Patents by Inventor Rajeev

Rajeev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240314673
    Abstract: According to an aspect there is provided a computer-implemented method of operating a register node (300; 705) in a communication network. The method comprises maintaining (801) a first list of identifiers of wireless devices (701) for which a notification has been requested when the wireless device (701) connects 5 to the communication network; receiving (803) a check request from a mobility management node (703) in the communication network, the check request comprising a first identifier of a wireless device (701) that is requesting access to the communication network; determining (805) if the first identifier is in the first list of identifiers; and, if the first identifier is in the first list of identifiers, sending (807) a notification to a client node (400; 708, 709) that is external to the communication network, the notification indicating that a wireless device 0 (701) having the first identifier is connecting to the communication network.
    Type: Application
    Filed: July 5, 2021
    Publication date: September 19, 2024
    Applicant: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Yatin RAJWADHA, Rajeev RANJAN PRASAD
  • Publication number: 20240307311
    Abstract: The instant invention relates to a printable material for 3D printing comprising a hydrolyzed and functionalized starch compound. It also relates to a process for 3D printing using the same. It also relates to products, in particular solid dosage forms, obtained thereof by 3D printing.
    Type: Application
    Filed: July 7, 2022
    Publication date: September 19, 2024
    Inventors: Yuan-Siang LUI, Keat-Theng CHOW, Rajeev GOKHALE, Olaf HAEUSLER
  • Publication number: 20240314549
    Abstract: This application describes techniques for dynamic feature-dependent electronic subscriber identity module (eSIM) profile provisioning for wireless devices, including provisioning of device-compatible eSIM profiles and mitigation of provisioned device-incompatible eSIM profiles. A wireless device can provide information regarding additional device capabilities indicating support (or lack thereof) for optional cellular wireless standard features to a provisioning server, which can select an eSIM profile matched to the wireless device. In some cases, a wireless device detects an error condition resulting from enabling a device-incompatible eSIM profile on an embedded universal circuit card (eUICC) of the wireless device, disables the errant eSIM profile, and notifies a provisioning server regarding the error condition. The provisioning server can account for the device compatibility when providing additional eSIM profiles to the wireless device.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 19, 2024
    Inventors: Stanley M. MAYALIL, Rajeev VERMA, Hyewon LEE
  • Publication number: 20240310589
    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
    Type: Application
    Filed: May 27, 2024
    Publication date: September 19, 2024
    Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
  • Publication number: 20240308071
    Abstract: A robot assembly for safe operation in a manufacturing setting with humans including a sensor for detecting movement of the robot assembly and a human location. A positional apparatus including at least one tag located on the robot apparatus and at least one detector for detecting the tag. Posture nodes associated with a human saved in memory. A method that includes, generating a task movement plan based on images captured by the sensors, tags detected by the detector, and posture nodes of a nearby human captured by the sensor.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 19, 2024
    Inventors: Zixu ZHANG, Rajeev VERMA, Alexander ZAK
  • Publication number: 20240314662
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a first node, a quality of experience (QoE) configuration. The UE may receive, from the first node, a message indicating a handover to a second node that does not support the QoE configuration. The UE may perform, after completion of the handover to the second node. QoE measurements in accordance with the QoE configuration. Numerous other aspects are described.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 19, 2024
    Inventors: Shankar KRISHNAN, Jianhua LIU, Xipeng ZHU, Rajeev KUMAR
  • Publication number: 20240309387
    Abstract: The invention relates to RNAi agents, e.g., double-stranded RNAi agents, targeting the TMPRSS6 gene, and methods of using such RNAi agents to inhibit expression of TMPRSS6 and methods of treating subjects having a TMPRSS6 associated disorder, e.g., an iron overload associated disorder, such as ?-thalassemia or hemochromatosis.
    Type: Application
    Filed: October 3, 2023
    Publication date: September 19, 2024
    Inventors: James Butler, Brian Bettencourt, Kallanthottathil G. Rajeev, Martin A. Maier, Klaus Charisse
  • Publication number: 20240309073
    Abstract: The invention describes an efficient platform for antibody manufacturing and formulation that provides i) cell culture process with improved feeding strategy resulting in high antibody titer between 2 gm/L to 5 gm/L; ii) improved purification process showing optimal percentage recovery, high purity monomer content, minimum aggregation/particulate formation, minimum impurity levels; and iii) high concentration stable liquid formulation with optimal osmolality and low viscosity across different temperature excursions and devoid of aggregation. The preferred antibodies include IgG1 monoclonal antibody specific to the Dengue virus epitope in domain III of the E protein and IgG1 monoclonal antibody specific to the rabies virus surface G glycoprotein.
