Abstract: The subject matter disclosed herein relates to methods to reduce warpage of a substrate.

Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

Abstract: The subject matter disclosed herein relates to methods to reduce warpage of a substrate.

Abstract: The present invention relates to a tray used in an optical disc drive. At least two aligning means arranged in the tray for marking an aligning line at a front side and a back side of the tray, respectively. The aligning line is used for determining the dimensional accuracy of each component located on the front side and back side of the tray, respectively.

Abstract: A wireless sensor network and data sensing method thereof are provided. A prediction model is established according to sensed data. When statistical value of the sensed data is within a user allowable range, the average value of the sensed data is returned to a user based on the prediction model. Alternatively, when the statistical value of the sensed data is beyond the user allowable range, actually sensed data is returned to the user based on the prediction model. In addition, the prediction model may further be dynamically updated according to subsequently received sensed data.

Abstract: The present invention relates to a probe for determining an electrical property of an area of a surface of a test sample, the probe is intended to be in a specific orientation relative to the test sample. The probe may comprise a supporting body defining a first surface. A plurality of cantilever arms (12) may extend from the supporting body in co-planar relationship with the first surface. The plurality of cantilever arms (12) may extend substantially parallel to each other and each of the plurality of cantilever arms (12) may include an electrical conductive tip for contacting the area of the test sample by movement of the probe relative to the surface of the test sample into the specific orientation. The probe may further comprise a contact detector (14) extending from the supporting body arranged so as to contact the surface of the test sample prior to any one of the plurality of cantilever arms (12) contacting the surface of the test sample when performing the movement.

Abstract: An IC system including sample preparation. The system includes a liquid sample injection loop, an ion concentrator, an ion separator, and only a single pump for pumping fluid through the system.

Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

Abstract: An IC system including sample preparation. The system includes a liquid sample injection loop, an ion concentrator, an ion separator, and only a single pump for pumping fluid through the system.

Abstract: A flip electronic device includes a cover, a display module, a casing, a circuit board, and an electrical connection element. The casing is pivotally connected with the cover. The cover has a light-transparent portion. The display module is disposed at the cover. The circuit board is disposed in the casing. The electrical connection element is electrically connected with the display module and the circuit board. At least one portion of the electrical connection element is viewable through the light-transparent portion.

Abstract: An electronic apparatus with a power indication function is connected to an adapter. The electronic apparatus includes a host, a power jack, a rechargeable battery, a power indication element and a controller. The power jack is disposed on the host for connecting with the adapter. The rechargeable battery is disposed in the host and is electrically connected to the power jack. The power indication element has a switch disposed adjacent to the power jack and a power indicator disposed in the host. The controller is electrically connected to the rechargeable battery, the switch and the power indicator. When the switch turns on, the controller detects the remained power in the rechargeable battery and the remained power is indicated by the power indicator.

Abstract: A button assembly is applied to a portable electronic device having a casing. The casing has an opening. The button assembly includes a button and a circuit board. The button is disposed at the opening and has a button body and a cloth-material layer. The cloth-material layer covers at least one portion of the button body and is exposed to a surface of the casing. The circuit board is disposed in the casing. The circuit board has a switch corresponding to the button body. A portable electronic device having the button assembly is also disclosed.

Abstract: A portable electronic device includes a casing, a covering layer, and a key. The casing has an opening. The covering layer covers at least one portion of the casing and covers the opening. The key is disposed at the opening and at least one portion of the key is embedded into the opening of the casing to allow one portion of the covering layer to be sandwiched between the key and the casing.

Abstract: A casing includes a main body and a covering layer. The main body has a first transparent area and a second transparent area disposed as mirror images. Light passes through the first transparent area and the second transparent area. The covering layer covers the second transparent area and has a transmittance gradient. A method for manufacturing the casing and an electronic device having the casing are also disclosed.

Abstract: A portable electronic device includes a casing, a key, a loudspeaker, a soft insulating material, and an actuating unit. The key is disposed at the casing. The loudspeaker is embedded into the casing flatly. The soft insulating material covers the casing and the loudspeaker. The actuating unit is coupled to the key and the loudspeaker, and it actuates the loudspeaker to protrude from the casing in response to an actuation of the key.

Abstract: Au automatic pencil comprising an outer pencil tube, a pencil head, a clipping device, a guiding tube and a pencil lead cylinder, characterized in that a resilient element is mounted between the guiding tube and the clipping device allowing the guiding tube to reciprocate upward and downward within the stopper. The resilient element urges the guiding tube to rise upward if the pencil lead cylinder is not depressed, and to keep a distance from the pencil lead, and to allow another pencil lead to be inserted. The pencil lead cylinder can adapt a plurality of pencil lead.

Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

Abstract: Systems and methods for imaging a 3D volume of geometrically irregular grid data. The systems and methods utilize various types of probes and displays to render the geometrically irregular grid data, in real-time, and analyze the geometrically irregular grid data.

Abstract: Au automatic pencil comprising an outer pencil tube, a pencil head, a clipping device, a guiding tube and a pencil lead cylinder, characterized in that a resilient element is mounted between the guiding tube and the clipping device allowing the guiding tube to reciprocate upward and downward within the stopper. The resilient element urges the guiding tube to rise upward if the pencil lead cylinder is not depressed, and to keep a distance from the pencil lead, and to allow another pencil lead to be inserted. The pencil lead cylinder can adapt a plurality of pencil lead.

Abstract: The present invention relates to a tray used in an optical disc drive. At least two aligning means arranged in the tray for marking an aligning line at a front side and a back side of the tray, respectively. The aligning line is used determining the dimensional accuracy of each component located on the front side and back side of the tray, respectively.