Abstract: A swage anvil includes a coupling portion that, when mated with a corresponding die of a swaging device, allows lateral positioning of the swage anvil (i.e., substantially parallel to a long axis of the saw blade) relative to the long axis of the saw blade. The swage anvil also includes a tooth contact face that substantially mirrors an angle of the back portion of each tooth of the saw blade. As such, after a manufacturer inserts the swage anvil into the swage device and laterally translates the swage anvil, the tooth contact face abuts the back portion of the saw blade tooth to support the tooth during a swaging procedure. With the aforementioned configuration of the swage anvil, translation of the swage anvil along a single axis provides support to the back portion of the saw blade tooth along two axes. As such, use of the swage anvil decreases the set-up time required in conventional swaging devices.

Abstract: A hand-operated swage device includes a first hand-operated actuator and a second hand operated actuator that, when actuated together, control the sequential operation of a clamping mechanism and a swaging mechanism of the hand-operated swage device. For example, the first actuator of the swage device is disposed on a first handle while the second actuator is disposed on a second handle of the swage device. To operate the hand-operated swage device, an operator grasps the first handle with one hand and grasps the second handle with his other hand to actuate both of the actuators in a substantially simultaneous manner. Actuation of both actuators controls sequential delivery of pressurized air to a first pneumatic device mechanically coupled to the clamping mechanism and to a second pneumatic device mechanically coupled to the swaging mechanism.

Abstract: Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.

Abstract: Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.

Abstract: An LCD can include a Compact Collimating Reflector (CCR), is configured to be located downstream in a light path from an LCD light source, where the CCR is configured to reflect light from the LCD light source to provide collimated light downstream from the CCR. A light diffusion film is located downstream from the CCR and is configured to receive the collimated light from the CCR. An LCD panel is located downstream from the CCR.

Abstract: Electromagnetic Interference (EMI) shields for a direct-view display having a direct-view display panel and an outer panel that provides an outer surface for the direct-view display. These EMI shields include a conductive mesh having an array of gaps therein. The conductive mesh is configured to shield at least some of the EMI that is emitted by the direct-view display panel. An optical redirecting structure is also included, that is configured to redirect at least some optical radiation that is emitted from the direct-view display panel that would strike the conductive mesh, through the gaps in the conductive mesh. The EMI shield is configured to mount between the direct-view display panel and the outer panel such that the optical redirecting structure is adjacent the direct-view display panel and the conductive mesh is remote from the direct-view display panel.

Abstract: Microlens sheets include a first array of anamorphic micolenses on a face of a substrate. The microlenses in the first array are defined by a first parametric model along a direction of the first array. A second array of anamorphic micolenses is also provided on the face of the substrate, and interspersed with the first array. The microlenses in the second array are defined by a second parametric model that is different from the first parametric model, along the direction of the first array.

Abstract: A pulsed laser beam is used to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof. The pulsed laser beam is focused in a vacuum spatial filter. A profile of the pulsed laser beam that emerges from the vacuum spatial filter is converted to a top hat profile. The laser beam having the top hat profile is diffused. Finally, the pulsed laser beam having the top half profile that has been diffused is impinged through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate. Related apparatus for creating the apertures and microlens array products are also described.

Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.

Abstract: Projection screens include a substrate, a reflective layer on the substrate and a refractive layer on the substrate. The reflective layer includes reflective microstructures of about 5 ?m to about 500 ?m in size, and arranged in a first pattern to reflect light at a first spatial frequency. The refractive layer includes refractive microstructures of about 5 ?m to about 500 ?m in size, and arranged in a second pattern that is different from the first pattern, to refract light at a second spatial frequency that is different than the first spatial frequency. Related fabrication methods also are described.

Abstract: A front-projection screen can include a substrate having first and second opposing sides with an array of optical microstructures on the first side of the substrate and an image reflecting layer on the second side of the substrate opposite the array of optical microstructures. An optically absorbing layer is located between the image reflecting layer and the array of optical microstructures, the optically absorbing layer includes an array of apertures therein exposing portions of the image reflecting layer therethrough.

Abstract: A front projection screen can include a microstructure on an upper surface of a substrate. The microstructure can include a surface that is inclined relative to the upper surface the substrate. A conformal reflective layer that conforms to the surface of the microstructure, can include discrete reflective microscopic objects that are substantially aligned to respective opposing portions of the inclined surface of the microstructure.

Abstract: Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.

Abstract: Optical microstructures, such as microlenses, are fabricated by rotating a cylindrical platform that includes a radiation sensitive layer thereon, about its axis, while simultaneously axially rastering a laser beam across at least a portion of the radiation sensitive layer. The cylindrical platform is also simultaneously translated axially while it is being rotated. The amplitude of the laser beam is continuously varied while rastering. The optical microstructures that are imaged in the radiation sensitive layer can be developed to provide a master for replicating a microlenses.

Abstract: Microlens sheets include a first array of anamorphic micolenses on a face of a substrate. The microlenses in the first array are defined by a first parametric model along a direction of the first array. A second array of anamorphic micolenses is also provided on the face of the substrate, and interspersed with the first array. The microlenses in the second array are defined by a second parametric model that is different from the first parametric model, along the direction of the first array.

Abstract: Methods of forming optoelectronic devices include forming an electrically conductive layer on a first surface of a substrate and forming a mirror backing layer from the electrically conductive layer by forming an endless groove that extends through the electrically conductive layer. A step is then performed to remove a portion of the substrate at a second surface thereof, which extends opposite the first surface. This step exposes a front surface of the mirror backing layer. An optically reflective mirror surface is then formed on the front surface of the mirror backing layer.

Abstract: A magnetic switch includes a substrate having a recess therein. A rotor or rotors are provided on the substrate. The rotor includes a tail portion that overlies the recess, and a head portion that extends on the substrate outside the recess. The rotor may be fabricated from ferromagnetic material, and is configured to rotate the tail in the recess in response to a changed magnetic field. First and second magnetic switch contacts also are provided that are configured to make or break electrical connection between one another in response to rotation of the tail in the recess, in response to the changed magnetic field. Related operation and fabrication methods also are described.

Abstract: A MEMs structure can include a recess in a substrate, the recess having a side wall and a floor. A tail portion of a moveable reflector is on the substrate and extends beyond the side wall of the recess opposite the recess floor and is configured to rotate into the recess. A head portion of the moveable reflector extends on the substrate outside the recess.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.