Abstract: There is provided a power amplifying apparatus including: a power amplifier; a power regulator providing a driving voltage and a driving current corresponding to a control voltage to the power amplifier; a current sensing unit sensing a current and a voltage corresponding to the driving current and controlling the driving voltage according to the sensed current; a current control unit controlling a current bias according to the sensed voltage of the current sensing unit; and a current bias circuit unit controlling a bias current of the power amplifier according to the controlling of the current control unit.

Abstract: An array substrate for an in-plane switching mode liquid crystal display device includes a substrate, a gate line along a first direction on the substrate, a data line along a second direction and crossing the gate line to define a pixel region, a common line on the substrate, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region and connected to the thin film transistor, the pixel electrode including horizontal parts along the first direction, and a common electrode in the pixel region and connected to the common line, the common electrode including horizontal portions along the first direction, wherein the pixel electrode and the common electrode are formed on a same layer.

Abstract: A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate.

Abstract: Disclosed is an anti-obesity active extract obtained from a medicinal plant. More specifically, the extract obtained from lysimachiae foenum-graeci herba (which is a medicinal plant traditionally used in the East) can be used as an active ingredient for a raw material, a functional food, cosmetic, a crude drug, etc. for an obesity preventing or therapeutic agent because the extract can suppress the adipocyte differentiation and decrease the body weight and body fat in an obese animal, thereby suppressing fat accumulation (that is, a factor for obesity).

Abstract: A robot calibration apparatus and a robot calibration method.

Abstract: An array substrate for an in-plane switching mode liquid crystal display device includes a substrate, a gate line along a first direction on the substrate, a data line along a second direction and crossing the gate line to define a pixel region, a common line on the substrate, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region and connected to the thin film transistor, the pixel electrode including horizontal parts along the first direction, and a common electrode in the pixel region and connected to the common line, the common electrode including horizontal portions along the first direction, wherein the pixel electrode and the common electrode are formed on a same layer.

Abstract: Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.

Abstract: When an error occurring in a terminal (device) is detected, one or more solutions for removing the detected error are displayed to a user, so that the detected error can be easily removed by the user even though the user is not familiar with operations or detailed functions of the camera.

Abstract: In one embodiment, a system for generating an oscillating signal includes a transconductance amplifier comprising a single-ended output and a differential input. The system also includes only one feedback loop coupled to the transconductance amplifier. The feedback loop includes a low pass filter configured to receive the output of the transconductance amplifier. Also, the feedback loop includes a high pass filter configured to receive the output of the first low pass filter and output a signal to only one terminal of the differential input of the transconductance amplifier.

Abstract: Provided is an apparatus for sharpening a blurred enlarged image, including a digital image output unit for outputting a digital image input through a digital image input unit. The apparatus includes a digital image processing unit for calculating a primary edge direction of the digital image input through the digital image unit to perform enlarging and edge sharpening on the input digital image. Accordingly, blurring is removed from the enlarged image without ringing or an artifact using an adaptive edge sharpening method, so that the enlarged image can be sharpened.

Abstract: In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

Abstract: In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.

Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Abstract: There is provided a high frequency transmission module, including: a high band power amplifier amplifying power of a preset high band frequency signal; a low band power amplifier amplifying power of a preset low band frequency signal; an LC matching circuit unit matching output impedance of the low band power amplifier to impedance of an antenna switch circuit; the antenna switch circuit connecting one of a first terminal connected to an output terminal of the high band power amplifier and a second terminal connected to the LC matching circuit unit to a common terminal; and a matching/ESD protecting unit matching impedances between the antenna switch circuit and an antenna and blocking static electricity introduced from the antenna.

Abstract: A semiconductor package includes one or more semiconductor chips to form a semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and/or a molding member including a body that covers the first semiconductor chip and at least one extension that extends from the body. The extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package and including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted.

Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.

Abstract: There is provided a power amplifier that can reduce power consumption by selectively turning a plurality of amplifiers on or off according to the power of a signal to be transmitted. A power amplifier according to an aspect of the invention may include: a first amplification section amplifying an input signal by a predetermined gain; a second amplification section having a plurality of amplification units re-amplifying the input signal, amplified by the first amplification section, by predetermined gains; and a switch section supplying or cutting off power to the plurality of amplification units according to an switching signal to selectively operate the plurality of amplification units.

Abstract: There is provided an integrated passive device assembly. An integrated passive device assembly according to an aspect of the invention may include: a board having a wiring pattern provided thereon; an integrated passive device mounted on an upper surface of the board and having conductive patterns provided on upper and lower surfaces thereof; a first connection portion electrically connecting the conductive pattern, provided on the upper surface of the integrated passive device, and the wiring pattern to each other; and a second connection portion electrically connecting the conductive pattern, provided on the lower surface of the integrated passive device, and the wiring pattern to each other.

Abstract: Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided.

Abstract: There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an insulating material, and having an integrated passive device mounted on an upper surface thereof; a conductive pattern disposed inside the mounting part; and a connecting part disposed on the substrate and electrically connected to the integrated passive device. The connecting part and the conductive pattern are electrically connected to the wiring pattern.