Patents by Inventor Raymond G. Beausoleil

Raymond G. Beausoleil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10396521
    Abstract: A laser includes a traveling wave laser cavity with an active section, a pulse stretcher, and a pulse compressor. The pulse stretcher is coupled to the waveguide before the active section and the pulse compressor is coupled to the waveguide after the active section.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: August 27, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Geza Kurczveil, Raymond G. Beausoleil, Di Liang, Chong Zhang, David Kielpinski
  • Patent number: 10386698
    Abstract: In the examples provided herein, an optical logic gate includes multiple couplers, where no more than two types of couplers are used in the optical logic gate, and further wherein the two types of couplers consist of: a 3-dB coupler and a weak coupler with a given transmission-to-reflection ratio. The optical logic gate also includes a first resonator, wherein the first resonator comprises a photonic crystal resonator or a nonlinear ring resonator, wherein in operation, the first resonator has a dedicated continuous wave input to bias a complex amplitude of a total field input to the first resonator such that the total field input is either above or below a nonlinear switching threshold of the first resonator, where the optical logic gate is an integrated photonic circuit.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: August 20, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Charles M. Santori, Jason Pelc, Ranojoy Bose, Cheng Li, Raymond G Beausoleil
  • Patent number: 10367590
    Abstract: Examples described herein relate to concurrently performing operations on optical signals. In an example, a method includes providing, to an optical circuit, a first plurality of signals having a first optical property and encoding a first vector. A second plurality of signals is provided to the circuit that encodes a second vector and has a second optical property that is different from the first optical property. A first attribute-dependent operation is performed on the first plurality of signals via the circuit to perform a first matrix multiplication operation on the first vector, and concurrently, a second attribute-dependent operation is performed on the second plurality of signals to perform a second matrix multiplication operation on the second vector. The first matrix multiplication operation and the second matrix multiplication operation are different based on the first optical property being different from the second optical property.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: July 30, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David Kielpinski, Jason Pelc, Thomas Van Vaerenbergh, Nikolas Tezak, Gabriel Joe Mendoza, Raymond G. Beausoleil
  • Publication number: 20190204507
    Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Raymond G. Beausoleil, Marco Fiorentino, Jason Pelc, Charles M. Santori, Terrel L. Morris
  • Patent number: 10333628
    Abstract: According to one example, errors in a logical signal from a data slicer are detected and a power supply voltage is adjusted based on the detected errors.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: June 25, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Cheng Li, Marco Fiorentino, Raymond G Beausoleil, Sr.
  • Patent number: 10333516
    Abstract: In one example, a device includes a photodetector to generate an electrical signal in response to an optical signal and a transimpedance amplifier unit to receive the electrical signal. In one example, the transimpedance amplifier unit may include a first inverter unit, a second inverter unit coupled to the first inverter unit, and a third inverter unit coupled to the second inverter unit. In one example the third inverter unit may include a feedback resistor and a first n-type transistor in parallel to the feedback resistor, where the first n-type transistor is to provide a variable gain of the third inverter unit.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: June 25, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Cheng Li, Kunzhi Yu, Marco Fiorentino, Raymond G Beausoleil
  • Publication number: 20190190610
    Abstract: One example includes a bias-based Mach-Zehnder modulation (MZM) system. The system includes a Mach-Zehnder modulator to receive and split an optical input signal and to provide an intensity-modulated optical output signal based on a high-frequency data signal to modulate a relative phase of the split optical input signal to transmit data and based on a bias voltage to modulate the relative phase of the split optical input signal to tune the Mach-Zehnder modulator. The system also includes a bias feedback controller to compare a detection voltage associated with the intensity-modulated output signal with a reference voltage to measure an extinction ratio associated with an optical power of the intensity-modulated optical output signal and to adjust the bias voltage based on the comparison to substantially maximize the extinction ratio.
