Abstract: An electronic system includes a controller configured to output a command, external row addresses, and external column addresses, receive a flag signal, and output the flag signal to a host. The electronic system also includes a semiconductor device configured to correct an error of internal data output from a memory cell selected based on the command, the external row addresses, and the external column addresses to output error-corrected internal data as data, and output the flag signal that is enabled when correcting the error in the internal data a set number of times.

Abstract: A semiconductor system includes a controller configured to apply a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device including a first rank and a second rank configured to calibrate each termination resistance, based on the command address, the first chip selection signal, and the second chip selection signal.

Abstract: A semiconductor system includes a controller configured to transmit a command address and a plurality of read strobe signals, and a semiconductor device including a first rank and a second rank that are configured to receive the command address and the plurality of read strobe signals and to perform a write operation and a read operation based on the command address. In the semiconductor device, the first rank is configured to calibrate a termination resistance value of the first rank to a target resistance value when a write operation for the first rank is performed. In the semiconductor device, the first rank is configured to calibrate the termination resistance value of the first rank to a dynamic resistance value based on the plurality of read strobe signals when a write operation for the second rank is performed.

Abstract: A memory device includes a memory cell array including row-hammer cells configured to store a number of accesses of a corresponding row of a plurality of rows; an address control circuit configured to generate consecutive first and second refresh addresses according to a normal refresh command, wherein the first refresh address indicates an odd-numbered row during a first refresh cycle and an even-numbered row during a second refresh cycle; and a refresh control circuit configured to refresh, according to the normal refresh command, first and second rows respectively corresponding to the first and second refresh addresses and selectively initialize the row-hammer cells of the first row while refreshing the first row.

Abstract: A memory system includes: a memory controller configured to: issue a normal refresh command and a refresh management command, and adjust, based on a replacement counting value, an issuance frequency of at least one of the normal refresh command and the refresh management command; and a memory device configured to: perform a first refresh operation corresponding to the normal refresh h command and a second refresh operation corresponding to the refresh management command, and replace the second refresh operation with the first refresh operation according to a memory information signal, count a number of times of the replacing to generate the replacement counting value, and provide the replacement counting value.

Abstract: A memory device may include: a memory bank comprising a plurality of memory blocks, each divided into a normal area and a row hammer area, a command control circuit suitable for performing an access operation on the normal area in response to an active command, an internal command generation circuit suitable for generating an internal command in response to a precharge command, a target address generation circuit suitable for saving a count for each logic level combination of a received address in the row hammer area by performing an access operation on the row hammer area in response to the internal command, and setting an address corresponding to the count as a target address when the count satisfies a preset condition, and a refresh control circuit suitable for controlling a smart refresh operation on the target address.

Abstract: A semiconductor system includes a controller configured to apply a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device including a first rank and a second rank configured to calibrate each termination resistance, based on the command address, the first chip selection signal, and the second chip selection signal.

Abstract: A semiconductor system includes a controller configured to transmit a command address and a plurality of read strobe signals, and a semiconductor device including a first rank and a second rank that are configured to receive the command address and the plurality of read strobe signals and to perform a write operation and a read operation based on the command address. In the semiconductor device, the first rank is configured to calibrate a termination resistance value of the first rank to a target resistance value when a write operation for the first rank is performed. In the semiconductor device, the first rank is configured to calibrate the termination resistance value of the first rank to a dynamic resistance value based on the plurality of read strobe signals when a write operation for the second rank is performed.

Abstract: A semiconductor memory apparatus may include: a memory cell array; an ECC (Error Check and Correction) circuit configured to detect an error from data read from the memory cell array in response to a read command, correct the detected error, and output an error correction signal whenever an error is corrected; and an EF (Error Flag) generator configured to enter a flag output mode when the number of times that the error correction signal is generated during a monitoring period reaches a threshold, and output the error correction signal as an error flag in the flag output mode.

Abstract: A memory device may include: a memory bank comprising a plurality of memory blocks, each divided into a normal area and a row hammer area, a command control circuit suitable for performing an access operation on the normal area in response to an active command, an internal command generation circuit suitable for generating an internal command in response to a precharge command, a target address generation circuit suitable for saving a count for each logic level combination of a received address in the row hammer area by performing an access operation on the row hammer area in response to the internal command, and setting an address corresponding to the count as a target address when the count satisfies a preset condition, and a refresh control circuit suitable for controlling a smart refresh operation on the target address.

