Abstract: A bit line sense amplifier and method thereof are provided. The example bit line sense amplifier may include a sense amplifying circuit coupled between a first bit line and a second bit line. The sense amplifying circuit may be configured to amplify a voltage difference between the first bit line and the second bit line. The example bit line sense amplifier may further include a power supply voltage providing circuit configured to provide a first power supply voltage and a second power supply voltage to the sense amplifying circuit in response to first and second bit line sensing control signals. The bit line sense amplifier may further include a bit line voltage compensation circuit configured to prevent a voltage-reduction at the first bit line and the second bit line for a delay period, the delay period including at least a period of time after a pre-charging of the first and second bit lines, in response to one or more of the first and second bit line sensing control signals.

Abstract: Provided is a DRAM having reduced current consumption and a communication terminal including the same. The DRAM includes a plurality of memory banks capable of being independently supplied with power, and a DPD controller for selectively causing some of the plurality of memory banks to enter a DPD mode.

Abstract: An internal supply voltage generation circuit includes first and second driving circuits and a resistive device. The first driving circuit receives a feedback voltage from a first node and generates a first output voltage based on first and second reference voltages to provide the first output voltage to the first node. The first output voltage is maintained between the first and second reference voltages. The second driving circuit receives a feedback voltage from a second node voltage and generates a second output voltage based on third and fourth reference voltages to provide the second output voltage to the second node. The second output voltage is maintained between the third and fourth reference voltages, and the second output voltage of the second node is provided as an internal supply voltage. The resistive device is coupled between the first and second nodes.

Abstract: A semiconductor memory device and method thereof are provided. The example method may be directed to performing a memory operation in a semiconductor memory device, and may include receiving data and a data masking signal corresponding to at least a portion of the received data, the received data scheduled to be written into memory in response to a write command and the data masking signal configured to block the at least a portion of the received data from being written into the memory and configuring timing parameters differently for each of the received data and the data masking signal so as to execute the write command without writing the at least a portion of the received data into the memory.

Abstract: A semiconductor memory device performs a parallel bit test on a plurality of memory blocks by writing test pattern data into the plurality of memory blocks, outputting two bits from each memory block in parallel and comparing the two bits output from each memory block with each other in a first test mode, and outputting two bits from respectively different memory blocks and comparing the two bits output from the respectively different memory blocks with each other in a second test mode.

Abstract: An apparatus for generating a column select line signal in a semiconductor memory device includes a column select line signal generator configured to generate a column select line signal in response to a column select line enable signal. The column select line signal has a first pulse width when the column select line signal generator is in a first operational mode and a second pulse width when the column select line signal generator is in a second operational mode. The second pulse width is longer than the first pulse width.

Abstract: An internal supply voltage generation circuit includes first and second driving circuits and a resistive device. The first driving circuit receives a feedback voltage from a first node and generates a first output voltage based on first and second reference voltages to provide the first output voltage to the first node. The first output voltage is maintained between the first and second reference voltages. The second driving circuit receives a feedback voltage from a second node voltage and generates a second output voltage based on third and fourth reference voltages to provide the second output voltage to the second node. The second output voltage is maintained between the third and fourth reference voltages, and the second output voltage of the second node is provided as an internal supply voltage. The resistive device is coupled between the first and second nodes.

Abstract: Provided is a semiconductor device including a plurality of fuse circuits. Each of the fuse circuits includes: a first signal generator generating a first signal to a first node in response to a power-up signal; a pull-down transistor pulling down a second node in response to the first signal; a pull-up transistor and a fuse which are connected in series between a power supply voltage and the second node and pulling up the second node in response to the first signal when the fuse is not cut; a buffer buffering a signal output from the second node and generating a control signal; and a standby reset transistor resetting the second node in response to the control signal output from the buffer, wherein the pull-down transistor and the standby reset transistor have threshold voltages lower than a threshold voltage of the buffer. Also, each of the fuse circuits further includes an active reset transistor resetting the second node in the active mode in response to the reset control signal.

Abstract: A semiconductor memory device having dummy sense amplifiers and a method of utilizing the same are provided. Embodiments of the semiconductor memory device may include at least one dummy cell block including dummy cells and memory cells. Normal bit lines connecting the memory cells in the dummy cell block in a first direction and dummy bit lines connecting the dummy cells in the first direction. A dummy sense amplifier is also included for connecting any two of the normal bit lines and the dummy bit lines. Some of the embodiments may improve the sensing margin and refresh margin in sensing memory cells in the dummy cell, as well as increasing the redundancy efficiency and utilization of the dummy cells.

