Abstract: A semiconductor memory device comprises a memory cell array, a defective address programming means, a redundant enable signal generating means, an output means, and a mode control signal setting means. The memory cell array comprises a plurality of memory cells. The defective address programming means programs a redundant control signal and a defective address of a defective memory cell among the plurality of the memory cells at a package level in response to a first control signal and an address signal applied from an external portion. The redundant enable signal generating means generates a comparison coincident signal in response to the redundant control signal when the address is consistent with the defective address. The output means outputs the comparison coincident signal to an external portion in response to a second control signal during a test operation.

Abstract: Disclosed is a dynamic random access memory (DRAM) device having word line low voltage supply lines for driving word lines in a mesh structure. The DRAM device includes a plurality of cell arrays each of which is formed of memory cells coupled to word lines and bit lines in a matrix. The memory device further includes regions of sense amplifiers disposed between the cell arrays arranged along the row direction, regions of word line drivers disposed between the cell arrays arranged along the column direction, conjunction regions disposed at positions adjacent to the regions of the sense amplifiers and word line drivers, and a plurality of word line low voltage supply lines disposed on the conjunction regions. The word line low voltage supply lines are electrically interconnected for each other at least on the conjunction regions. According to the layout arrangement, loadings of the word line low voltage supply lines are almost equally distributed, and thereby word line low noise are decreased.

Abstract: State change transition times of a semiconductor memory device is reduced by reducing contact resistance associated with unshared input/output (I/O) lines. To minimize the difference in transition times between shared I/O lines having dual precharging circuits and non-shared I/O lines which have only a single precharging circuit, effective contact resistance of the non-shared I/O lines are reduced by eliminating unnecessary isolation gates with their attendant impedances. This provides faster transition times for the non-shared I/O lines.

Abstract: The present invention relates to a fuse option circuit of an integrated circuit and a method thereof. More particularly it concerns a fuse option circuit comprising: a first fuse formed on a chip, which is cut by providing a larger electric current than a set value; a second fuse formed on the chip identically with the first fuse; a fuse cutting means providing a cutting current loop to the first fuse in response to a fuse cutting signal; and an option signal generating means which produces a fuse option signal by comparing resistance values of the first and second fuses. Accordingly, even if the first use is abnormally cut, the fuse option can be precisely provided by comparing the first fuse having a changed resistance after cutting process with the second fuse keeping an initial resistance value. Therefore, the reliability of a fuse option of an integrated circuit can be improved.

Abstract: A mode selection circuit for a semiconductor memory device includes a timing register for generating first and second control signals in response to a command signal and a first address signal, a programming control signal generator for generating third control signals in response to a second address signal and the first control signal, and a mode selection signal generator for generating mode selection signals in response to a master signal, the second control signal, and the third control signals, wherein the mode selection signals are activated in accordance with a sequential order of activation of the third control signals.

Abstract: A semiconductor memory device including a plurality of memory blocks having associated with one or more circuit blocks therearound, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. First portions of the input/output lines of the first group are arranged between the adjacent memory blocks while first portions of the input/output lines of the second group are arranged within the circuit blocks around the adjacent memory blocks. Second portions of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second portions of the input/output lines of the second group are arranged between the adjacent memory blocks.

Abstract: A fuse circuit according to the present invention includes fuse elements each connected to first and second nodes, a sense circuit for sensing a difference of currents flowing through the fuse elements, and an amplifier circuit for amplifying voltages of the first and second nodes with rail-to-rail voltages, respectively. By this configuration, the resistor difference of the fuse elements is sensed by a current difference, thus whether a fuse element is programmed is exactly sensed regardless of capacitive parasitic loading of the respective nodes.

Abstract: A semiconductor memory device of the invention includes: main decoders for generating wordline enable signals in response to first decoding signals, a first precharge signal, and a second precharge signal; wordline drivers for wordline drive signals in response to the wordline enable signals and second decoding signals; and a circuit for generating the second precharge signal in response to a command signal. The wordline drive signals are inactivated in sequence in response to the first decoding signals and the second precharge signal, in order to reducing ground noises.

Abstract: A semiconductor memory device including a plurality of memory blocks, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. A first parts of the input/output lines of the first group are arranged between adjacent memory blocks while first parts of the input/output lines of the second group are arranged on circuit blocks around the adjacent memory blocks, and second parts of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second parts of the input/output lines of the second group are arranged between the adjacent memory blocks.

Abstract: An integrated circuit includes first and second pads that are electrically connected to a circuit inside the integrated circuit. The circuit performs multiple functions which may be selected. A function identification circuit, inside the integrated circuit, is electrically connected to the first and second pads. The function identification circuit operates in multiple modes, wherein each operating mode corresponds to a function performed by the circuit. The function of the circuit may thereby be identified using fewer pads which may allow a reduction in the cost of the integrated circuit.

Abstract: A semiconductor memory device for sequentially disabling activated word lines is provided. The semiconductor memory device having a plurality of word lines connected to a plurality of memory cells includes a predecoding unit for predecoding a row address received from the outside, a row decoding and word line driving block, which is connected to the predecoding unit and the plurality of word lines, for decoding an output of the predecoding unit, selecting some of the plurality of word lines, and activating the selected word lines and a controller connected to the predecoding unit and the row decoding and word line driving block, for receiving the row address, the output of the predecoding unit, and at least one control signal, generating at least one output signal, and sequentially disabling the activated word lines by enabling the at least one output signal in response to the row address and the output of the predecoding unit.

