Abstract: Power, routability and electromigration have become crucial issues in modem microprocessor designs. In high performance designs, clocks are the highest consumer of power. Arranging clocking components with regularity so as to minimize the capacitance on the clock nets can help reduce clock power, however, it may hurt performance due to some loss of flexibility in physically placing those components. The present invention provides techniques to optimally place clock components in a regular fashion so as to minimize clock power within a performance constraint. A rectangular grid is created and clock distribution structures are assigned to the grid intersection points. Latches are then located around the clock distribution structures to minimize an overall distance for connections between the latches and respective clock distribution structures. The horizontal and vertical pitches of the grid may be independently adjusted to achieve a more uniform spread of the clock distribution structures.

Abstract: A circuit design method, computer program product and chip design system embodying the method. A gate selected for static timing analysis (STA) from a circuit design. Initial performance characteristics (e.g., load and transition slew) are determined for the selected gate. A charge equivalent effective capacitance (CQeff) is determined for the gate from the initial performance characteristics. A gate delay is determined in a single pass for the gate using CQeff as an effective load for said selected gate. Optionally, if the total gate load capacitance (Ctot) exceeds CQeff by less than a minimum, the effective capacitance (Ceff) is determined and used for determining the gate delay instead.

Abstract: A 3D chip having at least one I/O layer connected to other 3D chip layers by a vertical bus such that the I/O layer(s) may accommodate protection and off-chip device drive circuits, customization circuits, translation circuits, conversions circuits and/or built-in self-test circuits capable of comprehensive chip or wafer level testing wherein the I/O layers function as a testhead. Substitution of I/O circuits or structures may be performed using E-fuses or the like responsive to such testing.

Abstract: A system for logic block timing analysis may include a controller, and storage in communication with the controller. The storage may provide delay-versus-conesize values of a logic block. The system may further include a fitting module to provide a delay-cone based upon the delay-versus-conesize values of the logic block. The system may also include a conesize parser that uses the delay-cone to provide delay values through the logic block. The conesize parser may be used to validate the design of the logic block by comparing the delay-cone with a desired cycle time.

Abstract: A system to identify timing differences due to logic block changes, the system may include a controller, and storage in communication with the controller. The controller may provide delay values of a previous logic block and a current logic block. The system may also include a timing-modeler to compare the delay values of the previous logic block with the current logic block for timing analysis. The system may further include an interface that provides a report based upon the previous logic block and the current logic block comparison.

Abstract: An improved solution for designing a circuit is provided. A set of target paths, each of which has a performance attribute that is targeted for improvement, is obtained from a design for the circuit. An influence for one or more of the nodes in the set of target paths is obtained. One or more of the nodes are selected for improvement using the influence. Subsequently, the performance attribute for each selected node is improved. For example, an implementation of the node can be replaced with an implementation having an improved performance attribute. The relative improvement provided by an alternative implementation versus a relative detriment to another performance attribute can be obtained and used in selecting the node(s) for improvement. In one embodiment, the relative improvement and influence are used to obtain a sensitivity metric for each alternative implementation, which is used in selecting the node(s) for improvement. In this manner, the circuit can be improved in a more effective manner.

Abstract: An integrated circuit (IC) design, method and program product for reducing IC design power consumption. The IC is organized in circuit rows. Circuit rows may include a low voltage island powered by a low voltage (Vddl) supply and a high voltage island powered by a high voltage (Vddh) supply. Circuit elements including cells, latches and macros are placed with high or low voltage islands to minimize IC power while maintaining overall performance. Level converters may be placed with high voltage circuit elements.

Abstract: An integrated circuit (IC) design, method and program product for reducing IC design power consumption. The IC is organized in circuit rows. Circuit rows may include a low voltage island powered by a low voltage (Vddl) supply and a high voltage island powered by a high voltage (Vddh) supply. Circuit elements including cells, latches and macros are placed with high or low voltage islands to minimize IC power while maintaining overall performance. Level converters may be placed with high voltage circuit elements.

Abstract: The present invention provides a method, system and program product for mitigating effects of interconnect variability during a design stage of a chip. Under the technique of the present invention, a global and detailed routing of interconnects of the chip are determined. Thereafter, a dummy fill estimation and a grid based metal density estimation are performed. Then, based on a CMP model, a variable map of metal thicknesses is obtained. Based on the variable map, wiring nets of the chip that are sensitive to metal variability (e.g., that fail to meet timing closure due to metal thickness loss/gain in the CMP process) are identified. These wiring nets are then re-routed for optimization of the chip.

