Abstract: Methods of forming optoelectronic devices include forming an electrically conductive layer on a first surface of a substrate and forming a mirror backing layer from the electrically conductive layer by forming an endless groove that extends through the electrically conductive layer. A step is then performed to remove a portion of the substrate at a second surface thereof, which extends opposite the first surface. This step exposes a front surface of the mirror backing layer. An optically reflective mirror surface is then formed on the front surface of the mirror backing layer.

Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.

Abstract: Integrated optoelectronic devices include a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening. A pop-up mirror is provided in the opening. The mirror has an underside edge that is supported by an upward facing portion of the ledge when the mirror is in a closed position. A hinge is also provided. The hinge mechanically couples the mirror to the substrate so that the mirror can be rotated from the closed position to an open position.

Abstract: Mounting systems for micro-electromechanical system (MEMS) structures are provided including a non-Newtonian fluid having a threshold viscosity that is positioned between a MEMS base member and the MEMS structure so as to position the MEMS structure relative to the base member. A MEMS actuator is coupled to the MEMS structure. The MEMS actuator is positioned to cause movement of the MEMS structure relative to the MEMS base member by generating a force sufficient to exceed the threshold viscosity of the non-Newtonian fluid when the MEMS actuator is actuated. The MEMS structure may be a MEMS mirror positioned for pivotal movement about a bearing member to control tilt of the MEMS mirror.

Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.

Abstract: A MEMs structure can include a recess in a substrate, the recess having a side wall and a floor. A tail portion of a moveable reflector is on the substrate and extends beyond the side wall of the recess opposite the recess floor and is configured to rotate into the recess. A head portion of the moveable reflector extends on the substrate outside the recess.

Abstract: Mounting systems for micro-electromechanical system (MEMS) structures are provided including a non-Newtonian fluid having a threshold viscosity that is positioned between a MEMS base member and the MEMS structure so as to position the MEMS structure relative to the base member. A MEMS actuator is coupled to the MEMS structure. The MEMS actuator is positioned to cause movement of the MEMS structure relative to the MEMS base member by generating a force sufficient to exceed the threshold viscosity of the non-Newtonian fluid when the MEMS actuator is actuated. The MEMS structure may be a MEMS mirror positioned for pivotal movement about a bearing member to control tilt of the MEMS mirror.

Abstract: A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. A sacrificial material is first deposited over the substrate to cover at least a portion of the MEMS structure. An encapsulation material is then deposited over the sacrificial material such that the encapsulation material covers at least a portion of the sacrificial material over the MEMS structure. The sacrificial material is subsequently removed such that the encapsulation material forms a shell spaced apart from and covering the MEMS structure and permits the intended operation of the MEMS structure. Associated MEMS devices fabricated using a method of encapsulating MEMS structures according to embodiments of the present invention are also provided.

Abstract: An apparatus for identifying memory requests originating on remote I/O devices as non-cacheable in a computer system with multiple processors includes a main memory, memory cache, processor, cache coherence directory and cache coherence controller all coupled to a host bridge unit (North bridge). The I/O device transmits requests for data to an I/O bridge unit. The I/O bridge unit forwards the request for data to the host bridge unit and asserts a sideband signal to the host bridge unit if the request is for non-cacheable data. The sideband signal informs the host bridge unit that the memory request is for non-cacheable data and that the cache coherence controller does not need to perform a cache coherence directory lookup. For cacheable data, the cache coherence controller performs a cache coherence directory lookup to maintain the coherence of data stored in a plurality of processor caches in the computer system.

Abstract: Microelectronic interconnections are fabricated by forming a via in a first face of a microelectronic substrate that extends only partially through the microelectronic substrate towards a second face thereof. The via includes a sidewall and a floor. An insulating layer is formed on the sidewall. A plating electrode is formed on the second face. Metal is electroplated in the via from the floor by passing plating current between the plating electrode and the floor through the microelectronic substrate therebetween. The substrate then is thinned at the second face to expose the metal that was electroplated. Electroplated metal through-substrate interconnections thereby may be fabricated.

