Abstract: Aluminum nitride (AIN), due to its high thermal conductivity, is an attractive substrate material to the power hybrid market, (i.e., users employing circuits utilizing power semiconductors resulting in a great deal of heat being produced by the electronic device). In spite of its attractive thermal, mechanical and dielectric properties, AlN substrates generally afford certain drawbacks, the primary drawback being that many conductive compositions do not readily adhere to the surface. One of the more desirable conductors to utilize in conductive compositions when producing microcircuits is copper. In accordance with the present invention, a copper containing conductive composition is provided which affords excellent adhesion to AlN substrates. The conductive composition preferably comprises copper or a copper alloy, a glass binder, and cadmium oxide.

Abstract: A method of bonding a dielectric material to a substrate comprising the steps of:I. providing a substrate;II. providing a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;III.

Abstract: This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C.