Abstract: A method for operating a memory includes: activating a row which is selected based on a row address among a plurality of rows; receiving a counting command while the selected row is activated; reading a number of accesses from memory cells of particular columns of the selected row in response to the counting command; increasing the number of accesses; and writing the increased number of accesses into the memory cells of the particular columns of the selected row.

Abstract: A semiconductor memory apparatus may include: a memory cell array; an ECC (Error Check and Correction) circuit configured to detect an error from data read from the memory cell array in response to a read command, correct the detected error, and output an error correction signal whenever an error is corrected; and an EF (Error Flag) generator configured to enter a flag output mode when the number of times that the error correction signal is generated during a monitoring period reaches a threshold, and output the error correction signal as an error flag in the flag output mode.

Abstract: Provided is a periodic signal generation circuit including: a clock generation unit suitable for generating first to Nth clocks which have a basic period and have a phase increasing sequentially by a time interval obtained by dividing the basic period by “N”; a pulse generation unit suitable for generating first to Nth periodic pulses having an equal pulse width and having a phase increasing sequentially by a time interval obtained by dividing the basic period by “N” by combining two or more clocks among the first to Nth clocks; and a periodic signal generation unit suitable for generating a periodic signal by combining one or more periodic pulses among the first to Nth periodic pulses depending on combination information.

Abstract: A semiconductor device may include a data storage region, a parity storage region and an error correction circuit. The data storage region may be configured to store first data and second data. The parity storage region may be configured to store a parity. The error correction circuit may be configured to correct an error of the first data or an error of the second data and the parity, based on a transmission selection signal.

Abstract: An address generation circuit may include: a first latch unit suitable for latching an address obtained by inverting a part of an input address; a second latch unit suitable for latching the partly inverted input address of the first latch unit, and suitable for latching an added/subtracted address after a first refresh operation during a target refresh period; a third latch unit suitable for latching the partly inverted input address of the first latch unit during a period other than the target refresh period; and an addition/subtraction unit suitable for generating the added/subtracted address by adding/subtracting a predetermined value to/from the latched address of the second latch unit.

Abstract: A voltage generation circuit includes: a periodic wave generator that generates an on/off signal that is periodically enabled/disabled, where at least one between a period and a duty cycle of the on/off signal is controlled based on at least one information among temperature information, capacitance information, leakage current information, speed information, and voltage level information; and an internal voltage generator that is enabled/disabled in response to the on/off signal and generates an internal voltage.

Abstract: A voltage generation circuit includes: a periodic wave generator that generates an on/off signal that is periodically enabled/disabled, where at least one between a period and a duty cycle of the on/off signal is controlled based on at least one information among temperature information, capacitance information, leakage current information, speed information, and voltage level information; and an internal voltage generator that is enabled/disabled in response to the on/off signal and generates an internal voltage.

Abstract: A voltage generation circuit includes: a periodic wave generator that generates an on/off signal that is periodically enabled/disabled, where at least one between a period and a duty cycle of the on/off signal is controlled based on at least one information among temperature information, capacitance information, leakage current information, speed information, and voltage level information; and an internal voltage generator that is enabled/disabled in response to the on/off signal and generates an internal voltage.

Abstract: A semiconductor device may include an inversion control signal generation circuit, a pattern control signal generation circuit, and a data input/output (I/O) circuit. The inversion control signal generation circuit may generate an inversion control signal according to a logic level combination of bit patterns included in at least one of a first address and a second address. The pattern control signal generation circuit may generate a pattern control signal from a pre-control signal in response to the inversion control signal. In response to the pattern control signal, the data input/output (I/O) circuit may generate data signals that will be output to an internal I/O line based on data signals loaded on a local I/O line.

Abstract: A semiconductor device may include a syndrome generation circuit and a failure detection circuit. The syndrome generation circuit may generate a syndrome signal corresponding to a pattern of an output data signal. The failure detection circuit may detect the syndrome signal and sequentially store the syndrome signal to generate a first syndrome signal and a second syndrome signal if an error is detected from the syndrome signal. The failure detection circuit may generate a failure detection signal which is enabled if a logic level combination of the first syndrome signal is different from a logic level combination of the second syndrome signal.