Abstract: Multiple microelectromechanical (MEM) device substrates, such as MEM mirror substrates, are tiled on a base substrate. Each MEM device substrate can include one or more MEM devices such as mirrors. By including one or a relatively small number of devices on a MEM device substrate, the MEM device substrate can be manufactured with relatively high yield and can be tested prior to tiling onto the base substrate. The separate MEM device substrates and base substrate can also reduce crosstalk and/or other signal interference which could degrade MEM device operation. Solder bumps and/or other mounting techniques may be used to mount the MEM device substrates onto the base substrate.

Abstract: An apparatus for identifying memory requests originating on remote I/O devices as non-cacheable in a computer system with multiple processors includes a main memory, memory cache, processor, cache coherence directory and cache coherence controller all coupled to a host bridge unit (North bridge). The I/O device transmits requests for data to an I/O bridge unit. The I/0 bridge unit forwards the request for data to the host bridge unit and asserts a sideband signal to the host bridge unit if the request is for non-cacheable data. The sideband signal informs the host bridge unit that the memory request is for non-cacheable data and that the cache coherence controller does not need to perform a cache coherence directory lookup. For cacheable data, the cache coherence controller performs a cache coherence directory lookup to maintain the coherence of data stored in a plurality of processor caches in the computer system.

Abstract: A microelectromechanical device comprises first and second beam members that have respective first ends connected to anchors, and that are also connected together. The first and second beam members are connected to a dielectric tether by a first tether anchor. The microelectromechanical device further comprises a third beam member that has a first end that is connected to an anchor and that is connected to the dielectric tether by a second tether anchor. At least one of the first and the second beam members are configured to elongate when the first and/or the second beam member is heated to a temperature that is greater than a temperature of the third beam member.

Abstract: A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Abstract: A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate.

Abstract: A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Abstract: Lockable microelectromechanical actuators include a microelectromechanical actuator, a thermoplastic material that is coupled to the microelectromechanical actuator to lock the microelectromechanical actuator, and a heater that melts the thermoplastic material to allow movement of the microelectromechanical actuator. When the thermoplastic material solidifies, movement of the microelectromechanical actuator can be locked, without the need to maintain power, in the form of electrical, magnetic and/or electrostatic energy, to the microelectromechanical actuator, and without the need to rely on mechanical friction to hold the microelectromechanical actuator in place. Thus, the thermoplastic material can act as a glue to hold structures in a particular position without the need for continuous power application. Moreover, it has been found unexpectedly, that the thermoplastic material can solidify rapidly enough to lock the microelectromechanical actuator at or near its most recent position.

Abstract: In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions.

Abstract: Microelectromechanical actuators include a substrate, spaced apart supports on the substrate and a thermal arched beam that extends between the spaced apart supports and that further arches upon heating thereof, for movement along the substrate. One or more driven arched beams are coupled to the thermal arched beam. The end portions of the driven arched beams move relative to one another to change the arching of the driven arched beams in response to the further arching of the thermal arched beam, for movement of the driven arched beams. A driven arched beam also includes an actuated element at an intermediate portion thereof between the end portions, wherein a respective actuated element is mechanically coupled to the associated driven arched beam for movement therewith, and is mechanically decoupled from the remaining driven arched beams for movement independent thereof.

Abstract: A microelectromechanical device comprises first and second beam members that have respective first ends connected to anchors, and that are also connected together. The first and second beam members are connected to a dielectric tether by a first tether anchor. The microelectromechanical device further comprises a third beam member that has a first end that is connected to an anchor and that is connected to the dielectric tether by a second tether anchor. At least one of the first and the second beam members are configured to elongate when the first and/or the second beam member is heated to a temperature that is greater than a temperature of the third beam member.