Patents by Inventor Ronald Steven Cok

Ronald Steven Cok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160212987
    Abstract: A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer including dispersed multiple biocidal particles on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The multiple biocidal particles are dispersed within only the first curable layer. The structured bi-layer has at least one depth greater than the thickness of the second layer. The multi-layer biocidal structure is located on a surface.
    Type: Application
    Filed: January 28, 2015
    Publication date: July 28, 2016
    Inventors: Ronald Steven Cok, Mitchell Stewart Burberry
  • Publication number: 20160212988
    Abstract: A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the first cured layer.
    Type: Application
    Filed: January 28, 2015
    Publication date: July 28, 2016
    Inventors: Mitchell Stewart Burberry, Ronald Steven Cok
  • Patent number: 9374894
    Abstract: A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: June 21, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Ronald Steven Cok, Mitchell Stewart Burberry
  • Patent number: 9358577
    Abstract: A method of making a colored biocidal multi-layer structure includes providing a first layer of a first color and locating a biocidal second layer on or over the first layer. The biocidal second layer has a second color different from the first color.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: June 7, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: John Joseph Scheible, Tomas Gerard Patrick McHugh, Alan Richard Priebe, Ronald Steven Cok
  • Patent number: 9345144
    Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate with a plurality of micro-channels. First and second material compositions are provided. The first material composition is coated over the substrate and micro-channels and then removed from the substrate surface but not the micro-channels. The second material composition is coated over the substrate, in the micro-channels, and over the first materials, and then removed from the substrate surface but not the micro-channels. The first and second material compositions are cured in the micro-channels in a common step to form a cured first material layer and a cured second material layer in the micro-channels. The cured first material layer and the cured second material layer form an electrically conductive multi-layer micro-wire in each micro-channel.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: May 17, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventor: Ronald Steven Cok
  • Publication number: 20160133357
    Abstract: Electrically-conductive articles are prepared to have electrically-conductive metallic grids and electrically-conductive metallic connectors (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive metallic connectors are designed with one metallic main wire that comprises two or more adjacent metallic micro-wires in bundled patterns. These bundled patterns and metallic micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such patterns. The electrically-conductive articles can be prepared using various manufacturing technologies and can be used as parts of various electronic devices including touch screen devices. The electrically-conductive metallic grids and connectors can be prepared and designed using various technologies that are amenable to obtaining very fine lines in predetermined patterns.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 12, 2016
    Inventors: Ronald Steven Cok, James Edward Sutton
  • Publication number: 20160132146
    Abstract: Electrically-conductive articles are prepared to have electrically-conductive metallic grids and electrically-conductive metallic connectors (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive metallic connectors are designed with one metallic main wire that comprises two or more adjacent metallic micro-wires in bundled patterns. These bundled patterns and metallic micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such patterns. The electrically-conductive articles can be prepared using various manufacturing technologies and can be used as parts of various electronic devices including touch screen devices. The electrically-conductive metallic grids and connectors can be prepared and designed using various technologies that are amenable to obtaining very fine lines in predetermined patterns.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 12, 2016
    Inventors: Ronald Steven COK, James Edward SUTTON
  • Patent number: 9336442
    Abstract: A method of making a selected-image collection including providing a set of relationships between an individual and a plurality of different persons, each relationship in the relationship set having a pre-determined relationship weight value; providing a collection of images, the image collection including images having at least two persons of the plurality of different persons present in the images; using a processor to select from the relationship set a relationship weight value corresponding to each person present in each image in the image collection; assigning an image weight value to each image in the image collection, the image weight value corresponding to a combination of the selected relationship weight value(s); and selecting images from the image collection based on the image weight values to make the selected-image collection.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 10, 2016
    Assignee: Intellectual Ventures Fund 83 LLC
    Inventor: Ronald Steven Cok
  • Publication number: 20160121593
    Abstract: A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support, the structured bi-layer including a first cured layer on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second cured layer. The multi-layer biocidal structure is located on a surface.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventor: RONALD STEVEN COK
  • Publication number: 20160121366
    Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support. A second curable layer is located on the first curable layer, the second curable layer having multiple biocidal particles dispersed within the second curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventor: RONALD STEVEN COK
  • Publication number: 20160121594
    Abstract: A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure having a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer. The multi-layer biocidal structure is located on a surface.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Ronald Steven Cok, Mitchell Stewart Burberry
  • Publication number: 20160120178
    Abstract: A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support. A second layer is located on or over the first curable layer, the second layer having multiple biocidal particles located within the second layer. The first curable layer and the second layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second layer. The first curable layer is cured to form a first cured layer with a second layer. The imprinting stamp is removed.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: RONALD STEVEN COK, Mitchell Stewart Burberry
  • Publication number: 20160120174
    Abstract: A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the second cured layer.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventor: RONALD STEVEN COK
  • Publication number: 20160120175
    Abstract: A multi-layer biocidal structure includes a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the second layer.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Ronald Steven Cok, Mitchell Stewart Burberry
  • Publication number: 20160122559
    Abstract: An imprinted multi-layer structure includes a support and a structured bi-layer on or over the support, The structured bi-layer includes a first cured layer having a first cross-linked material on or over the support. A second cured layer has a second material different from the first material on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least a depth greater than the thickness of the second cured layer. The first material is cross-linked to the second material.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Yongcai Wang, John Andrew Lebens, Ronald Steven Cok
  • Publication number: 20160107415
    Abstract: A colored biocidal multi-layer structure includes a first layer of a first color and a biocidal second layer on or over the first layer. The biocidal second layer has a second color different from the first color.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 21, 2016
    Inventors: John Joseph Scheible, Tomas Gerard Patrick McHugh, Alan Richard Priebe, Ronald Steven Cok
  • Publication number: 20160107191
    Abstract: A method of making a colored biocidal multi-layer structure includes providing a first layer of a first color and locating a biocidal second layer on or over the first layer. The biocidal second layer has a second color different from the first color.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 21, 2016
    Inventors: John Joseph Scheible, Tomas Gerard Patrick McHugh, Alan Richard Priebe, Ronald Steven Cok
  • Patent number: 9304636
    Abstract: A touch-screen device is disclosed having a touch-sensitive area that includes a plurality of patterned driver electrodes, each having a plurality of patterned conductive electrically connected driver micro-wires. An unpatterned conductive layer that is unpatterned in the touch-sensitive area is in electrical contact with the driver micro-wires of the driver electrodes. A plurality of patterned sensor electrodes each includes a plurality of patterned conductive electrically connected sensor micro-wires. A dielectric layer is located between the driver electrodes and the sensor electrodes.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: April 5, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Mitchell Stewart Burberry, Ronald Steven Cok, Roger G. Markham
  • Patent number: 9296013
    Abstract: A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface including forming a plurality of micro-channels in the substrate, locating a first electrically conductive material composition forming a first layer in each micro-channel, and locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: March 29, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Todd Mathew Spath, Ronald Steven Cok
  • Patent number: 9288901
    Abstract: A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: March 15, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Roger G. Markham, Ronald Steven Cok, Yongcai Wang, Mitchell Lawrence Wright