, Manoj VERMA, Rahul JAIN
  • Patent number: 10949907
    Abstract: Methods and systems for generating a list of products each matching a reference product are disclosed. A user query is first received, and multi-modal attribute data for the reference product are determined, with each data mode being a type of product characterization having a modality selected from a text data class, categorical data, a pre-compared engineered feature, audio, image, and video. Next, a first list of candidate products is determined based on a product match signature, and a second list of candidate products is generated from the first, wherein for at least one given candidate product, a deep learning multi-modal matching model is selected to determine whether a match is found. Lastly, the second list is filtered to remove outliers and to generate the list of matching products. Also disclosed are benefits of the new methods and systems, and alternative embodiments of the implementation.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 16, 2021
    Assignee: Price Technologies Inc.
    Inventors: Rahul Jain, Steven Douglas Moffitt