Abstract: A test apparatus for a semiconductor memory device applies a test input pattern to the semiconductor memory device to produce a test output pattern. The test apparatus compares the test output pattern to an expected output pattern using a plurality of comparators to determine whether the semiconductor memory device is defective. The plurality of comparators are respectively controlled by a respective plurality of strobe signals having relative phase delays so that the test output pattern is compared to the expected output pattern at different times.

Abstract: In a method of inputting/outputting data in a semiconductor memory device, first data and second data are buffered and outputted to a first output node and a second output node, respectively, in a normal mode. In a test mode, the first data is buffered through a first transmission line and a second transmission line and outputted to the first output node and the second output node in response to at least one control signal. Also, in the test mode, the second data is buffered through the first transmission line and the second transmission line and outputted to the first output node and the second output node in response to the at least one control signal. Accordingly, test time may be reduced, and variations of operation characteristics caused by merging the data pins may also be reduced.

Abstract: The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer bum-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.

Abstract: A semiconductor device comprises a plurality of banks, a plurality of control circuits, and a plurality of temperature sensors, wherein each of the plurality of temperature sensors is disposed near at least one of the plurality of banks for sensing the temperature of the area surrounding the at least one of the plurality of banks and for outputting a sense signal corresponding to a sensed temperature, and each of the plurality of control circuits outputs at least one control signal, for controlling an operation of the at least one of the plurality of banks, to the at least one of the plurality of banks based on the sense signal.

Abstract: An integrated circuit of a semiconductor device has a chip malfunction controlling circuit embedded in a chip. The circuit comprises a fusing part, to which a cutting will be made in the manufacturing process according to the result of the discrimination of a defect in a chip, with one end thereof being connected to a first power terminal. A signal generating part is connected to the other end of the fusing part, and to a second power terminal. The signal generating part generates a discrimination signal of discriminating whether the chip is defective or not, by whether the fusing part has been cut or not. The discrimination signal is supplied to at least one internal function circuit, and inhibits its operation if the fusing part has been cut. Furthermore, the chip malfunction controlling method comprises generating a discrimination signal that has a first state if a test fuse has been cut and a second state if the test fuse has not been cut.

Abstract: A bit line pre-charge circuit of a semiconductor memory device includes a pre-charge circuit connected between a pair of bit lines for pre-charging the pair of bit lines in response to a pre-charge control signal and a pre-charge voltage transmitting circuit for transmitting a pre-charge voltage to the pre-charge circuit in response to the pre-charge control signal. A voltage drop in a pre-charge voltage generation line may be prevented when a short circuit is formed between a word line and a pair of bit lines, and current consumption during a standby operation of the semiconductor memory device may also be reduced, by preventing current from flowing from the pair of bit lines to the pre-charge voltage generation line.

Abstract: There is provided a voltage measurement device that is stable with respect to an undershot or overshot input voltage of a pad. The voltage measurement device includes a voltage line, a pad, a signal generating unit, a first switch, and a second switch. The first switch is connected between the pad and the second switch and the second switch is connected to the voltage line. The signal generating unit receives a control signal and generates an inverted control signal. The voltage line is connected to the pad through the first and second switches that are responsive to the control signal. The pad is also connected to an internal circuit block, so that the internal circuit block is driven according to a pad input. Specifically, the first and second switches can be implemented with an NMOS transistor and a PMOS transistor that are responsive to the control signal and the inverted control signal, respectively.

Abstract: A fuse arrangement in a semiconductor device, including a fuse resistor being connected to a first voltage, and a transistor passing current to the fuse resistor, wherein a second voltage is applied to a gate of the transistor, the second voltage being greater than the first voltage. Another fuse arrangement in a semiconductor device, including a first fuse resistor having a first terminal connected to a first voltage and a second terminal connected to a first node, a second fuse resistor having a third terminal connected to the first voltage and a fourth terminal connected to a second node, and a transistor being controlled by a first signal with a second voltage, the transistor passing current to the second terminal of the first fuse resistor based on the first signal, the second voltage being greater than the first voltage.

Abstract: A semiconductor memory device and a write control circuit which may detect write failures and a write control method for the same are provided. The semiconductor memory device may include a memory cell array, a bit line amplifier, a switch unit, and a write driver. Exemplary embodiments of the semiconductor memory device, according to the present invention, may determine the activation timing of the column select line signal using a clock enable signal and a mode register set signal, without synchronizing with a master clock signal.

Abstract: Integrated circuit memory devices include a memory cell array that is configured to output data bits in parallel at a first data rate. An output circuit is configured to serially output the data bits to an external terminal at the first data rate in a normal mode of operation, and to serially output the data bits to the external terminal at a second data rate that is lower than the first data rate in a test mode of operation. Accordingly, the memory cell array can operate at a first data rate while allowing the output circuit to output data to an external terminal at a second data rate that is lower than the first data rate, in a test mode of operation.