    Type: Application
    Filed: April 24, 2024
    Publication date: September 19, 2024
    Inventors: Rajeev Mhalasakant DHERE, Sambhaji Shankar PISAL, Srinivas Reddy PEDDIREDDY, Digamber Singh CHAHAR, Lenna Ravinda YEOLEKAR, Pankaj Singh CHOUHANA, Nikhil Dattatray AVALASKAR, Adar Cyrus POONAWALA, Cyrus Soli POONAWALLA
  • Publication number: 20240311006
    Abstract: A ferroelectric memory chiplet in a multi-dimensional packaging. The multi-dimensional packaging includes a first die comprising a switch and a first plurality of input-output transceivers. The multi-dimensional packaging includes a second die comprising a processor, wherein the second die includes a second plurality of input-output transceivers coupled to the first plurality of input-output transceivers. The multi-dimensional packaging includes a third die comprising a coherent cache or memory-side buffer, wherein the coherent cache or memory-side buffer comprises ferroelectric memory cells, wherein the coherent cache or memory-side buffer is coupled to the second die via I/Os. The dies are wafer-to-wafer bonded or coupled via micro-bumps, copper-to-copper hybrid bond, or wire bond, Flip-chip ball grid array routing, chip-on-wafer substrate, or embedded multi-die interconnect bridge.
    Type: Application
    Filed: April 13, 2021
    Publication date: September 19, 2024
    Applicant: Kepler Computing Inc.
    Inventors: Amrita Mathuriya, Christopher B. Wilkerson, Rajeev Kumar Dokania, Debo Olaosebikan, Sasikanth Manipatruni
  • Patent number: 12094511
    Abstract: A disturb mitigation scheme is described for a 1TnC or multi-element ferroelectric gain bit-cell where after writing to a selected capacitor of the bit-cell, a cure phase is initiated. Between the cure phase and the write phase, there may be zero or more cycles where the selected word-line, bit-line, and plate-lines are pulled-down to ground. The cure phase may occur immediately before the write phase. In the cure phase, the word-line is asserted again just like in the write phase. In the cure phase, the voltage on bit-line is inverted compared to the voltage on the bit-line in the write phase. By programming a value in a selected capacitor to be opposite of the value written in the write phase of that selected capacitor, time accumulation of disturb is negated. This allows to substantially zero out disturb field on the unselected capacitors of the same bit-cell and/or other unselected bit-cells.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: September 17, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Rajeev Kumar Dokania, Mustansir Yunus Mukadam, Tanay Gosavi, James David Clarkson, Neal Reynolds, Amrita Mathuriya, Sasikanth Manipatruni
  • Patent number: 12096325
    Abstract: This Application sets forth techniques for managing subscriber identity module (SIM) toolkit (STK) scheduling for multiple enabled electronic subscriber identity module (eSIM) profiles on an embedded universal integrated circuit card (eUICC) of a wireless device, including managing multiple STK sessions at a baseband processor external to the eUICC of the wireless device. To forestall STK communication for different eSIMs from interfering with execution of processes associated with the eSIMs, a baseband processor can schedule STK sessions to avoid overlap and reduce opportunities for errors in handling eSIM processes. The baseband processor can prioritize whether to queue commands for a second STK session for a second eSIM until a first STK session for a first eSIM ends or to terminate the first STK session to handle the second STK session.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: September 17, 2024
    Assignee: Apple Inc.
