Abstract: Ion chromatography apparatus including (a) a chromatographic column, (b) a source of an aqueous eluent liquid stream, (c) a detector, (d) a recycle line between the detector and the chromatographic column, and (e) a purifying device disposed along the recycle line including ion exchange removal medium. Also, such apparatus with an electrolytic purifying device disposed along the recycle line. Also, methods of using such apparatus.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract: An ink cartridge structure includes a resilient device coupled to an ink cartridge for absorbing impact energy acting on the ink cartridge for protection of the ink cartridge. The resilient device includes a connection bar mounted to the ink cartridge and is coupled to a retention bar that is accessible by a user with a resilient element therebetween so that the resilient element provides cushioning to the ink cartridge. The connection bar is partially fit into a hollow portion of the retention bar and forms a vent hole that is in communication with the ink cartridge so that when the retention bar, under the resilient support by the resilient element, is manually moved reciprocally with respect to the connection bar, air is pumped, through the vent hole, into the ink cartridge to force the ink contained in the ink cartridge to ward a writing tip.

Abstract: An electronic circuit package has a thin-film circuit integrated with the ceramic substrate. The thin-film circuit includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active power electronic component mounted on the ceramic substrate and is electrically connected with the integrated thin-film circuit.

Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: A process of physical vapor depositing mirror layer with improved reflectivity is disclosed. A wafer is loaded into a PVD tool comprising a degas chamber, a Ti/TiN sputter deposition chamber, a cooling chamber, and an aluminum sputter deposition chamber. A wafer degas process is first performed within the degas chamber. The wafer is then transferred to the Ti/TiN sputter deposition chamber and deposition sputtering a layer of titanium onto the wafer. The wafer is transferred to the cooling chamber and gas cooling the wafer temperature down to 40-50° C. The wafer is then transferred to the aluminum sputter deposition chamber and deposition sputtering a layer of aluminum onto the wafer at 40-50° C. with a backside gas turned off. The deposited layer of aluminum over the wafer has a reflectivity of about 0.925 at wavelength of around 380 nm.

Abstract: The mechanical pencil contains a tubular body having a bottom cap and a top cap. Inside the mechanical pencil, a tip element is positioned inside and protrudes from the bottom cap, a clamping mechanism is above the tip element with a spring therebetween, and a sliding mechanism is above the clamping mechanism. A single lead is stored in the sliding mechanism and is held by the clamping mechanism. When the lead outside the tip element is used up and the tip element is pressed, the spring is compressed and a segment of the lead is advanced into the tip element. When the tip element is released, the tip element is pushed downward by the spring and the segment of the lead is brought along with the tip element. By repeating the process a number of times, the lead would be extended out of the tip element.

Abstract: Pretreatment method and apparatus to remove matrix ions from a liquid sample, prior to separation of the sample analytes (e.g. by chromatography), by flowing the liquid sample into a sample compartment and stopping the flow. The sample compartment has a wall comprising an ion exchange membrane having exchangeable ions of the same charge as the matrix ions to be removed. A regenerant liquid stream flows through a regenerant flow compartment on the other side of the membrane from said parked liquid sample. Matrix ions in the parked liquid sample are transported across the membrane into the regenerant flow compartment. Suppression may be performed electrolytically and/or chemically. A concentrator column may also be used.

Abstract: A combination pen includes a tubular barrel having two open ends for selectively receiving different stationery devices so that different stationery devices can be combined together with the barrel. The stationery devices received in the barrel can be replaced if desire so that any combination that is desired by a user or that is of practical use can be made with respect to different kinds of stationery devices. The stationary devices can be selectively combined together for saving of space and ease of stowage.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract: Pretreatment method and apparatus to remove matrix ions from a liquid sample, prior to separation of the sample analytes (e.g. by chromatography), by flowing the liquid sample into a sample compartment and stopping the flow. The sample compartment has a wall comprising an ion exchange membrane having exchangeable ions of the same charge as the matrix ions to be removed. A regenerant liquid stream flows through a regenerant flow compartment on the other side of the membrane from said parked liquid sample. Matrix ions in the parked liquid sample are transported across the membrane into the regenerant flow compartment. Suppression may be performed electrolytically and/or chemically. A concentrator column may also be used.

Abstract: Systems and methods for visualizing multiple volumes of three-dimensional data. A graphics card is used for voxel intermixing, pixel intermixing and image intermixing, which produces a final-combined image of the three-dimensional data in real time.

Abstract: A method for dynamic channel allocation for access points in wireless networks. Communication information of wireless devices is gathered. A network topology formed by the wireless devices is derived according to the communication information. Switch channel indexes for each wireless device are calculated according to the communication information and network topology. Desired wireless devices for switching channels are determined according to the switch channel indexes.

Abstract: A computer-based method for testing an input/output functional board is provided. The method includes the steps of: obtaining control information of the computer; testing devices coupled with the input/output functional board by using the control information; and determining whether the devices work normally according to test results. A related system is also disclosed.

Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.