Patents by Inventor Ravindra Vaman Shenoy
Ravindra Vaman Shenoy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200387734Abstract: Various aspects of the present disclosure generally relate to optical character detection. In some aspects, a user device may receive, from a vision sensor, a first image that is associated with a first optical character image. The user device may determine, using an image processing model, that the first image depicts the first optical character image. The user device may cause, based at least in part on determining that the first image depicts the first optical character image, a camera to capture a second image that is associated with a second optical character image. The user device may perform an action associated with the second image. Numerous other aspects are provided.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: Ravishankar SIVALINGAM, Russell GRUHLKE, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Evgeni GOUSEV, Kebin LI, Khurshid Syed ALAM, Edwin Chongwoo PARK, Arnold Jason Gum
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Publication number: 20200344413Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.Type: ApplicationFiled: April 23, 2020Publication date: October 29, 2020Inventors: Jon LASITER, Evgeni GOUSEV, Ravindra Vaman SHENOY, Russell GRUHLKE, Khurshid Syed ALAM, Kebin LI, Edwin Chongwoo PARK
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Publication number: 20200314305Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.Type: ApplicationFiled: July 24, 2019Publication date: October 1, 2020Inventors: Russell GRUHLKE, Jon LASITER, Ravindra Vaman SHENOY, Ravishankar SIVALINGAM, Kebin LI, Khurshid Syed ALAM
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Patent number: 10734332Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: GrantFiled: December 12, 2017Date of Patent: August 4, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin, Seong Heon Jeong, Jeremy Dunworth, Alireza Mohammadian, Mario Francisco Velez, Chin-Kwan Kim
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Patent number: 10685924Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: GrantFiled: August 24, 2017Date of Patent: June 16, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Publication number: 20200147643Abstract: Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non-ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.Type: ApplicationFiled: January 9, 2020Publication date: May 14, 2020Inventors: Firas SAMMOURA, David William BURNS, Ravindra Vaman SHENOY
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Patent number: 10618079Abstract: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.Type: GrantFiled: February 23, 2017Date of Patent: April 14, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter
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Patent number: 10569302Abstract: Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non- ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.Type: GrantFiled: June 26, 2017Date of Patent: February 25, 2020Assignee: Qualcomm IncorporatedInventors: Firas Sammoura, David William Burns, Ravindra Vaman Shenoy
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Publication number: 20200006846Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.Type: ApplicationFiled: June 29, 2018Publication date: January 2, 2020Inventors: Jon LASITER, Seong Heon JEONG, Ravindra Vaman SHENOY, Jeremy Darren DUNWORTH, Mohammad Ali TASSOUDJI
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Publication number: 20190379102Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.Type: ApplicationFiled: June 11, 2018Publication date: December 12, 2019Inventors: Jon LASITER, Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Seong Heon JEONG, Jeremy Darren DUNWORTH
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Patent number: 10497748Abstract: An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.Type: GrantFiled: October 12, 2016Date of Patent: December 3, 2019Assignee: QUALCOMM IncorporatedInventors: Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Alan Dickinson, Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter, Hao-Yen Tang, Yipeng Lu
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Patent number: 10490880Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.Type: GrantFiled: September 18, 2017Date of Patent: November 26, 2019Assignee: QUALCOMM IncorporationInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Patent number: 10478858Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.Type: GrantFiled: December 12, 2014Date of Patent: November 19, 2019Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti
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Patent number: 10470309Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.Type: GrantFiled: September 20, 2015Date of Patent: November 5, 2019Assignee: QUALCOMM IncorporatedInventors: Mete Erturk, Farsheed Mahmoudi, James Thomas Doyle, Ravindra Vaman Shenoy, Jitae Kim
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Publication number: 20190259677Abstract: A device comprising a first die, a second die coupled to a first die, and a polymer planarization layer. The second die includes a side portion and a backside portion. The polymer planarization layer is coupled to the first die and the second die such that the polymer planarization layer is coupled to the side portion and the backside portion of the second die. The polymer planarization layer includes an organic polymer. The polymer planarization layer may include a self planarizing material.Type: ApplicationFiled: September 19, 2018Publication date: August 22, 2019Inventors: Jon LASITER, Ravindra Vaman SHENOY, Kambiz SAMADI, Jing XIE
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Publication number: 20190164681Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.Type: ApplicationFiled: November 30, 2017Publication date: May 30, 2019Inventors: Donald William KIDWELL, JR., Ravindra Vaman SHENOY, Alan LEWIS, Christopher Feuling FERGUSON
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Publication number: 20190076114Abstract: An apparatus may include an array of piezoelectric micromachined ultrasonic transducers (PMUTs) and a control system configured to communicate with the array of PMUTs. The control system may be configured to determine a target location within a human body and to control the array of PMUTs to focus ultrasonic waves at the target location.Type: ApplicationFiled: September 13, 2017Publication date: March 14, 2019Inventors: Firas Sammoura, David William Burns, Ravindra Vaman Shenoy
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Publication number: 20190067221Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: ApplicationFiled: December 12, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Vladimir APARIN, Seong Heon JEONG, Jeremy DUNWORTH, Alireza MOHAMMADIAN, Mario Francisco VELEZ, Chin-Kwan KIM
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Publication number: 20190067219Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: ApplicationFiled: August 24, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad TASSOUDJI, Mario Francisco VELEZ
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Patent number: 10209072Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.Type: GrantFiled: April 13, 2015Date of Patent: February 19, 2019Assignee: SNAPTRACK Inc.Inventors: Philip Jason Stephanou, David William Burns, Ravindra Vaman Shenoy