Abstract: An electrolytic device includes four channels separated by three charged barriers. The device can be used to suppress an eluent stream containing separated sample analyte ions and/or to pretreat a sample stream containing unseparated analyte ions.

Abstract: An apparatus for detecting analytes in a liquid sample may include an elongated primary channel through which an ionic species flows, the primary channel extending through a primary channel member, a first regenerant channel through which a regenerant flows, the first regenerant channel extending adjacent to the primary channel and being formed in a first block, a first charged barrier having exchangeable ions capable of passing ions of only one charge, positive or negative, and of blocking bulk liquid flow, the first charged barrier disposed between the primary channel member and the first block for separating the primary channel from the first regenerant channel, and a first sealing member disposed between the first charged barrier and the first block defining the first regenerant channel.

Abstract: A packaged chip, including a package structure, a redistribution structure, and a carrier, where the package structure includes a first chip and a second chip adjacent to the first chip. The redistribution structure is configured to electrically connect the first chip and the carrier, and is configured to electrically connect the second chip and the carrier. The redistribution structure includes a main body made of an insulating material and a bump solder array welded to a lower surface of the main body. A metal redistribution wire group and a metal interconnection wire group that has a curve or bend design are disposed in the main body. An upper surface of the main body of the redistribution structure adheres to a lower surface of the first chip and a lower surface of the second chip. The redistribution structure is welded to an upper surface of the carrier.

Abstract: An apparatus includes a circuit device, a heat sink fin, and a thermal interface material layer. The thermal interface material layer is thermally coupled to the circuit device and the heat sink fin. The thermal interface material layer includes a first alloy layer, a nanometal particle layer, and a second alloy layer. The first alloy layer is thermally coupled to the circuit device. The nanometal particle layer is thermally coupled to the first alloy layer. The nanometal particle layer includes nanometal particles and an intermediate mixture.

Abstract: An anti-counterfeit bottle cap, having a body (10) and a safety ring bell (20), and a slit (30) in between; an anti-theft mechanism (40) is provided within the slit (30); the anti-theft mechanism (40) has upper rods (41), lower rods (43) and a tear ring (42) in between; upper ends of the upper rods (41) are connected to the body (10), lower ends of which are connected to the tear ring (42): upper ends of the lower rods (43) are connected with the tear ring (42), lower ends of which are connected with the safety ring belt (20). The tear ring is subject to irreversible plastic deformation after the body (10) disengages from the bottle mouth. Therefore, the tear ring (42) cannot be restored, The torn and broken upper rods (41), lower rods (43) or tear ring (42) cannot be glued back to its/their original position(s).

Abstract: An anti-theft bottle cap having a lower cap (1), an upper cap (2), and an anti-theft mechanism (3) provided therebetween; an opening (5) in communication with an interior of a container (6) is provided on the lower cap (1); the bottle cap also has a flip plate (21) which prevents prying of the anti-theft mechanism (3); the flip plate (21) is a grabbing part which is grabbed to facilitate opening of the upper cap when it is necessary to pour liquid oil out of the bottle. Since the flip plate (21) partially blocks the anti-theft mechanism, the anti-theft mechanism can be prevented from being pried undamaged, thereby achieving better anti-theft effect.

Abstract: An electrolytic device includes four channels separated by three charged barriers. The device can be used to suppress an eluent stream containing separated sample analyte ions and/or to pretreat a sample stream containing unseparated analyte ions.

Abstract: A sandwich suppressor in an ion chromatography system in which loosely packed ion exchange resin of low density is disposed in the central sample stream flow channel. Also, a method of using the suppressor is described.

Abstract: Treatment of multiple myeloma with a combination of panobinostat and bortezomib at specified doses adjusted for safety.

Abstract: The present embodiments provides a chip, including a carrier, a redistribution structure, and multiple packaging function modules, where the multiple packaging function modules each have at least a part wrapped by a colloid, and are fastened to the redistribution structure side by side; the redistribution structure is fastened to the carrier, and the redistribution structure includes one or more redistribution metal layers; the redistribution metal layer communicatively connects the multiple packaging function modules and the carrier. The redistribution structure further includes one or more interconnect metal layers, and the interconnect metal layer is communicatively connected to at least two packaging function modules so as to provide a signal path between the at least two packaging function modules. In the chip, two packaging function modules are placed on the carrier side by side, and a signal path is established between the two packaging function modules by using the redistribution structure.

Abstract: Various communication systems may benefit from mechanisms for transferring control over or communication with terminal devices. For example, certain wireless communication systems may benefit from a handover mechanism with pre-scheduling consecutive grants and pre calculated timing advance. A method can include receiving pre-scheduled uplink grants in a plurality of sub-frames for an incoming user equipment without random access channel The method can also include receiving a timing advance value or performing timing advance calculation for the incoming user equipment without random access channel The method can further include sending a plurality of duplicate messages within the plurality of sub-frames based on the received timing advance value or calculated timing advance.