Abstract: An integrated circuit memory device includes a memory cell array and first and second sense amplifiers positioned on respective opposite first and second sides of the memory cell array. A first bit line pair and a second bit line pair connect the memory cell array to the first and second sense amplifiers, respectively. A first bit line of the first bit line pair and a first bit line of the second bit line pair extend across the memory cell array from the first side to the second side without crossing one another. A second bit line of the second bit line pair extends across the memory cell array from the first side to the second side, crossing the first bit line of the first bit line pair and the first bit line of the second bit line pair.

Abstract: An internal power supply circuit for use in a semiconductor device includes a clamp circuit for clamping an internal voltage to a constant level. The clamped internal voltage is distributed to internal circuits of the semiconductor device through an output node. When the internal voltage rises momentarily due to noise in the internal power supply circuit due to open-circuit phenomenon, the rising internal voltage is discharged through the clamp circuit, thereby maintaining the internal voltage at a constant value. The clamp circuit includes a first transistor for discharging the output node, and a diode-connected transistor for generating a charge voltage at the gate of the first transistor. The threshold voltage of the diode-connected transistor is preferably equal to or lower than the threshold voltage of the first transistor.

Abstract: External address signals are applied to an integrated circuit in a burn-in test mode. The external address signals control the voltage levels of adjacent main word lines in a memory array in the integrated circuit. The adjacent main word lines may thereby be configured in to be in opposing logic states. The opposing logic states may provide a potential difference between the adjacent main word lines, thereby increasing the likelihood of detecting microbridges between the adjacent main word lines formed during fabrication of the integrated circuit. The reliability of the integrated circuit may thereby be improved.

Abstract: Multi-bank integrated circuit memory devices include first and second memory cell arrays having first and second pairs of differential bit lines electrically coupled thereto, respectively. A dual sense amplifier is also provided and this sense amplifier is electrically coupled together by a first pair of differential input/output lines. First and second isolation circuits are also provided. The first isolation circuit is electrically coupled to the first pair of differential bit lines and is responsive to a first control signal (C1). The second isolation circuit is electrically coupled to the second pair of differential bit lines and is responsive to a second control signal (C2). First and second equalization circuits are provided. The first equalization circuit is responsive to the second control signal and performs the function of equalizing a potential of the first pair of differential bit lines.

Abstract: A burn-in stress circuit for a semiconductor memory device. A burn-in enable signal generator generates a burn-in enable signal in response to a plurality of control signals. A wordline predecoder generates a wordline driving voltage for driving a wordline in response to the burn-in enable signal and another a plurality of control signals. A wordline decoder applies the wordline driving voltage to the wordline in response to the burn-in enable signal and another plurality of control signals. To reduce the stress testing time by stressing multiple rows of a memory array simultaneously, all of the wordlines (rows) are stressed and or tested at the same time. To select all of the wordlines, the wordlines are selected sequentially, but each selected wordline is held in a selected state by a latching mechanism while all of the other wordlines are being selected as well. When all of the wordlines (or a desired subset) have been selected, the burn-in stress test begins.

Abstract: An internal voltage conversion circuit for a DRAM wherein a voltage level of an internal power supply is regulated by an external signal applied to the DRAM pins after packaging to perform reliability tests. The internal voltage conversion circuit includes a test mode signal generator, for generating a test mode signal by combining first control signals applied externally of the semiconductor device, and a switching signal generator, for generating first and second switching signals according to second control signals applied externally of the DRAM when the test mode signal is active. First and second switching resistor portions connected in series between the internal power supply port and a ground potential are switched by the first and second switching signals, respectively, so that their resistance values are changed. The resistor portions are in a feedback path connected to one input of a comparator. The other input is connected to a reference cell.

Abstract: A voltage clamping circuit for a semiconductor memory device which is capable of rapidly coping with the demand of the user. The voltage clamping circuit includes PMOS transistors connected in series between an external supply voltage terminal and a node on an output line of a DC voltage generator, a control PMOS transistor having a channel connected at both ends thereof respectively to the node on the output line and a node between the second and third ones of the series-connected PMOS transistors, and a pad connected to a control electrode of the control PMOS transistor. The pad is selectively connected to a supply voltage in a first state and to a ground voltage in a second state, thereby controlling a clamping interval of the clamping means to be variable. The first state is a state requiring a longer clamping interval than that of the second state.

Abstract: Integrated circuit memory devices contain an array of active memory cells and at least one column of dummy memory cells having missing electrical connections to either a dummy bit line and/or respective storage electrodes. The dummy memory cells are provided with missing electrical connections so that formation of stray electrical "shorts" between storage electrodes of dummy and active memory cells during fabrication do not cause memory failures when the memory devices are installed. In particular, integrated circuit memory devices are provided which comprise an array of active DRAM memory cells and a column of dummy DRAM memory cells. The active DRAM memory cells each contain electrical connections to a respective active bit line and a respective storage electrode, but the dummy DRAM memory cells are each devoid of an electrical connection to a dummy bit line and/or a respective storage electrode. Accordingly, the formation of a stringer (e.g.