Abstract: An approach is provided for monitoring disk utilization at an object level. At a first time a first size of an object (i.e., integrated file system or library) in a System i computing platform is determined. At a second time a second size of the object is determined. A difference between the first and second sizes is determined. The difference is determined to be greater than a threshold. Based on the difference exceeding the threshold, an alert is sent indicating growth at the object level rather than at an auxiliary storage pool level. Sizes of System i libraries are monitored at multiple dates and stored in a repository. Sizes of the libraries at user-entered start and end dates are retrieved from the repository. Differences between the sizes of the libraries at the start and end dates are determined and presented.

Abstract: An integrated device package that includes a die, a substrate, a fill and a conductive interconnect. The die includes a pillar, where the pillar has a first pillar width. The substrate (e.g., package substrate, interposer) includes a dielectric layer and a substrate interconnect (e.g., surface interconnect, embedded interconnect). The fill is located between the die and the substrate. The conductive interconnect is located within the fill. The conductive interconnect includes a first interconnect width that is about the same or less than the first pillar width. The conductive interconnect is coupled to the pillar and the substrate interconnect. The fill is a non-conductive photosensitive material. The fill is a photosensitive film. The substrate interconnect includes a second interconnect width that is equal or greater than the first pillar width. The conductive interconnect includes one of at least a paste, a solder and/or an enhanced solder comprising a polymeric material.

Abstract: A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.

Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.

Abstract: An approach is provided for monitoring disk utilization at an object level. At a first time a first size of an object (i.e., integrated file system or library) in a System i computing platform is determined. At a second time a second size of the object is determined. A difference between the first and second sizes is determined. The difference is determined to be greater than a threshold. Based on the difference exceeding the threshold, an alert is sent indicating growth at the object level rather than at an auxiliary storage pool level. Sizes of System i libraries are monitored at multiple dates and stored in a repository. Sizes of the libraries at user-entered start and end dates are retrieved from the repository. Differences between the sizes of the libraries at the start and end dates are determined and presented.

Abstract: An approach is provided for monitoring disk utilization at an object level. At a first time a first size of an object in a System i computing platform is determined by calling an application programming interface (API). The object is an integrated file system object or a library that includes other objects in the System i platform. At a second time a second size of the object is determined by calling the API. A difference between the first and second sizes is determined. The difference is determined to be greater than a threshold. Based on the difference exceeding the threshold, an alert is sent. The alert indicates the object had a growth in size that exceeds the threshold and indicates the growth at a level of the object, which is different from a growth at a level of an auxiliary storage pool in the System i platform.

Abstract: Some features pertain to a package that includes a redistribution portion, a first die coupled to the redistribution portion, a core layer coupled to the redistribution portion, and an encapsulation layer encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer. The core layer has a higher Young's Modulus than the encapsulation layer. In some implementations, the core layer includes a glass fiber (e.g., core layer is a glass reinforced dielectric layer). In some implementations, the core layer has a Young's Modulus of about at least 15 gigapascals (Gpa). In some implementations, the first die includes a front side and a back side, where the front side of the first die is coupled to the redistribution portion. In some implementations, the first dielectric layer is a photo imageable dielectric (PID) layer.

Abstract: A hydraulic system (40) for a work machine comprising a priority circuit (41) including at least a first priority actuator (47, 48) and a priority control valve (58) for controlling the supply of hydraulic fluid to the first priority actuator (47, 48) and for providing a load sense signal indicative of the load acting on the first priority actuator (47, 48); an auxiliary circuit (42) including at least a first auxiliary actuator (51) and at least a first auxiliary control valve (80) for controlling the supply of hydraulic fluid to the first auxiliary actuator (51); at least a first pump (46) for producing a flow of hydraulic fluid; and a priority valve (74) for distributing the flow from the pump (46) to the priority circuit (41) and auxiliary circuit (42) for operating the respective actuators thereof, with priority being given to the priority circuit (41) as a function of the load sense signal.

Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.

Abstract: Provided is an auxiliary power module removably connectable to a mobile platform, such as a municipal vehicle having a prime mover mounted thereon for powering the auxiliary power module. The auxiliary power module includes at least one auxiliary power module, such as a generator, at least one hydraulic motor mechanically connected to the generator for driving the generator, and a fluid connector fluidly connected to the hydraulic motor and configured to mate with a coupler to fluidly connect the hydraulic motor to a hydraulic pump on the mobile platform. When the auxiliary power module is connected to the municipal vehicle, the existing vehicle hydraulic circuit may be used with the auxiliary power module to provide output power from the generator during emergency and disaster situations.

Abstract: An integrated device that includes a printed circuit board (PCB) and a package on package (PoP) device coupled to the printed circuit board (PCB). The package on package (PoP) device includes a first package that includes a first electronic package component (e.g., first die) and a second package coupled to the first package. The integrated device includes a first encapsulation layer formed between the first package and the second package. The integrated device includes a second encapsulation layer that at least partially encapsulates the package on package (PoP) device. The integrated device is configured to provide cellular functionality, wireless fidelity functionality and Bluetooth functionality. In some implementations, the first encapsulation layer is separate from the second encapsulation layer. In some implementations, the second encapsulation layer includes the first encapsulation layer.

Abstract: A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: A hybrid package having a processor module disposed on a substrate and an auxiliary module disposed on a patterned lid. The auxiliary module may be a memory module, a power management integrated circuit (PMIC) module, and/or other suitable module, that are located in the package along with the processor module. Having the auxiliary module in the package with the processor module reduces the noise at the solder bump between the processor module and the substrate. Having the auxiliary module in the package with the processor module also allows other modules to be added to the package without increasing the area of the package.

Abstract: Some features pertain to a package that includes a redistribution portion, a first die coupled to the redistribution portion, a core layer coupled to the redistribution portion, and an encapsulation layer encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer. The core layer has a higher Young's Modulus than the encapsulation layer. In some implementations, the core layer includes a glass fiber (e.g., core layer is a glass reinforced dielectric layer). In some implementations, the core layer has a Young's Modulus of about at least 15 gigapascals (Gpa). In some implementations, the first die includes a front side and a back side, where the front side of the first die is coupled to the redistribution portion. In some implementations, the first dielectric layer is a photo imageable dielectric (PID) layer.

Abstract: A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace.

Abstract: Some examples of the disclosure include a semiconductor package having a heat spreader, an outer perimeter portion attached to the bottom of the heat spreader along the perimeter and having a plurality of electrical pathways, a package substrate located below and spaced from the outer perimeter portion and having a plurality of electrical pathways, a plurality of connection points located between the outer perimeter component and the package substrate to provide connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways in the package substrate, and a cavity formed on the bottom of the heat spreader inside the outer perimeter portion.

Abstract: Some examples of the disclosure include a semiconductor package having a heat spreader, an outer perimeter portion attached to the bottom of the heat spreader along the perimeter and having a plurality of electrical pathways, a package substrate located below and spaced from the outer perimeter portion and having a plurality of electrical pathways, a plurality of connection points located between the outer perimeter component and the package substrate to provide connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways in the package substrate, and a cavity formed on the bottom of the heat spreader inside the outer perimeter portion.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: An approach is provided for monitoring disk utilization at an object level. At a first time a first size of an object in a System i computing platform is determined by calling an application programming interface (API). The object is an integrated file system object or a library that includes other objects in the System i platform. At a second time a second size of the object is determined by calling the API. A difference between the first and second sizes is determined. The difference is determined to be greater than a threshold. Based on the difference exceeding the threshold, an alert is sent. The alert indicates the object had a growth in size that exceeds the threshold and indicates the growth at a level of the object, which is different from a growth at a level of an auxiliary storage pool in the System i platform.