Abstract: The present invention provides a pipe straightener, which consists of three roller wheel units and a restraining sleeve, wherein each of the roller wheel units is juxtaposed, and the roller wheel units enclose and are configured to form a long straight-formed passageway. The passageway is used to enable metal pipes to pass therethrough. The restraining sleeve encloses and covers each of the roller wheel units, thereby restraining each of the roller wheel units. Each of the roller wheel units is mainly structured from a wheel carrier and a plurality of roller wheels. One side of the wheel carrier is a first side, and the other side is a second side. The first side is adjacent to the passageway, and the second side is adjacent to the restraining sleeve.

Abstract: An expandable package filler or ornament includes a stack of sheets, such as tissue paper, foil, etc. The stack is bound together, such as by a fastener. A generally spiral cut extends from a peripheral edge of the stack toward the center of the each sheet. The cut forms each sheet into a generally spiral strip ending in a peninsula portion. Grasping the peninsula portion, lifting and shaking the stack causes the strips to fall and entangle with each other. The resulting structure is decorative and may be used to stuff a gift box, bag or basket.

Abstract: The present invention provides a compound of formula (I) or the salt thereof: wherein R is at least one selected from the group consisting of unsubstituted C1-4 alkyl, C1-4 alkyl substituted by C6-18 aryl or —OR1, and —C(?O)Z. The compound is a type-S protein kinase inhibitor, which binds to an ATP-binding site and a substrate-recognition site of a protein kinase simultaneously. The present invention further provides a pharmaceutical composition, which includes a compound of formula (I) or a salt and a pharmaceutically acceptable carrier thereof. The present invention further provides a use of a compound of formula (I) or a salt thereof, which is for the manufacture of a protein kinase inhibitor as a drug.

Abstract: A transportation system between dispatchers and individual recipients includes a first transport-requirement device, a second transport-requirement device, a transport-execution device, and a data processing server. The first transport-requirement device and the second transport-requirement device respectively provides first plan information and second plan information, such information comprising start-locations of a first and a second plan, a destination-locations of the first and the second plan, and start-times of the first and the second plan. The transport-execution device provides driver information and driver confirmation of readiness. The data processing server provides carpool plans to the transport-execution device according to the driver locations. The data processing server obtains end-time of the first and the second plan according to the first and the second plan information, and generates carpool plans according to the relationship between first and the second plan information.

Abstract: The disclosure introduces a method and a system of searching and collating video files, a method for establishing a semantic group, and a program storage medium therefor. In the method of searching and collating video files, program information in an electronic program guide (EPG) may be used for searching matching candidate video files, and titles of the candidate video files are reformatted or amended for selection. Some of the candidate video files are integrated to be a complete program, and these candidate video files may be grouped into a channel set for users to watch.

Abstract: A semiconductor package structure includes a first semiconductor substrate, a second semiconductor substrate, a semiconductor die electrically connected to the first semiconductor substrate, an interconnection element and an encapsulant. The first semiconductor substrate includes a first top pad, and the second semiconductor substrate includes a second bottom pad. The interconnection element connects the second bottom pad and the first top pad. The interconnection element includes a first cupped portion and a second arcuate portion, where the first portion is connected to the first top pad and the second portion is connected to the second bottom pad. The first portion and the second portion together define the interconnection element as a monolithic component. The encapsulant is disposed between the first semiconductor substrate and the second semiconductor substrate, and covers the semiconductor die and the interconnection element.

Abstract: An electrolytic device comprising: a central sample flow channel, first and second regenerant flow channels, first and second charged barriers disposed between said sample flow channel and first and second regenerant flow channels, and pairs of oppositely charged, spaced electrodes disposed in the regenerant flow channels. Also, electrolytic devices with a different electrode configuration are described. Also, methods of using the devices, e.g., for suppression in an ion chromatography system are described.

Abstract: Disclosed is a composition including: an isolated in vitro pre-conditioned population of adult bone marrow derived mesenchymal stem cells (BMSCs), wherein the BMSCs express neuronal markers, and wherein the neuronal markers are PGP9.5, NSE, Tuj1, HuC/D and neuronal nitric oxide synthase (nNOS). Methods of preparing the BMSCs are also provided. In addition, the present disclosure is directed to a method of treating an enteric nervous system-related disorder including: administering to a subject in need thereof a pharmaceutical composition including the in vitro pre-conditioned BMSC population and a pharmaceutically acceptable carrier.

Abstract: A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.