Patents by Inventor Rahul Manepalli

Rahul Manepalli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treatment for microelectronic device substrate
    Publication number: 20040121512
    Abstract: Embodiments of the methods of the present invention provide a Molded Matrix Array Package (MMAP) carrier substrate panel that prevents underfill adhesion in the inter-die areas. Surface treatments are provided via plasmas and/or patterned chemical depositions that reduce the surface free energy of the inter-die area to below the surface free energy of the underfill material. The surface treatments prevent the underfill material from wetting the carrier substrate panel and therefore encroachment upon the inter-die area. This provides a underfill material-free inter-die area allowing adhesion between the mold compound and carrier substrate.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Inventors: Rahul Manepalli, Terry Sterrett, Tian-an Chen, Vassoudevane Lebonheur
  • Anhydride polymers for use as curing agents in epoxy resin-based underfill material
    Publication number: 20040106770
    Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
    Type: Application
    Filed: July 8, 2003
    Publication date: June 3, 2004
    Inventors: Saikumar Jayaraman, Rahul Manepalli
  • Anhydride polymers for use as curing agents in epoxy resin-based underfill material
    Patent number: 6620512
    Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Intel Corporation
    Inventors: Saikumar Jayaraman, Rahul Manepalli
  • Anhydride polymers for use as curing agents in epoxy resin-based underfill material
    Publication number: 20030118835
    Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: Saikumar Jayaraman, Rahul Manepalli