    Inventors: Li Li, Rajeev Verma, Dennis D. Conway
  • Patent number: 12090164
    Abstract: Disclosed are methods of treating cystic fibrosis using AmB and a sterol or compositions comprising AmB and a sterol. Also disclosed are methods of increasing the pH of airway surface liquid in a patient having cystic fibrosis using AmB and a sterol; and methods of decreasing the viscosity of airway surface liquid in a patient having cystic fibrosis using AmB and a sterol.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: September 17, 2024
    Assignees: The Board of Trustees of the University of Illinois, University of Iowa Research Foundation
    Inventors: Martin D. Burke, Katrina A. Muraglia, Rajeev S. Chorghade, Michael J. Welsh
  • Patent number: 12093749
    Abstract: A system to facilitate infrastructure management is described. The system includes one or more processors and a non-transitory machine-readable medium storing instructions that, when executed, cause the one or more processors to execute an infrastructure management controller to automatically balance utilization of infrastructure resources between a plurality of on-premise infrastructure controllers.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: September 17, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Subhajit Dasgupta, Charles E. Fowler, Michelle Frolik, Charles Greenidge, Jerry Harrow, Sandesh V. Madhyastha, Clifford A. McCarthy, Abhay Padlia, Rajeev Pandey, Jonathan M. Sauer, Geoffery Schunicht, Latha Srinivasan, Gary L. Thunquest
  • Patent number: 12096638
    Abstract: A configuration for efficiently placing a group of capacitors with one terminal connected to a common node is described. The capacitors are stacked and folded along the common node. In a stack and fold configuration, devices are stacked vertically (directly or with a horizontal offset) with one terminal of the devices being shared to a common node, and further the capacitors are placed along both sides of the common node. The common node is a point of fold. In one example, the devices are capacitors. N number of capacitors can be divided in L number of stack layers such that there are N/L capacitors in each stacked layer. The N/L capacitors are shorted together with an electrode (e.g., bottom electrode). The electrode can be metal, a conducting oxide, or a combination of a conducting oxide and a barrier material. The capacitors can be planar, non-planar or replaced by memory elements.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: September 17, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Rajeev Kumar Dokania, Amrita Mathuriya, Debo Olaosebikan, Tanay Gosavi, Noriyuki Sato, Sasikanth Manipatruni
  • Patent number: 12094923
    Abstract: A memory device includes a first electrode comprising a first conductive nonlinear polar material, where the first conductive nonlinear polar material comprises a first average grain length. The memory device further includes a dielectric layer comprising a perovskite material on the first electrode, where the perovskite material includes a second average grain length. A second electrode comprising a second conductive nonlinear polar material is on the dielectric layer, where the second conductive nonlinear polar material includes a third grain average length that is less than or equal to the first average grain length or the second average grain length.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: September 17, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Niloy Mukherjee, Somilkumar J. Rathi, Jason Y. Wu, Pratyush Pandey, Zeying Ren, Fnu Atiquzzaman, Gabriel Antonio Paulius Velarde, Noriyuki Sato, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania, Amrita Mathuriya, Ramamoorthy Ramesh, Sasikanth Manipatruni
  • Publication number: 20240303294
    Abstract: Systems and methods are described for monitoring and managing an online experience. An example method includes: obtaining user data describing interactions between a plurality of users and plurality of online services; determining, based on the user data, a rate of change in usage of the online services for each user in the plurality of users; assigning a portion of the users to a user segment based on the user data and the determined rate of change in usage; and based on the assignment, providing each user in the user segment with a customized experience in one or more of the online services.
    Type: Application
    Filed: March 14, 2024
    Publication date: September 12, 2024
    Inventors: Rajeev Raman, Stephen Mui
  • Publication number: 20240301536
    Abstract: Described herein are novel 5xxx series aluminum alloys which exhibit high strength and formability. The aluminum alloys described herein have higher amounts of Mg content than traditional 5xxx series aluminum alloys and exhibit high strength and formability. The aluminum alloys described herein are produced according to a method including continuous casting.
    Type: Application
    Filed: January 19, 2022
    Publication date: September 12, 2024
    Applicant: Novelis Inc.
    Inventors: Sazol Kumar Das, Rajasekhar Talla, Rajeev G. Kamat, Tudor Piroteala, Samuel Robert Wagstaff
  • Publication number: 20240303139
    Abstract: The present invention provides a robust and effective solution to an entity or an organization by enabling maximization of the utilization of machine resources by optimally allocating the tasks such as application programming interfaces (APIS) in the queue using a set of predetermined instructions. The method further enables finding the number of machines in order to fulfil a cumulative service-level agreement (SLA) of the APIs in the queue using heuristics and the set of predetermined instructions.
    Type: Application
    Filed: October 29, 2022
    Publication date: September 12, 2024
    Inventors: Ameya MUNAGEKAR, Akansha KUMAR, Kamlesh DHONDGE, Akhil Patel PATLOLLA, Rajeev GUPTA
  • Publication number: 20240303841
    Abstract: Disclosed are systems and techniques for capturing images (e.g., using a monocular image sensor) and detecting depth information. According to some aspects, a computing system or device can generate a feature representation of a current image and update accumulated feature information for storage in a memory based on a feature representation of a previous image and optical flow information of the previous image. The accumulated feature information can include accumulated image feature information associated with a plurality of previous images and accumulated optical flow information associated of the plurality of previous images. The computing system or device can obtain information associated with relative motion of the current image based on the accumulated feature information and the feature representation of the current image.
    Type: Application
    Filed: December 13, 2023
    Publication date: September 12, 2024
    Inventors: Rajeev YASARLA, Hong CAI, Jisoo JEONG, Risheek GARREPALLI, Yunxiao SHI, Fatih Murat PORIKLI
  • Patent number: D1043456
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: September 24, 2024
    Inventor: Rajeev Ramanath