Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate with a micro-wire layer having first and second areas. The micro-wire layer includes first and second micro-wire electrodes and first and second connection pads in the first and second areas, respectively. Each micro-wire electrode includes one or more electrically connected micro-wires and is electrically connected to a connection pad. The micro-wires are located in a common step. The first area is separated from the second area and the first area of the substrate and the second area of the micro-wire layer are located between the first micro-wires and the second area of the substrate so that a second layer edge extends at least partly beyond a first layer edge and one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

Abstract: A method of ranking the importance of digital images from a collection of images, including using a processor to operate upon a photo-collage identifying digital images in the image collection to rank the importance of one or more of the digital images based on the photo-collage, and associating the importance ranking of the one or more digital images with the corresponding one or more digital images.

Abstract: A biocidal device includes a biocidal material layer having edges, an exposed side, and an adhesive side opposing the exposed side. A patterned adhesive layer is located in contact with the adhesive side and extends to the edges of the biocidal material layer. The patterned adhesive layer includes a non-biocidal portion and a biocidal portion. The biocidal portion includes biocidal materials and extends to at least one edge. The patterned adhesive layer is adhered to at least a portion of a support and at least a part of the biocidal portion that extends along an edge is exposed.

Abstract: A biocidal article includes a biocidal material layer having edges, an exposed side, and an adhesive side opposing the exposed side. A patterned adhesive layer is located in contact with the adhesive side and extends to the edges of the biocidal material layer. The patterned adhesive layer includes a non-biocidal portion and a biocidal portion. The biocidal portion includes biocidal materials and extends to at least one edge.

Abstract: A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure having a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer. The multi-layer biocidal structure is located on a surface.

Abstract: Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with at least one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used are parts of various electronic devices including touch screen devices.

Abstract: A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.

Abstract: A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Multi-level second micro-channels are imprinted in a curable second layer in contact with the first layer with a multi-level stamp, the second layer is cured, and a curable conductive ink is located and cured in the multi-level second micro-channels to form multi-level second micro-wires. At least one of the multi-level second micro-channels contacts at least one first micro-wire. A multi-level second micro-wire in at least one of the multi-level second micro-channels is in electrical contact with at least one first micro-wire.

Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support. A second layer is located on or over the first curable layer, the second layer having multiple biocidal particles located within the second layer. The first curable layer and the second layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second layer. The first curable layer is cured to form a first cured layer with a second layer. The imprinting stamp is removed.

Abstract: A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition includes a chamber and a moveable substrate having a levitation stabilizing structure located on the moveable substrate that defines an enclosed interior impingement area of the moveable substrate. A stationary support, located in the chamber, supports the moveable substrate. The stationary support extends beyond the enclosed interior impingement area. A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure.

Abstract: An apparatus for depositing a thin film on a substrate using atmospheric pressure atomic-layer deposition includes a chamber having an atmosphere and a moveable substrate. A stationary support is located in the chamber that supports the moveable substrate. A pressurized-fluid source provides a compound fluid flow including an inert fluid surrounding a reactive fluid that flows simultaneously through the stationary support and impinges on at least a portion of the moveable substrate to fluidically levitate the moveable substrate and expose the moveable substrate to the compound fluid flow to deposit a thin film on the moveable substrate.

Abstract: A method for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition provides a chamber including a stationary support, through which fluid flows, that supports a moveable substrate. A moveable substrate includes a levitation stabilizing structure on the substrate that defines an enclosed interior impingement area of the substrate. The moveable substrate is positioned proximate to the stationary support so that the stationary support extends beyond the enclosed interior impingement area and the fluid flow is directed within the enclosed interior impingement area of the moveable substrate.

Abstract: A substrate for fluidic levitation processing includes a moveable substrate and a levitation stabilizing structure located on the moveable substrate. The levitation stabilizing structure defines an enclosed interior impingement area of the moveable substrate that stabilizes lateral displacement of the moveable substrate during fluidic levitation processing.

Abstract: A method for depositing a thin film on a substrate using atmospheric pressure atomic-layer deposition includes providing a chamber having an atmosphere and a stationary support located in the chamber. The moveable substrate is located in a spatial relationship with the stationary support. A pressurized compound fluid flow, including an inert fluid surrounding a reactive fluid, is provided simultaneously through the stationary support that impinges on at least a portion of the moveable substrate to fluidically levitate the moveable substrate and expose the moveable substrate to the compound fluid flow to deposit a thin film on the moveable substrate.

Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support, the first curable layer including dispersed multiple biocidal particles. A second curable layer is located on the first curable layer; the multiple biocidal particles are dispersed within only the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed.

Abstract: A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate with a first stamp, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Second micro-channels are imprinted in a curable second layer in contact with the first layer with a second stamp, the second layer is cured, and a curable conductive ink is located and cured in the second micro-channels to form second micro-wires. At least one of the second micro-channels contacts at least one first micro-wire and a second micro-wire in at least one of the second micro-channels is in electrical contact with at least one first micro-wire.

Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support. A second curable layer is located on the first curable layer, the second curable layer having multiple biocidal particles dispersed within the second curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed.

Abstract: Electrically-conductive articles are prepared to have electrically-conductive metallic grids and electrically-conductive metallic connectors (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive metallic connectors are designed with one metallic main wire that comprises two or more adjacent metallic micro-wires in bundled patterns. These bundled patterns and metallic micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such patterns. The electrically-conductive articles can be prepared using various manufacturing technologies and can be used as parts of various electronic devices including touch screen devices. The electrically-conductive metallic grids and connectors can be prepared and designed using various technologies that are amenable to obtaining very fine lines in predetermined patterns.

Abstract: Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with at least one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used are parts of various electronic devices including touch screen devices.

Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support, the first curable layer including dispersed multiple biocidal particles. A second curable layer is located on the first curable layer; the multiple biocidal particles are dispersed within only the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed.