Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: Monitoring techniques have been developed for direct/indirect determination of metal etching bath components and for managing their replenishment. The disclosed methods have been successfully employed to make TiW etching a robust process that provides minimized and controlled undercutting of ball limited metallurgy and mechanical reliable C4s. A metal etching solution is monitored and replenished by measuring the sulfate concentration of a hydrogen peroxide, soluble salt, and soluble EDTA salt etchant. Turbidimetric titration conditions are used to measure and compare opaqueness of liquids by viewing light through them and determining how much light is cut off. Additional sulfate is added to maintain the sulfate concentration. Water and/or fresh etchant is added to compensate for evaporation or drag.

Abstract: The present invention relates to a chemical etchant for etching metals in the presence of one or more metals not to be etched, the etchant comprising 10-25 gms EDTA, 15-35 gms K.sub.2 HPO.sub.4 and 25-45 gms oxalic acid in a liter of 30% H.sub.2 O.sub.2. More particularly, in the fabrication of interconnections for microchip structures, the present invention addresses the removal of intermediate adherent layers, e.g., Ti--W, without damaging other microchip structures made of other metals, such as Al or Al--Cu test pads; Cu and phased Cr--Cu layers; and Sn--Pb solder bumps. The use of potassium phosphate in the hydrogen peroxide+EDTA bath has been found to significantly reduce the attack on the metal not to be etched. Furthermore, the use of oxalic acid in the bath prevented the deposition of tin oxide on the substrate adherent layer metal, thus facilitating its complete removal.

Abstract: Reduced undercutting of a titanium-tungsten layer in a ball limiting metallurgy (BLM) is achieved in the preparation of solder ball interconnect structures by removing metal oxide film which forms on the titanium-tungsten layer and etching the titanium-tungsten layer in different steps. Removing the metal oxide with an acid solution prior to etching the titanium-tungsten layer provides for a more uniform etch of the titanium-tungsten layer.