    Type: Application
    Filed: February 14, 2019
    Publication date: June 20, 2019
    Inventors: Cheng Li, Jim Huang, Ashkan Seyedi, Marco Fiorentino, Raymond G. Beausoleil
  • Patent number: 10261256
    Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: April 16, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Raymond G Beausoleil, Marco Fiorentino, Jason Pelc, Charles M Santori, Terrel L Morris
  • Patent number: 10256902
    Abstract: In example implementations, an apparatus includes a bus waveguide, a plurality of optical gates coupled to the bus waveguide and an injection coupler. The bus waveguide receives a plurality of constraint signals. Each optical gate outputs an internal state via a local phase shift when at least one of the plurality of constraint signals has a wavelength that matches a respective resonant wavelength. The injection coupler combines the at least one of the plurality of constraint signals with additional constraint signals that are injected. An error is detected in a bit of a message when an overall phase shift has occurred to the at least one of the plurality of constraint signals causing a power level to exceed a power level threshold of an optical gate when the at least one of the plurality of constraint signals constructively interferes with the additional constraint signals that are injected.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: April 9, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Nikolas Anton Tezak, David Kielpinski, Jason Pelc, Thomas Van Vaerenbergh, Ranojoy Bose, Raymond G. Beausoleil
  • Publication number: 20190103719
    Abstract: A laser includes a traveling wave laser cavity with an active section, a pulse stretcher, and a pulse compressor. The pulse stretcher is coupled to the waveguide before the active section and the pulse compressor is coupled to the waveguide after the active section.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Geza Kurczveil, Raymond G. Beausoleil, Di Liang, Chong Zhang, David Kielpinski
  • Publication number: 20190094466
    Abstract: An example system for multi-wavelength optical signal splitting is disclosed. The example disclosed herein comprises a first splitter, a second splitter, and a modulator. The system receives a multi-wavelength optical signal and an electrical signal, wherein the multi-wavelength optical signal comprises a plurality of optical wavelengths and has a power level. The first splitter is to split the plurality of optical wavelengths into a plurality of optical wavelength groups. The second splitter is to split the multi-wavelength optical signal or the plurality of optical wavelength groups into a plurality of lower power signal groups. The modulator is to encode the electrical signal into the plurality of optical wavelength groups, the plurality of lower power signal groups, or a combination thereof.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Inventors: Raymond G. Beausoleil, Di Liang, Marco Fiorentino, Geza Kurczveil, Mir Ashkan Seyedi, Zhihong Huang
  • Patent number: 10243662
    Abstract: One example includes a bias-based Mach-Zehnder modulation (MZM) system. The system includes a Mach-Zehnder modulator to receive and split an optical input signal and to provide an intensity-modulated optical output signal based on a high-frequency data signal to modulate a relative phase of the split optical input signal to transmit data and based on a bias voltage to modulate the relative phase of the split optical input signal to tune the Mach-Zehnder modulator. The system also includes a bias feedback controller to compare a detection voltage associated with the intensity-modulated output signal with a reference voltage to measure an extinction ratio associated with an optical power of the intensity-modulated optical output signal and to adjust the bias voltage based on the comparison to substantially maximize the extinction ratio.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 26, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Cheng Li, Jim Huang, Ashkan Seyedi, Marco Fiorentino, Raymond G Beausoleil
  • Publication number: 20190089466
    Abstract: An example optical receiver may have an optical receiver front-end, four slicers, and a logic block. The optical receiver front-end may include a transimpedance amplifier to convert a photodiode output signal to a voltage signal. Three of the slicers may be data slicers, and one of the slicers may be an edge slicer. The slicers may each: shift the voltage signal based on an offset voltage set for the respective slicer, determine whether the shifted voltage signal is greater than a threshold value and generate a number of comparison signals based on the determining, and generate multiple digital signals by demuxing the comparison signals. The logic block may perform PAM-4 to binary decoding based on the data signals output by the data slicers and clock-and-data-recovery based on the digital signals output by the edge slicer.