Abstract: A logic design tool, a tool for analyzing soft error sensitivities in logic, and a program product for logic design. A particle generator simulates events likely to occur for a given operating environment. A pre-characterizer provides circuit block responses to simulated events. A circuit response simulator simulates events in a logic design and provides an indication of soft error sensitivity for the design. Based on the soft error sensitivity indication, the design may be modified to reduce the overall soft error sensitivity.

Abstract: The present invention provides a method, system and program product for mitigating effects of interconnect variability during a design stage of a chip. Under the technique of the present invention, a global and detailed routing of interconnects of the chip are determined. Thereafter, a dummy fill estimation and a grid based metal density estimation are performed. Then, based on a CMP model, a variable map of metal thicknesses is obtained. Based on the variable map, wiring nets of the chip that are sensitive to metal variability (e.g., that fail to meet timing closure due to metal thickness loss/gain in the CMP process) are identified. These wiring nets are then re-routed for optimization of the chip.

Abstract: An electronic circuit layout refinement method and system. A grid of equally sized tiles is defined on a circuit layout area. Each tile of the grid has a respective critical area estimate metric associated with critical area estimates for a circuit to be placed on the circuit layout area. A global circuit routing for a circuit to be placed within a plurality of tiles of the grid is performed. An estimation of critical area estimate metrics that are assigned to respective tiles of the grid is performed prior to performing a detailed circuit routing for the circuit. The global circuit routing is adjusted, after estimating the critical area estimate metrics, in order to improve a respective critical area estimate metric assigned to at least one tile of the grid. The adjusted global circuit routing is then produced.

Abstract: An IC structure having reduced power loss and/or noise includes two or more active semiconductor regions stacked in a substantially vertical dimension, each active semiconductor region including an active layer. The IC structure further includes two or more voltage supply planes, each of the voltage supply planes corresponding to a respective one of the active layers.

Abstract: An IC structure having reduced power loss and/or noise includes two or more active semiconductor regions stacked in a substantially vertical dimension, each active semiconductor region including an active layer. The IC structure further includes two or more voltage supply planes, each of the voltage supply planes corresponding to a respective one of the active layers.

Abstract: A three-dimensional architecture chip includes a base chip including a unit integrated thereon and configured to perform electrical signal operations. An active layer is separately fabricated from the base layer. The active layer includes a component to service the unit of the base chip. The active layer is bonded to the base chip such that the component is aligned in vertical proximity of the unit. An electrical connection connects the unit to the component through vertical layers of at least one of the base chip and the active layer.

Abstract: A design structure for a 3D chip having at least one I/O layer connected to other 3D chip layers by a vertical bus such that the I/O layer(s) may accommodate protection and off-chip device drive circuits, customization circuits, translation circuits, conversions circuits and/or built-in self-test circuits capable of comprehensive chip or wafer level testing wherein the I/O layers function as a testhead. Substitution of I/O circuits or structures may be performed using E-fuses or the like responsive to such testing.

Abstract: A level converter for interfacing two circuits supplied by different supply voltages, and integrated circuit including the level converter interfacing circuit in two different voltage islands. A first buffer is supplied by a virtual supply and receives an input signal from a lower voltage circuit. The first buffer drives a second buffer, which is supplied by a higher supply voltage. An output from the second buffer switches a supply select to selectively pass the higher supply voltage or a reduced supply voltage to the first buffer.

Abstract: An IC structure having reduced power loss and/or noise includes two or more active semiconductor regions stacked in a substantially vertical dimension, each active semiconductor region including an active layer. The IC structure further includes two or more voltage supply planes, each of the voltage supply planes corresponding to a respective one of the active layers.

Abstract: A solution for managing a circuit design, which enables a cell to be incrementally placed in the circuit design based on a resulting wiring distance is provided. A cell to be placed in the circuit design is obtained along with a corresponding set of nets in the circuit design to which the cell is to be connected. A routing grid, which defines a plurality of tiles in the circuit design for consideration in placing the cell, can be generated based on the set of nets for the cell. A wire distance measure can be calculated for each of the tiles in the routing grid using the set of nets. The wire distance measure is then used to identify a target tile for placing the cell. The target tile can be used to find an exact and/or rough placement for the cell.

Abstract: The present invention provides a method, system and program product for mitigating effects of interconnect variability during a design stage of a chip. Under the technique of the present invention, a global and detailed routing of interconnects of the chip are determined. Thereafter, a dummy fill estimation and a grid based metal density estimation are performed. Then, based on a CMP model, a variable map of metal thicknesses is obtained. Based on the variable map, wiring nets of the chip that are sensitive to metal variability (e.g., that fail to meet timing closure due to metal thickness loss/gain in the CMP process) are identified. These wiring nets are then re-routed for optimization of the chip.