Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.

Abstract: The present disclosure provides a scalable power distribution system including a power distribution device, the power distribution includes a plurality of input modules and a plurality of output modules. The input module includes a connector for receiving the input power. The output module has a plurality of output ports. The output module receives the input power of the connector of the corresponding input module, or receives the input power of the connector of the input module neighboring to the corresponding input module. The input module receives the plural types of input power, and the power distribution system selectively receives one or more times of the input power through one or more of the plurality of input modules to provide one or more times of the output power to one or more of the plurality of output ports.

Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

Abstract: The present disclosure provides nectin-4 antibodies and oligonucleotide conjugates thereof. Also provided are related methods of preparation thereof and methods of use thereof, including therapeutic uses.

Abstract: An inspection method for an out-of-order execution processing circuit, includes determining that a refill request is not sent by a data cache unit of the out-of-order execution processing circuit before an exception commitment triggered by a permission check failure of the out-of-order execution processing circuit; and determining a key data is not read by a load-store unit of the out-of-order execution processing circuit and the key data is not utilized by a calculation unit of the out-of-order execution processing circuit before the exception commitment triggered by the permission check failure of the out-of-order execution processing circuit.

Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

Abstract: A semiconductor device including a first active region having a first active configuration, a second active region having a second, and different, active configuration, and a transition cell arranged between the first and second active regions in which the transition cell has a transitional configuration that is different from and compatible with both the first active configuration and the second active configuration.

Abstract: A semiconductor device including a first active region having a first active configuration, a second active region having a second, and different, active configuration, and a transition cell arranged between the first and second active regions in which the transition cell has a transitional configuration that is different from and compatible with both the first active configuration and the second active configuration.

Abstract: A manufacturing method of a circuit board structure includes the following steps. A first sub-circuit board having an upper surface and a lower surface opposite to each other and including at least one conductive through hole is provided. A second sub-circuit board including at least one conductive through hole is provided on the upper surface of the first sub-circuit board. A third sub-circuit board including at least one conductive through hole is provided on the lower surface of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are laminated so that at least two of their conductive through holes are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.

Abstract: A method for manufacturing a shoe article is disclosed. The method includes a material preparing step, a heat pressing step, a cooling step, and a separating step. The material preparing step includes providing a frame, filling particles of a foam material in the cavities, and providing a shoe-shaped knitted object. The frame has an upper supporting face. The upper supporting face includes at least two concave area with a plurality of cavities. The shoe-shaped knitted object includes a shoe bottom face. The heat pressing step includes simultaneously heating the particles of the foam material to become a semi-solid state foam material, and applying a force to make the shoe bottom face contact with at least a portion of the foam material. The cooling step includes solidifying the semi-solid state foam material to form at least two foam structures connected with the shoe bottom face in positions corresponding to the cavities, wherein the foam structure includes a foam layer and a plurality of foam protrusions.

Abstract: An automatic shoe-making device includes a bottom mold unit having a shoe last, two side mold units driven to combine with or separate from each other, a pressing mold unit driven to be movable relative to the bottom mold unit, a feeding unit configured to feed a sole material into a mold cavity in a supercritical fluid state, and a control unit configured to: control the two side mold units to form a combined configuration, so the two side mold units surround the shoe last to form the mold cavity for receiving the sole material, control the pressing mold unit to hot-press the sole material to form a shoe product or a shoe component, and control the pressing mold unit and the two side mold units to move away from the bottom mold unit to allow the shoe product or the shoe component to be removed from the shoe last.

Abstract: An automatic shoe-making device includes a bottom mold unit having a shoe last for selectively receiving an upper, two side mold units driven to combine with or separate from each other, a pressing mold unit driven to be movable relative to the bottom mold unit, and a control unit configured to: control the two side mold units to move toward the bottom mold unit to form a combined configuration, so the two side mold units surround the shoe last to form a mold cavity for receiving a sole material, control the pressing mold unit to hot-press the sole material to form a shoe product or a shoe component, and control the pressing mold unit and the two side mold units to move away from the bottom mold unit to allow the shoe product or the shoe component to be removed from the shoe last.

Abstract: A method for manufacturing a shoe article is disclosed. The method includes a material preparing step, a heat pressing step, a cooling step, and a separating step. The material preparing step includes providing a shoe-shaped knitted object having a shoe bottom face, providing a frame having a plurality of middle frame holes, and filling particles of a foam material in the middle frame holes. The heat pressing step includes simultaneously heating the particles of the foam material to become a semi-solid state foam material, and applying a force to make the foam material substantially apply pressure onto the shoe bottom face. The cooling step includes solidifying the semi-solid state foam material to form a plurality of foam structures connected with the shoe bottom face in positions corresponding to the cavities. The separating step includes making the foam structures and the shoe-shaped knitted object separate from the frame together.

Abstract: A fuel cell system bipolar plate formed of a graphite metal composite. The bipolar plate is formed of a metal foil formed of tantalum or a metal having a tantalum coating. Flexible graphite deposited in rows on each surface of the metal foil forms channels of the bipolar plate and providing a flow field. The graphite metal composite provides flexural strength as well as resistance to corrosion.

Abstract: A method is disclosed including: generating, based on design information for an integrated circuit, a circuit design that includes an initial power delivery network (PDN) for the integrated circuit; performing a pre-layout simulation to the circuit design that includes the initial power delivery network, to determine whether the circuit design meets a predetermined specification; generating a circuit layout of the integrated circuit when the circuit design meets the predetermined specification; modifying a pillar density of the initial power delivery network repeatedly when the circuit design does not meet the predetermined specification until the circuit design meets the predetermined specification to generate a circuit layout of the integrated circuit; and performing a post-layout simulation to the circuit layout.

Abstract: A computing in memory accelerator for applying to a neural network includes a memory, a data buffer unit, a pooling unit, a loss computing unit, a first macro circuit, a second macro unit, a third macro unit, and a multiplexer. The memory is used for saving data. The data buffer unit is coupled to the memory and used to buffer data outputted from the memory. The pooling unit is coupled to the memory and used to pool data for acquiring a maximum pooling value. The loss computing unit is coupled to the memory and used to compute output loss. The first macro circuit, the second macro unit, and the third macro unit are coupled to the data buffer unit. The multiplexer is coupled to the pooling unit, the first macro circuit, the second macro unit, and the third macro unit and used to generate output data.

Abstract: A memory chip includes a memory cell circuit, a periphery circuit, an interconnect structure, and a control logic circuit. The periphery circuit is positioned under the memory cell circuit and electrically connected to the memory cell circuit. The interconnect structure is positioned on a side surface of the memory cell circuit. The control logic circuit is positioned under the interconnect structure. The control logic circuit is electrically connected to the interconnect structure and the periphery circuit and includes a dynamic random-access memory.