    Type: Application
    Filed: April 14, 2016
    Publication date: March 21, 2019
    Inventors: Cheng Li, Kunzhi Yu, Marco Fiorentino, Raymond G. Beausoleil
  • Publication number: 20190089129
    Abstract: An example method of manufacturing a semiconductor device. A first wafer may be provided that includes a first layer that contains quantum dots. A second wafer may be provided that includes a buried dielectric layer and a second layer on the buried dielectric layer. An interface layer may be formed on at least one of the first layer and the second layer, where the interface layer may be an insulator, a transparent electrical conductor, or a polymer. The first wafer may be bonded to the second wafer by way of the interface layer.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 21, 2019
    Inventors: Di Liang, Geza Kurczveil, Raymond G. Beausoleil, Marco Fiorentino
  • Patent number: 10209445
    Abstract: Compact photonics platforms and methods of forming the same are provided. An example of a compact photonics platform includes a layered structure having an active region along a longitudinal axis, a facet having an angle no less than a critical angle formed at at least one longitudinal end of the active region, and a waveguide having at least one grating coupler positioned in alignment with the angled facet to couple light out to or in from the waveguide.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: February 19, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Di Liang, David A. Fattal, Marco Florentino, Zhen Peng, Charles M. Santori, Raymond G. Beausoleil
  • Patent number: 10212497
    Abstract: A hybrid circuit-packet switch device includes a packet switch and a circuit switch. The circuit switch selectively passes, under control of a control logic, incoming data received at an optical input of the hybrid circuit-packet switch device to the packet switch or an optical output of the hybrid circuit-packet switch device.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: February 19, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Terrel Morris, Charles F. Clark, Raymond G. Beausoleil
  • Patent number: 10192857
    Abstract: According to an example of the present disclosure a direct bandgap (DBG) semiconductor structure is bonded to an assembly comprising a silicon photonics (SiP) wafer and a complementary metal-oxide-semiconductor (CMOS) wafer. The SiP wafer includes photonics circuitry and the CMOS wafer includes electronic circuitry. The direct bandgap (DBG) semiconductor structure is optically coupled to the photonics circuitry.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: January 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Marco Fiorentino, Di Liang, Geza Kurczveil, Raymond G Beausoleil
  • Publication number: 20190020416
    Abstract: An example system includes an optical modulator and a multiplexing controller. The modulator includes a data bus for receiving at least one data signal, a plurality of multiplexers and a plurality of modulating segments. Each multiplexer is coupled to the data bus to receive at least one data signal and to output a multiplexed signal. Each modulating segment may receive the multiplexed signal from one of the plurality of multiplexers and modulate the multiplexed signal using an optical input. The multiplexing controller may be in communication with the plurality of multiplexers and may configure each of the plurality of multiplexers in accordance with a selected modulation type.
    Type: Application
    Filed: January 15, 2016
    Publication date: January 17, 2019
    Inventors: Tsung-Ching Huang, Ashkan Seyedi, Chin-Hui Chen, Cheng Li, Marco Fiorentino, Raymond G. Beausoleil
  • Publication number: 20190018919
    Abstract: In example implementations, a method executed by a processor is provided. The method receives a simulated photonic data input based on a theoretical photonic design that meets a target specification. A complementary metal-oxide semiconductor (CMOS) circuit design is designed based on the simulated photonic data input using a pre-layout simulation. An experimental photonic data input based on a fabricated photonics device that meets the target specification is received. The CMOS circuit is designed based on the experimental photonic data input using a post-layout simulation. A physical circuit CMOS circuit design and a layout that includes detailed physical dimensions associated with the physical CMOS circuit design that is based on the pre-layout and the post-layout are transmitted to a CMOS foundry.
    Type: Application
    Filed: January 22, 2016
    Publication date: January 17, 2019
    Inventors: Tsung-Ching Huang, Chin-Hui Chen, Aarco Fiorentino, Raymond G. Beausoleil
  • Patent number: 10181898
    Abstract: In example implementations, an optical gate is provided. The optical gate receives at least one optical signal via a waveguide of an optical memory gate. The optical gate compares a wavelength of the at least one optical signal to a resonant wavelength associated with a resonator. When the wavelength of the at least one optical signal matches the resonant wavelength, a value that is stored in the resonator is read out via the at least one optical signal. Then, the at least one optical signal with the value that is read out is transmitted out of the optical gate.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: January 15, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Nikolas A. Tezak, David Kielpinski, Jason Pelc, Thomas Van Vaerenbergh, Ranojoy Bose, Raymond G. Beausoleil