Patents by Inventor Robert E. Meyer
Robert E. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150031906Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles).Type: ApplicationFiled: October 13, 2014Publication date: January 29, 2015Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20150008592Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The chip stack further includes a thermal interface material pad between the first chip and the second chip. The thermal interface material pad comprises a plurality of nanotubes containing a magnetic material, aligned parallel to mating surfaces of the first chip and the second chip, wherein a hydrophobic tail of oleic acid is wrapped around each one of the plurality of nanotubes and a hydrophilic acid head of the oleic acid is attached to the magnetic material.Type: ApplicationFiled: July 8, 2013Publication date: January 8, 2015Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Patent number: 8917510Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.Type: GrantFiled: January 14, 2011Date of Patent: December 23, 2014Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Patent number: 8900491Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles).Type: GrantFiled: May 6, 2011Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140273614Abstract: According to embodiments of the invention, an electrical connector structure with an encapsulated corrosion inhibitor may be provided. The structure may include a first electrical connector having a first contact surface. The structure may also include an encapsulated corrosion inhibitor applied to at least a portion of the first contact surface.Type: ApplicationFiled: March 18, 2013Publication date: September 18, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joseph Kuczynski, Robert E. Meyer, III, Mark D. Plucinski, Timothy J. Tofil, Jason T. Wertz
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Publication number: 20140262192Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.Type: ApplicationFiled: March 18, 2013Publication date: September 18, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140215905Abstract: Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles.Type: ApplicationFiled: April 4, 2014Publication date: August 7, 2014Applicant: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140221212Abstract: Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl)trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles.Type: ApplicationFiled: April 4, 2014Publication date: August 7, 2014Applicant: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140221202Abstract: Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl)trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles.Type: ApplicationFiled: April 4, 2014Publication date: August 7, 2014Applicant: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140210136Abstract: Embodiments of the disclosure provide a method for removing residual BPA from a residual BPA-containing substance and a method for making a container with residual BPA removed. The method may consist of preparing a stabilization reagent, wherein water is removed from the stabilization reagent. The method may also include preparing the residual BPA-containing substance. The method may also include reacting the residual BPA-containing substance in a melt condensation process with the stabilization reagent, wherein the stabilization reagent is non-toxic.Type: ApplicationFiled: January 29, 2013Publication date: July 31, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Travis R. Hebig, Joseph Kuczynski, Robert E. Meyer, III, Steven R. Nickel
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Patent number: 8741804Abstract: Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles.Type: GrantFiled: October 28, 2011Date of Patent: June 3, 2014Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140072777Abstract: Thermally cross-linkable photo-hydrolyzable inkjet printable polymers are used to print microfluidic channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a mixture of hydrophobic polymer and cross-linking agent in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic polymer which hydrolyzes to form a hydrophilic material), cross-linking agent, and a photoacid generator (PAG) in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMAA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. The cross-linking agent (e.g.Type: ApplicationFiled: September 12, 2012Publication date: March 13, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20140041908Abstract: A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant.Type: ApplicationFiled: August 13, 2012Publication date: February 13, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Patent number: 8614882Abstract: A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads.Type: GrantFiled: June 21, 2011Date of Patent: December 24, 2013Assignee: International Business Machines CorporationInventors: Cary M. Huettner, Joseph Kuczynski, Robert E. Meyer, III, Mark D. Plucinski, Timothy J. Tofil
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Publication number: 20130291369Abstract: A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIL) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.Type: ApplicationFiled: July 12, 2013Publication date: November 7, 2013Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20130252456Abstract: An assembly may have first and second components. The first component may include a first electrical connector and a guide member. The second component may include a second electrical connector to couple with the first electrical connector, and a receptacle to receive the guide member in a mated position. An adhesive may be provided between the guide member and the receptacle to form a bond between the guide member and the receptacle. The bond may be reversed when the adhesive is heated above a threshold temperature. A heating element to heat the adhesive may be provided.Type: ApplicationFiled: March 20, 2012Publication date: September 26, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joseph Kuczynski, Robert E. Meyer, III, Mark D. Plucinski, Timothy J. Tofil
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Patent number: 8511369Abstract: Thermal insulating materials and methods of making the thermal insulating material generally include a plurality of thermally reversible crosslinked polymer modified particles. The thermally reversible crosslinked polymer modified particles include a polymer containing a plurality of a first functional group; and a modified particle having a plurality of pendent cross-linking agents containing a second functional group, wherein the first functional group and the second functional group are complementary reactants to a reversible cross-linking reaction.Type: GrantFiled: April 18, 2011Date of Patent: August 20, 2013Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20130206463Abstract: A non-halogenated flame retardant filler having phosphorous-modified inorganic particles imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. Phosphorous-modified silica particles, for example, may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a non-halogenated flame retardant filler comprised of phosphorous-modified silica particles. In an exemplary method of synthesizing phosphorous-modified silica particles, a vinyl-terminated phosphorous-based monomer (e.g., a phosphorous based flame retardant functionalized to contain a vinyl functional group) is reacted with vinyl functionalized silica particles (i.e.Type: ApplicationFiled: February 15, 2012Publication date: August 15, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Patent number: 8507062Abstract: A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.Type: GrantFiled: August 27, 2010Date of Patent: August 13, 2013Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
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Publication number: 20130187706Abstract: A tamper resistant electronic device includes multiple eFuses that are individually blown in each instance the electronic device is tampered with. For example an eFuse is blown when the electronic device is subjected to a temperature that causes solder reflow. Since it is anticipated that the electronic device may be tampered with in an acceptable way and/or an acceptable number of instances, functionality of the electronic device is altered or disabled only after a threshold number of eFuses are blown. In certain implementations, the threshold number is the number of anticipated acceptable tamper events. Upon a tamper event an individual eFuse is blown. If the total number of blown eFuses is less than the threshold, a next eFuse is enabled so that it may be blown upon a next tamper event.Type: ApplicationFiled: January 20, 2012Publication date: July 25, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Travis R. Hebig, Joseph Kuczynski, Robert E. Meyer, III, Steven R. Nickel