Patents by Inventor Rajneesh Kumar

Rajneesh Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120217287
    Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 30, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Rajneesh Kumar, Jae-Woong Nah, Eric D. Perfecto
  • Patent number: 8204029
    Abstract: A system and method are provided in which access point (AP) devices in a wireless local area network (WLAN) are typed or configured into one of three measurement and reporting roles: Monitor-Mode AP (MMAP), Portal AP (PAP), a Border AP (BAP) or an Interior AP (IAP). APs are assigned specific link measurement requirements according to their assigned type or role. In general, MMAPs and PAPs have the greatest measurement and reporting responsibilities, BAPs have less measurement and reporting responsibilities than PAPs and IAPs have the least measurement and reporting responsibilities. The APs generate measurements that are supplied to appropriate equipment to facilitate handover decisions with respect to a dual-mode wireless client device that roams between the WLAN and another network or vice versa. As a result, link measurements are only performed by APs in locations where such measurements are necessary for handover service, thus reducing the overall processing load on the WLAN infrastructure.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: June 19, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: David Sheldon Stephenson, Seema Nayak, Sudip Ghosal, Rajneesh Kumar
  • Publication number: 20120119353
    Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
    Type: Application
    Filed: January 26, 2012
    Publication date: May 17, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael A. Gaynes, Rajneesh Kumar, Thomas E. Lombardi, Steve Ostrander
  • Publication number: 20120106463
    Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.
    Type: Application
    Filed: November 2, 2010
    Publication date: May 3, 2012
    Inventors: Michael McBride, Subhasri Dhesikan, Neil Diener, David Stephenson, Rajneesh Kumar
  • Patent number: 8165021
    Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: April 24, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: Prasad Prabhakar Jogalekar, Arnold Mark Bilstad, Rajneesh Kumar
  • Patent number: 8129230
    Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: March 6, 2012
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Rajneesh Kumar, Thomas E. Lombardi, Steve Ostrander
  • Patent number: 8085710
    Abstract: A packet loss reduction system. In particular implementations, a method includes responsive to indications of roaming intent of a wireless client relative to currently associated wireless access point, determining if a traffic stream associated with the wireless client is to be proactively buffered by one or more potential wireless access points; conditionally transmitting a command to the one or more potential wireless access points to cause the potential wireless access points to set up resources to proactively buffer packets of the traffic stream; duplicating received packets of the traffic stream destined for the wireless client; and transmitting the duplicate packets to the potential wireless access points for storage in a proactive stream buffer.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: December 27, 2011
    Assignee: Cisco Technology, Inc.
    Inventors: Rajneesh Kumar, Robert B. O'Hara, Jr., Kalyan Dharanipragada
  • Publication number: 20110267084
    Abstract: Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brian M. ERWIN, David L. GARDELL, James N. HUMENIK, Rajneesh KUMAR, John LAWSON
  • Patent number: 7981849
    Abstract: A reversible thermal thickening grease for microelectronic packages, in which the grease contains filler particles; at least one polymer; and a binder; in which the filler particles are dispersed within the binder, in which one or more segments of the at least one polymer may be attached to the filler particles prior to dispersion in the binder, and in which the polymer collapses at temperatures below a Theta temperature and swells at temperatures above a Theta temperature. During the operation of a microelectronic package, grease pump-out and air proliferation are minimized with use of the reversible thermal thickening grease, while grease fluidity is retained under repetitive thermal stresses.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: July 19, 2011
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Jeffrey D. Gelorme, Sushumna Iruvanti, Rajneesh Kumar, Ijeoma M. Nnebe
  • Patent number: 7978669
    Abstract: In one embodiment, a method includes characterizing a first packet of a video stream as being associated with a first frame type, wherein the video stream is arranged to be transmitted on a wireless local area network. The method also includes processing at least the first packet of the video stream as being associated with the first frame type if the first packet of the video stream is characterized as being of the first frame type.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: July 12, 2011
    Assignee: Cisco Technology, Inc.
    Inventors: Rajneesh Kumar, Aseem Asthana, Sravan Vadlakonda, Ashish Chotai
  • Patent number: 7948905
    Abstract: A voice over WLAN diagnostic system. In particular implementations, a method includes simulating, in response to a triggering event, Voice over Internet Protocol (VoIP) communications with a remote diagnostics engine; gathering metric data characterizing one or more aspects of the simulated VoIP communications; and periodically transmitting diagnostic packets including the metric data to the remote diagnostics engine; wherein the simulating VoIP communications comprises transmitting diagnostic protocol packets that simulate VoIP communications to the remote diagnostic engine; and intercepting diagnostic protocol packets received from the diagnostics engine.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: May 24, 2011
    Assignee: Cisco Technologies, Inc.
