Abstract: A method of manufacturing an elevator of a medical device comprises using an additive manufacturing method, forming a pivot portion at a proximal end of the elevator. The pivot portion tapers proximally such that a proximalmost end of the elevator is thinner than more distal portions of the pivot portion. The method further comprises using the additive manufacturing method, forming a body of the elevator that is distal to the pivot portion. The elevator body includes a surface configured to contact an instrument inserted in a working channel of the medical device.

Abstract: A method of manufacturing an elevator of a medical device comprises using an additive manufacturing method, forming a pivot portion at a proximal end of the elevator. The pivot portion tapers proximally such that a proximalmost end of the elevator is thinner than more distal portions of the pivot portion. The method further comprises using the additive manufacturing method, forming a body of the elevator that is distal to the pivot portion. The elevator body includes a surface configured to contact an instrument inserted in a working channel of the medical device.

Abstract: A system for detecting and addressing security threats is disclosed. The system detects incoming network traffic to a computing device. The system detects physical and digital effects of the network traffic on the computing device. The system determines that the network traffic is causing a first set of anomalies based on the physical and digital effects of the network traffic. The system compares the first set of anomalies with a second set of anomalies associated with previously known malicious network traffic. If the system determines that more than a threshold percentage of the first set of anomalies corresponds to counterpart anomalies from the second set of anomalies, the system determines that the network traffic corresponds to the malicious network traffic. The system communicates a security patch associated with the second set of anomalies and instructions that cause the security patch to be executed to the computing device.

Abstract: A system for updating a security patch based on simulating different security protocols across multiple machines is disclosed. The system communicates malicious network traffic to testing computing devices. The system triggers execution of a first security protocol to a first testing computing device and a second security protocol to a second testing computing device. The first security protocol is configured to implement a first software instruction. The second security protocol is configured to implement a second software instruction. The system determines that the first software instruction is configured to counter the effect of the malicious network traffic. The system determines that the second software instruction is associated with an anomaly. In response, the system communicates the first security protocol and an instruction that causes the execution of the first security protocol to user devices.

Abstract: An implantable medical device is disclosed. The implantable medical device includes a housing forming an internal compartment. The housing includes a frame disposed within the internal compartment forming a first partition and a second partition within the internal compartment. The first partition is hermetically sealed from the second partition. At least one electronic component and a power source are disposed within the first partition. The medical device includes a fluidics circuit including a manifold operably coupled to at least one fluidics component. The fluidics circuit is operably coupled to the at least one electronic component across the frame.

Abstract: A method for providing a quantum reflection access credentialing (QRAC) system. The method includes receiving a user login. The user login may include a username and password. The user login may be associated with a known user. The system may include a memory for storing information corresponding to light reflected from the face of the user. The method may further include selecting, or receiving a selection of, a light source from among an array of light sources. The method may also include shining light generated by the selected light source on the user's face. The method may also include scanning the user face to capture a reflection of the light generated by the light source. The method may then include confirming that the information stored in the memory corresponds to the reflection of the light generated by the light source. In response to confirming that the information stored in the memory corresponds to the reflection of the light generated by the light source, the method may credential user access.

Abstract: A device for aseptic delivery of biological material from a vial includes a tubular barrel, a filter assembly, and a dispersion assembly. The dispersion assembly is at least partially disposed within the tubular barrel. The dispersion assembly includes a dispersion element, a piston, and a one-way valve. The dispersion element is in fluid communication with the vial to disperse the biological material from the vial. The piston is disposed at the distal end of the dispersion assembly and is in sealing contact with the tubular barrel. The one-way valve forms a fluid passageway in fluid communication with the dispersion element and the tubular barrel. The one-way valve is configured to allow a flow of the dispersed biological material from the dispersion element, through the fluid passageway, and into the tubular barrel, and to prevent a flow of the dispersed biological material from the tubular barrel into the dispersion assembly.

Abstract: The present disclosure provides to encapsulate the distal components of a scope to form a distal cap assembly, which removes the need for adhesives and potting often used in conventional distal cap assemblies. In particular, the present disclosure provides a spline structure configured to hold the distal end components in a predefined arrangement. The spline structure, along with the distal end components, is inserted into a mold and the spline structure along with the distal end components is encapsulated (e.g., in a polymer using hot melt, or the like) to form a distal cap. The distal cap locks the distal end components into the spline structure and protects the distal end components from moisture and relative movement. As a benefit, the present encapsulation techniques and distal cap assembly is faster to manufacture and provides less room for error than conventional methods.

Abstract: A medical device includes an operating member, a hub, and an end effector. The operating member includes an actuation portion. The hub includes a channel receiving the actuation portion of the operating member. The actuation portion of the operating member moves within the channel. The end effector is movable between a closed configuration and an open configuration. Distal extension of the operating member transitions the end effector to the open configuration, and proximal retraction of the operating member transitions the end effector to the closed configuration. The medical device is formed through an additive manufacturing process.

Abstract: An example method for manufacturing an object is disclosed. The example method includes determining the material composition of a base material, wherein determining the material composition of the base material includes determining the relative percentage of a first metal and the relative percentage of a second metal forming the base material. The method further includes selecting a common laser processing wavelength to be used in processing the base material. The method further includes processing the base material with a laser to form a processed material, the laser emits a laser beam matching the common laser processing wavelength during the processing of the base material and the material composition of the processed material is substantially similar to the material composition of the base material.

Abstract: A method of manufacturing an elevator of a medical device comprises using an additive manufacturing method, forming a pivot portion at a proximal end of the elevator. The pivot portion tapers proximally such that a proximalmost end of the elevator is thinner than more distal portions of the pivot portion. The method further comprises using the additive manufacturing method, forming a body of the elevator that is distal to the pivot portion. The elevator body includes a surface configured to contact an instrument inserted in a working channel of the medical device.

Abstract: A method of making a vascular occlusion device may include cutting a tubular member to form an expandable frame including a first hub integrally formed with the expandable frame adjacent a first end of the expandable frame, and a plurality of longitudinally-oriented struts extending in a direction opposite the first end; heat-setting the expandable frame to define an expanded configuration of the expandable frame; sliding a constrainment member over the plurality of longitudinally-oriented struts, the constrainment member being formed using additive manufacturing technology; fixedly securing the constrainment member to the plurality of longitudinally-oriented struts to define a second hub of the expandable frame; and cutting the plurality of longitudinally-oriented struts adjacent the constrainment member and opposite the first end relative to the constrainment member.

Abstract: A device for aseptic delivery of biological material from a vial includes a tubular barrel, a filter assembly, and a dispersion assembly. The dispersion assembly is at least partially disposed within the tubular barrel. The dispersion assembly includes a dispersion element, a piston, and a one-way valve. The dispersion element is in fluid communication with the vial to disperse the biological material from the vial. The piston is disposed at the distal end of the dispersion assembly and is in sealing contact with the tubular barrel. The one-way valve forms a fluid passageway in fluid communication with the dispersion element and the tubular barrel. The one-way valve is configured to allow a flow of the dispersed biological material from the dispersion element, through the fluid passageway, and into the tubular barrel, and to prevent a flow of the dispersed biological material from the tubular barrel into the dispersion assembly.

Abstract: A method of making a vascular occlusion device may include cutting a tubular member to form an expandable frame including a first hub integrally formed with the expandable frame adjacent a first end of the expandable frame, and a plurality of longitudinally-oriented struts extending in a direction opposite the first end; heat-setting the expandable frame to define an expanded configuration of the expandable frame; sliding a constrainment member over the plurality of longitudinally-oriented struts, the constrainment member being formed using additive manufacturing technology; fixedly securing the constrainment member to the plurality of longitudinally-oriented struts to define a second hub of the expandable frame; and cutting the plurality of longitudinally-oriented struts adjacent the constrainment member and opposite the first end relative to the constrainment member.

Abstract: A method of making a semiconductor device includes disposing a mask on a substrate; etching the mask to form an opening in the mask; etching a trench in the substrate beneath the opening in the mask; and implanting a dopant in an area of the substrate beneath the opening of the mask, the dopant capable of gettering mobile ions that can contaminate the substrate; wherein the dopant extends through the substrate from a sidewall of the trench and an endwall of the trench.

Abstract: A method of making a semiconductor device includes disposing a mask on a substrate; etching the mask to form an opening in the mask; etching a trench in the substrate beneath the opening in the mask; and implanting a dopant in an area of the substrate beneath the opening of the mask, the dopant capable of gettering mobile ions that can contaminate the substrate; wherein the dopant extends through the substrate from a sidewall of the trench and an endwall of the trench.

Abstract: A method of implementing three-dimensional (3D) integration of multiple integrated circuit (IC) devices includes forming a first insulating layer over a first IC device; forming a second insulating layer over a second IC device; forming a 3D, bonded IC device by aligning and bonding the first insulating layer to the second insulating layer so as to define a bonding interface therebetween, defining a first set of vias within the 3D bonded IC device, the first set of vias landing on conductive pads located within the first IC device, and defining a second set of vias within the 3D bonded IC device, the second set of vias landing on conductive pads located within the second device, such that the second set of vias passes through the bonding interface; and filling the first and second sets of vias with a conductive material.

Abstract: A computer readable medium is provided that is encoded with a program comprising instructions for performing a method for fabricating a 3D integrated circuit structure. Provided are an interface wafer including a first wiring layer and through-silicon vias, and a first active circuitry layer wafer including active circuitry. The first active circuitry layer wafer is bonded to the interface wafer. Then, a first portion of the first active circuitry layer wafer is removed such that a second portion remains attached to the interface wafer. A stack structure including the interface wafer and the second portion of the first active circuitry layer wafer is bonded to a base wafer. Next, the interface wafer is thinned so as to form an interface layer, and metallizations coupled through the through-silicon vias in the interface layer to the first wiring layer are formed on the interface layer.

Abstract: A computer readable medium is provided that is encoded with a program comprising instructions for performing a method for fabricating a 3D integrated circuit structure. Provided are an interface wafer including a first wiring layer and through-silicon vias, and a first active circuitry layer wafer including active circuitry. The first active circuitry layer wafer is bonded to the interface wafer. Then, a first portion of the first active circuitry layer wafer is removed such that a second portion remains attached to the interface wafer. A stack structure including the interface wafer and the second portion of the first active circuitry layer wafer is bonded to a base wafer. Next, the interface wafer is thinned so as to form an interface layer, and metallizations coupled through the through-silicon vias in the interface layer to the first wiring layer are formed on the interface layer.

Abstract: A method of forming a deep trench capacitor includes providing a wafer. Devices are formed on a front side of the wafer. A through-silicon-via is formed on a substrate of the wafer. Deep trenches are formed on a back side of the wafer. A deep trench capacitor is formed in the deep trench. The through-silicon-via connects the deep trench capacitor to the devices.