Abstract: A headrest device includes a headrest support and an adjusting seat. The headrest support is a flat rod and has a ditch and a bias rack beside the ditch. The adjusting seat is being inserted by the headrest support and has a pressing member and a buffer assembly. The pressing member is elastically pivotedly connected into a side of the adjusting seat. Part of the pressing member protrudes from the adjusting seat. The pressing member has hooking teeth corresponding to the bias rack in biasing direction and an elastic arm pressed by the adjusting seat so as to make the pressing member normally elastically outward pushed and swayable. The hooking teeth engages with the bias rack.

Abstract: The present invention relates to bispecific antibodies that specific bind to BCMA (B-Cell Maturation Antigen) and CD3 (Cluster of Differentiation 3). Method of making the bispecific antibodies and method of using the bispecific antibodies for the treatment of multiple myeloma are also provided.

Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

Abstract: A display panel and a pixel circuit of the display panel are provided. The pixel circuit includes a driving transistor and a light-emitting time length modulator. The driving transistor has a control terminal receiving a pulse width control signal and an amplitude control signal, and the driving transistor generates a driving signal. In a first time period, the light-emitting time length modulator modulates a time length of a plurality of second time periods for providing the driving signal to a light-emitting device according to a light-emitting time control signal.

Abstract: A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ? of the first distance.

Abstract: An apparatus for controlling wafer uniformity is disclosed. In one example, the apparatus includes: a plurality of temperature control elements and a processor. Each of the temperature control elements corresponds to a different portion of a wafer respectively such that the temperature control elements correspond to different portions of the wafer. Each of the temperature control elements is configured to individually control temperature of a corresponding portion of the wafer. The processor determines at least one portion of the wafer for temperature uniformity control, and instruct at least one of the temperature control elements, corresponding to the at least one portion, to adjust temperature of the at least one portion for controlling temperature uniformity of the wafer.

Abstract: A display system includes a first display device having an active display region having individually controllable pixels, a sensor to generate information that is useful for determining a position of the first display device relative to a second display device, and a display controller to determine the position of the first display device relative to the second display device based on the information generated by the sensor. The display controller determines an image to be shown on the first display device based on the position of the first display device relative to the second display device.

Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

Abstract: A method including the operations of receiving a preliminary device layout including a plurality of active areas, analyzing the preliminary device layout to identify empty areas between the plurality of active areas, determining the configurations of the active areas bordering the empty areas, selecting a transition cell from a transition cell library in which the transition cell has a transitional configuration for reducing density gradient effects in the active areas adjacent the transition cell, and inserting the transition cells into the empty areas to define a modified device layout.

Abstract: A display system includes a first display device having an active display region having individually controllable pixels, a sensor to generate information that is useful for determining a position of the first display device relative to a second display device, and a display controller to determine the position of the first display device relative to the second display device based on the information generated by the sensor. The display controller determines an image to be shown on the first display device based on the position of the first display device relative to the second display device.

Abstract: An apparatus for controlling wafer uniformity is disclosed. In one example, the apparatus includes: a plurality of temperature control elements and a processor. Each of the temperature control elements corresponds to a different portion of a wafer respectively such that the temperature control elements correspond to different portions of the wafer. Each of the temperature control elements is configured to individually control temperature of a corresponding portion of the wafer. The processor determines at least one portion of the wafer for temperature uniformity control, and instruct at least one of the temperature control elements, corresponding to the at least one portion, to adjust temperature of the at least one portion for controlling temperature uniformity of the wafer.

Abstract: The present invention relates bispecific antibodies that specific binds to BCMA (B-Cell Maturation Antigen) and CD3 (Cluster of Differentiation 3). Method of making the bispecific antibodies and method of using the bispecific antibodies for the treatment of multiple myeloma are also provided.

Abstract: A display panel and a pixel circuit of the display panel are provided. The pixel circuit includes a driving transistor and a light-emitting time length modulator. The driving transistor has a control terminal receiving a pulse width control signal and an amplitude control signal, and the driving transistor generates a driving signal. In a first time period, the light-emitting time length modulator modulates a time length of a plurality of second time periods for providing the driving signal to a light-emitting device according to a light-emitting time control signal.

Abstract: A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

Abstract: A method for fabricating an integrated circuit is provided. The method includes: receiving a cell schematic of a unit cell of the integrated circuit; when an intrinsic gain of a transistor of the unit cell falls outside a predetermined range of gain values, revising a set of parameter values for a set of size parameters of the unit cell in the cell schematic, wherein the intrinsic gain of the transistor of the unit cell characterized by the revised set of parameter values falls within the predetermined range of gain values; generating a cell layout of the unit cell according to the cell schematic indicating the revised set of parameter values for the set of size parameters; and fabricating the integrated circuit according to the cell layout of the unit cell.

Abstract: A composition may include at least 50 wt-% of a first lignin component; and up to 50 wt % of a second lignin component. The first and second lignin components may include processed lignin or native lignin. The composition may include at least 80 wt-% processed lignin; and at least 1 wt-%) of a blend component comprising an aromatic ring and one or more electron withdrawing groups. The processed lignin may include kraft lignin or GVL lignin or both. The composition may include a lignin component and a non-lignin blend component. Polymeric articles formed from the composition by casting, molding, or extrusion may exhibit a tensile strength of 20 MPa or greater, or a tensile elongation at break of 1.5%> or greater.

Abstract: The present invention relates to antibodies, e.g., full length antibodies or antigen binding fragments thereof, that specifically bind to BCMA (B-Cell Maturation Antigen) and/or CD3 (Cluster of Differentiation 3). The invention also relates to antibody conjugates (e.g., antibody-drug-conjugates) comprising the BCMA antibodies, compositions comprising the BCMA antibodies, and methods of using the BCMA antibodies and their conjugates for treating conditions associated with cells expressing BCMA (e.g., cancer or autoimmune disease). The invention further relates to heteromultimeric antibodies that specifically bind to CD3 and a tumor cell antigen, (e.g., bispecific antibodies that specifically bind to CD3 and BCMA). Compositions comprising such heteromultimeric antibodies, methods for producing and purifying such heterodimeric antibodies, and their use in diagnostics and therapeutics are also provided.

Abstract: A device for connecting a headrest to a back is disclosed. The device includes a headrest assembly and a fixing seat. The headrest assembly includes a headrest, a support and an adjusting seat. The headrest is pivotedly connected to the support. The support is slidably connected to the adjusting seat. An inner base of the adjusting seat has two rails. Each rail is extended with an inserting wing. Tops of the rails are formed with a blocker. A wall is formed between the rails. The fixing seat has a connecting side facing the adjusting seat. The connecting side has a recess with a closed bottom edge. Two opposite edges of the recess is formed with troughs for receiving the inserting wings. A flexible arm is formed between the two troughs. The flexible arm is stopped by the wall.

Abstract: A method for fabricating a semiconductor structure is provided. The method includes assigning a set of parameter values to a set of size parameters of a unit cell of the integrated circuit in a unit cell schematic of the unit cell according to a predetermined criterion, wherein the unit cell characterized by the set of parameter values has a circuit characteristic meeting the predetermined criterion; generating a unit cell layout of the unit cell according to the unit cell schematic; generating a circuit layout comprising a plurality of replicas of the unit cell layout, the replicas of the unit cell layout being arranged in correspondence with circuit blocks in a circuit floorplan of the integrated circuit, respectively; and fabricating the integrated circuit according to the circuit layout.