Patents by Inventor Sang-Hyun Oh
Sang-Hyun Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190123244Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.Type: ApplicationFiled: December 12, 2018Publication date: April 25, 2019Inventors: Ye Seul KIM, Kyoung Wan KIM, Sang Hyun OH, Duk Il SUH, Sang Won WOO, Ji Hye KIM
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Patent number: 10234201Abstract: A complex type dryer includes a rotational cylinder, a drying material, a hot air provider, a hot air chamber and a scraping unit. The drying material provider is disposed over the rotational cylinder and coats a drying material on a surface of the rotational cylinder. The hot air provider is connected to both sides of the rotational cylinder, and includes first and second hot air tubes. The first and second hot air tubes alternately provide a hot air into the rotational cylinder or alternately exhaust the hot air passing through the rotational cylinder. The hot air chamber is disposed along an outer surface of the rotational cylinder outside of the rotational cylinder. The scraping unit is disposed at a side of the rotational cylinder, and removes the drying material from the surface of the rotational cylinder after dried by the rotational cylinder and the hot air chamber.Type: GrantFiled: November 2, 2015Date of Patent: March 19, 2019Assignee: Korea institute of energy researchInventors: Sung-il Kim, Jong-Won Choi, Sang-Hyun Oh, Kye-Jong Lee
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Patent number: 10186638Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.Type: GrantFiled: January 12, 2017Date of Patent: January 22, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Sang Hyun Oh, Duk Il Suh, Sang Won Woo, Ji Hye Kim
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Publication number: 20180361400Abstract: Devices, systems, and methods for applying a dielectrophoretic force on a particle include: a cell defining at least one channel for confining the particle; and a first electrode and a second electrode electrically isolated from the first electrode, at least one of the first and second electrodes being formed from a two-dimensional (2D) material providing an atomically sharp edge. The first and second electrodes are arranged sufficiently close to one another and sufficiently close to the channel such that application of a sufficient voltage across the first and second electrodes generates an electric field in at least part of the channel, the electric field having an electric field gradient sufficient to apply the dielectrophoretic force on the particle in the channel.Type: ApplicationFiled: June 18, 2018Publication date: December 20, 2018Inventors: Sang-Hyun Oh, Steven John Koester
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Publication number: 20180335257Abstract: A hybrid drying apparatus including: a bed portion having a horizontally disposed top surface; an object-to-be-dried supplying portion configured to spread an object to be dried on the top surface of the bed portion; and a driving unit configured to rotate and drive the bed portion or the object-to-be-dried supplying portion, wherein the object to be dried supplied from the object-to-be-dried supplying portion is spread on the top surface of the bed portion while the bed portion or the object-to-be-dried supplying portion is rotated, and the top surface of the bed portion is heated in such a manner that a lower portion of the bed portion is primarily heated so that the bed portion is used to dry the object to be dried coated on the top surface of the bed portion by the object-to-be-dried supplying portion.Type: ApplicationFiled: September 15, 2017Publication date: November 22, 2018Applicant: KOREA INSTITUTE OF ENERGY RESEARCHInventors: Sung Il KIM, Sang Hyun OH, Ki Ho PARK
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Patent number: 10084112Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: GrantFiled: March 24, 2017Date of Patent: September 25, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
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Publication number: 20180219130Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: March 26, 2018Publication date: August 2, 2018Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9929314Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: October 27, 2016Date of Patent: March 27, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9777372Abstract: A method for fabricating articles for use in optics, electronics, and plasmonics includes large scale lithography or other patterning and conformal deposition such as by atomic layer deposition.Type: GrantFiled: August 7, 2014Date of Patent: October 3, 2017Assignee: REGENTS OF THE UNIVERSITY OF MINNESOTAInventors: Sang-Hyun Oh, Xiaoshu Chen
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Publication number: 20170200857Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: ApplicationFiled: March 24, 2017Publication date: July 13, 2017Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
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Publication number: 20170125640Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.Type: ApplicationFiled: January 12, 2017Publication date: May 4, 2017Inventors: Ye Seul Kim, Kyoung Wan Kim, Sang Hyun Oh, Duk Il Suh, Sang Won Woo, Ji Hye Kim