Abstract: A bit line sense amplifier and method thereof are provided. The example bit line sense amplifier may include a sense amplifying circuit coupled between a first bit line and a second bit line. The sense amplifying circuit may be configured to amplify a voltage difference between the first bit line and the second bit line. The example bit line sense amplifier may further include a power supply voltage providing circuit configured to provide a first power supply voltage and a second power supply voltage to the sense amplifying circuit in response to first and second bit line sensing control signals. The bit line sense amplifier may further include a bit line voltage compensation circuit configured to prevent a voltage-reduction at the first bit line and the second bit line for a delay period, the delay period including at least a period of time after a pre-charging of the first and second bit lines, in response to one or more of the first and second bit line sensing control signals.

Abstract: A semiconductor memory device is provided. The device includes an on die termination circuit controlling a termination resistance value by detecting a phase change of a signal inputted through a pad. Additionally, the on die termination circuit changes the termination resistance value when an identical phase signal is inputted during n (n is positive integer) periods of a clock signal.

Abstract: The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer burn-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.

Abstract: Provided is a DRAM having reduced current consumption and a communication terminal including the same. The DRAM includes a plurality of memory banks capable of being independently supplied with power, and a DPD controller for selectively causing some of the plurality of memory banks to enter a DPD mode.

Abstract: A fuse arrangement in a semiconductor device, including a fuse resistor being connected to a first voltage, and a transistor passing current to the fuse resistor, wherein a second voltage is applied to a gate of the transistor, the second voltage being greater than the first voltage. Another fuse arrangement in a semiconductor device, including a first fuse resistor having a first terminal connected to a first voltage and a second terminal connected to a first node, a second fuse resistor having a third terminal connected to the first voltage and a fourth terminal connected to a second node, and a transistor being controlled by a first signal with a second voltage, the transistor passing current to the second terminal of the first fuse resistor based on the first signal, the second voltage being greater than the first voltage.

Abstract: A circuit with fuses and a semiconductor device having the same circuit include a first switch connected to a power supply voltage or a signal input terminal and turned on in response to a first pulse signal, a second switch connected to a ground voltage and turned on in response to a second pulse signal, a fuse connected between the first switch and the second switch, and a signal generating circuit for producing the first and second pulse signals. The first pulse signal turns off the first switch before the second pulse signal turns on the second switch and the first pulse signal turns on the first switch after the second pulse signal turns off the second switch.

Abstract: A semiconductor memory device and a write control circuit which may detect write failures and a write control method for the same are provided. The semiconductor memory device may include a memory cell array, a bit line amplifier, a switch unit, and a write driver. Exemplary embodiments of the semiconductor memory device, according to the present invention, may determine the activation timing of the column select line signal using a clock enable signal and a mode register set signal, without synchronizing with a master clock signal.

Abstract: A semiconductor device that performs stable circuit operations is provided. The device includes: a pull-up driver for pulling up a first node in response to first states of input and control signals; a pull-down driver for pulling down a second node in response to a second state of the input signal; at least one fuse connected between the first node and the second node; a latch for generating an output signal to maintain the state of the second node; and a controller for generating the control signal that is maintained in a first state when the input signal is in the second state, and maintained in the first state and then transitioned to the second state after a predetermined delay time when the input signal is transitioned to the first state. In this construction, even if the fuse is incompletely cut during a process of cutting the fuse, the pull-up driver or the pull-down driver is turned off, thus preventing unnecessary current flow in advance.

Abstract: An apparatus for generating a column select line signal in a semiconductor memory device includes a column select line signal generator configured to generate a column select line signal in response to a column select line enable signal. The column select line signal has a first pulse width when the column select line signal generator is in a first operational mode and a second pulse width when the column select line signal generator is in a second operational mode. The second pulse width is longer than the first pulse width.

Abstract: A fuse circuit according to the present invention includes first and second fuses, each of which has a first end and a second end. The first and second ends of the first fuse are connected in a straight line. The first end of the second fuse is spaced by a first interval from the first end of the first fuse, and the second end thereof is spaced by a second interval from the second end of the first fuse. The first ends of the first and second fuses have the same widths as those of the second ends thereof. Alternatively, the first ends of the first and second fuses have narrower widths that those of the second ends thereof.

Abstract: The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer burn-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.