Abstract: A laser link structure used in semiconductor devices and a fuse box using the laser link structure preferably include a plurality of first conductive line patterns positioned in parallel at predetermined intervals, and a second conductive line pattern broadly formed on the plurality of first conductive line patterns for forming hole regions which link the second conductive line pattern to the plurality of first conductive line patterns. Preferably, at least one hole region is formed on each of the plurality of first conductive line patterns, and via holes are formed in the hole regions.

Abstract: A fuse box including make-links and a redundancy address decoder including the fuse box are provided. It is preferable that the fuse box includes a plurality of make-links for programming an address of a defective normal memory cell with an address of a corresponding redundant memory cell, and the address is a row address or a column address. The redundant address decoder includes a fuse box having a plurality of make-links for decoding an address of a defect cell and a redundant word line selection circuit for selecting a word line of a redundant cell corresponding to the address of the defect cell in response to a signal output from the fuse box.

Abstract: Integrated circuit memory devices include a memory cell array that is configured to output data bits in parallel at a first data rate. An output circuit is configured to serially output the data bits to an external terminal at the first data rate in a normal mode of operation, and to serially output the data bits to the external terminal at a second data rate that is lower than the first data rate in a test mode of operation. Accordingly, the memory cell array can operate at a first data rate while allowing the output circuit to output data to an external terminal at a second data rate that is lower than the first data rate, in a test mode of operation.

Abstract: Integrated circuits are provided that include a voltage control circuit that is configured to adjust a circuit voltage that is outside a predetermined circuit voltage specification to within the predetermined circuit voltage specification so that the integrated circuit device is no longer defective. Integrated circuits are also provided that include a signal time delay control circuit that is configured to adjust a circuit delay time that is outside a predetermined circuit delay time specification to within the predetermined circuit delay time specification so that the integrated circuit device is no longer defective. Corresponding methods of operation are also provided.

Abstract: Integrated circuits are provided that include a voltage control circuit that is configured to adjust a circuit voltage that is outside a predetermined circuit voltage specification to within the predetermined circuit voltage specification so that the integrated circuit device is no longer defective. Integrated circuits are also provided that include a signal time delay control circuit that is configured to adjust a circuit delay time that is outside a predetermined circuit delay time specification to within the predetermined circuit delay time specification so that the integrated circuit device is no longer defective. Corresponding methods of operation are also provided.

Abstract: A control signal generating circuit including a make-link type fuse is provided. The circuit includes a first transistor for receiving an input signal at a gate thereof, the first transistor being connected to a first voltage, a second transistor for receiving the input signal at a gate thereof, the second transistor being connected to a second voltage, a make-link type fuse serially linked between the first and second transistors by application of energy, and a sensing circuit, connected to the make-link type fuse, for sensing whether the make-link type fuse is linked between the first and second transistors or not and for outputting a control signal based on the sensed result and the input signal. The first and second transistors are complementarily connected to turn on one of the first and second transistors in response to the input signal, thereby preventing current from flowing between the first and second transistors when the make-link type fuse is linked between the first and second transistors.

Abstract: A fuse circuit according to the present invention includes first and second fuses, each of which has a first end and a second end. The first and second ends of the first fuse are connected in a straight line. The first end of the second fuse is spaced by a first interval from the first end of the first fuse, and the second end thereof is spaced by a second interval from the second end of the first fuse. The first ends of the first and second fuses have the same widths as those of the second ends thereof. Alternatively, the first ends of the first and second fuses have narrower widths that those of the second ends thereof.

Abstract: A circuit with fuses and a semiconductor device having the same circuit include a first switch connected to a power supply voltage or a signal input terminal and turned on in response to a first pulse signal, a second switch connected to a ground voltage and turned on in response to a second pulse signal, a fuse connected between the first switch and the second switch, and a signal generating circuit for producing the first and second pulse signals. The first pulse signal turns off the first switch before the second pulse signal turns on the second switch and the first pulse signal turns on the first switch after the second pulse signal turns off the second switch.

Abstract: The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer bum-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.

Abstract: A bit line pre-charge circuit of a semiconductor memory device includes a pre-charge circuit connected between a pair of bit lines for pre-charging the pair of bit lines in response to a pre-charge control signal and a pre-charge voltage transmitting circuit for transmitting a pre-charge voltage to the pre-charge circuit in response to the pre-charge control signal. A voltage drop in a pre-charge voltage generation line may be prevented when a short circuit is formed between a word line and a pair of bit lines, and current consumption during a standby operation of the semiconductor memory device may also be reduced, by preventing current from flowing from the pair of bit lines to the pre-charge voltage generation line.