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Patent number: 9608165Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: GrantFiled: July 9, 2015Date of Patent: March 28, 2017Assignee: Seoul Viosys Co., Ltd.Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
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Publication number: 20170047483Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: October 27, 2016Publication date: February 16, 2017Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160380157Abstract: A light-emitting diode (LED) includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. The LED includes a first distributed Bragg reflector arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector including a first laminate structure including alternately stacked SiO2 and Nb2O5 layers. The first laminate structure of the first distributed Bragg reflector is configured to reflect at least 90% of a first wavelength range of blue light emitted from the light emitting structure.Type: ApplicationFiled: September 12, 2016Publication date: December 29, 2016Inventors: Duk Il SUH, Jae Moo Kim, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee
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Patent number: 9520536Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: December 30, 2015Date of Patent: December 13, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160252302Abstract: A complex type dryer includes a rotational cylinder, a drying material, a hot air provider, a hot air chamber and a scraping unit. The drying material provider is disposed over the rotational cylinder and coats a drying material on a surface of the rotational cylinder. The hot air provider is connected to both sides of the rotational cylinder, and includes first and second hot air tubes. The first and second hot air tubes alternately provide a hot air into the rotational cylinder or alternately exhaust the hot air passing through the rotational cylinder. The hot air chamber is disposed along an outer surface of the rotational cylinder outside of the rotational cylinder. The scraping unit is disposed at a side of the rotational cylinder, and removes the drying material from the surface of the rotational cylinder after dried by the rotational cylinder and the hot air chamber.Type: ApplicationFiled: November 2, 2015Publication date: September 1, 2016Applicant: KOREA INSTITUTE OF ENERGY RESEARCHInventors: Sung-il KIM, Jong-Won CHOI, Sang-Hyun OH, Kye-Jong LEE
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Patent number: 9401370Abstract: A three-dimensional non-volatile memory device that may increase erase operation efficiency during an erase operation using Gate-Induced Drain Leakage (GIDL) current and a method for fabricating the three-dimensional non-volatile memory device. The non-volatile memory device includes a channel structure formed over a substrate including a plurality of inter-layer dielectric layers and a plurality of channel layers that are alternately stacked, and a first selection gate and a second selection gate that are disposed on a first side and a second side of the channel structure, wherein the first selection gate and the second selection gate are disposed on sidewalls of the multiple channel layers, respectively, wherein a work function of a material forming the first selection gate is different from a work function of a material forming the second selection gate.Type: GrantFiled: September 7, 2012Date of Patent: July 26, 2016Assignee: SK Hynix Inc.Inventors: Sang-Moo Choi, Byung-Soo Park, Sang-Hyun Oh, Han-Soo Joo
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Patent number: 9397108Abstract: A three dimensional (3-D) non-volatile memory device includes a pipe gate including a first pipe gate, a second pipe gate formed on the first pipe gate, and a first interlayer insulating layer interposed between the first pipe gate and the second pipe gate, word lines alternately stacked with second interlayer insulating layers on the pipe gate, a pipe channel buried within the pipe gate, and memory cell channels coupled to the pipe channel and arranged to pass through the word lines and the second interlayer insulating layers.Type: GrantFiled: October 2, 2014Date of Patent: July 19, 2016Assignee: SK Hynix Inc.Inventors: Seo Hyun Lee, Byung Soo Park, Sang Hyun Oh, Sun Mi Park
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Patent number: 9397264Abstract: Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: February 24, 2015Date of Patent: July 19, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9334571Abstract: Methods for the formation of individual, precisely shaped nano- or micro-scale metallic structures, particularly pyramids. With this technique, mass fabrication of high-quality, uniform, and ultra-sharp pyramids, cones and wedges is achieved. The high yield, reproducibility, durability and massively parallel fabrication methods of this disclosure provide structures suitable for reliable optical sensing and detection and for cementing near-field optical imaging and spectroscopy as a routine characterization.Type: GrantFiled: March 13, 2013Date of Patent: May 10, 2016Assignee: Regents of the University of MinnesotaInventors: Sang-hyun Oh, Timothy W. Johnson