    Inventors: Girish S. Variyath, Vikram Jayaraman, Karthikeyan Ganesan, Rajneesh Kumar
  • Publication number: 20110037181
    Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 17, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael A. Gaynes, Rajneesh Kumar, Thomas E. Lombardi, Steve Ostrander
  • Patent number: 7816785
    Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: October 19, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, Randall G. Kemink, Rajneesh Kumar, Steven P. Ostrander, Prabjit Singh
  • Patent number: 7768923
    Abstract: A method and software to cause a processor to implement a method to set a packet age limit in an access point of a wireless network for communicating time-sensitive data with an associated wireless client station. One method includes the client station sending feedback to the access point so that the access point can set its packet age limit. Another method includes the access point setting its packet age limit according to feedback from the associated client station and/or according to information determined at the access point about the network.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: August 3, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: Rajneesh Kumar, David Sheldon Stephenson
  • Publication number: 20100181663
    Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.
    Type: Application
    Filed: January 22, 2009
    Publication date: July 22, 2010
    Applicant: International Business Machines Corporation
    Inventors: SUSHUMNA IRUVANTI, RANDALL G. KEMINK, RAJNEESH KUMAR, STEVEN P. OSTRANDER, PRABJIT SINGH
  • Publication number: 20100118830
    Abstract: A system and method are provided in which access point (AP) devices in a wireless local area network (WLAN) are typed or configured into one of three measurement and reporting roles: Monitor-Mode AP (MMAP), Portal AP (PAP), a Border AP (BAP) or an Interior AP (IAP). APs are assigned specific link measurement requirements according to their assigned type or role. In general, MMAPs and PAPs have the greatest measurement and reporting responsibilities, BAPs have less measurement and reporting responsibilities than PAPs and IAPs have the least measurement and reporting responsibilities. The APs generate measurements that are supplied to appropriate equipment to facilitate handover decisions with respect to a dual-mode wireless client device that roams between the WLAN and another network or vice versa. As a result, link measurements are only performed by APs in locations where such measurements are necessary for handover service, thus reducing the overall processing load on the WLAN infrastructure.
    Type: Application
    Filed: December 19, 2008
    Publication date: May 13, 2010
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: David Sheldon Stephenson, Seema Nayak, Sudip Ghosal, Rajneesh Kumar
  • Patent number: 7641811
    Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: January 5, 2010
    Assignee: International Business Machines Corporation
    Inventors: Rajneesh Kumar, Stephen P. Ostrander
  • Patent number: 7606178
    Abstract: An apparatus for, a method of, and a computer carrier medium carrying code to cause a processor to execute a method. The method includes running a plurality of instances of a wireless spanning tree protocol in a wireless mesh node, each instance substantially conforming to the IEEE 802.1 standard. Running an instance of wireless spanning tree protocol including the wireless mesh point wirelessly transmitting BPDU information to other wireless mesh points of the network or wirelessly receiving BPDU information from other wireless mesh points, the BPDU information encapsulated in one or more control/management frames, e.g., beacon or probe response frames of a wireless network standard, the BPDU information relating to a spanning tree topology for the instance.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: October 20, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Shahriar I. Rahman, Jan Kruys, Rajneesh Kumar
  • Publication number: 20090219822
    Abstract: A voice over WLAN diagnostic system. In particular implementations, a method includes simulating, in response to a triggering event, Voice over Internet Protocol (VoIP) communications with a remote diagnostics engine; gathering metric data characterizing one or more aspects of the simulated VoIP communications; and periodically transmitting diagnostic packets including the metric data to the remote diagnostics engine; wherein the simulating VoIP communications comprises transmitting diagnostic protocol packets that simulate VoIP communications to the remote diagnostic engine; and intercepting diagnostic protocol packets received from the diagnostics engine.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Applicant: Cisco Technology, Inc.
    Inventors: Girish S. Variyath, Vikram Jayaraman, Karthikeyan Ganesan, Rajneesh Kumar
  • Publication number: 20090213207
    Abstract: A method is provided for configuring a video conference endpoint. The method comprises receiving session data that comprises endpoint connection data for remote endpoints associated with scheduled conferences, and receiving a signal from a user interface indicating a user has activated a control associated with a selected conference, identifying the endpoint connection data for the remote endpoint associated with the selected conference, and establishing a media session with the associated remote endpoint. A video conference endpoint system also is provided. The system comprises a controller coupled to a memory, and a user interface coupled to the controller. The user interface includes a command button associated with a conference. The controller periodically receives session data associated with the scheduled conferences, stores the session data in the memory, and establishes the selected conference in response to a user activating the command button.
    Type: Application
    Filed: May 11, 2009
    Publication date: August 27, 2009
    Applicant: Cisco Technology, Inc.
    Inventors: Krutarth Shah, Randy K. Harrell, Kenneth W. Erion, Rajneesh Kumar