Abstract: An electrocardiogram (ECG) sensor includes an analog front end device configured to remove a DC offset in a first ECG signal received from a measuring electrode, and adjust a gain amplification value based on the first ECG signal. The analog front end device is configured to output an adjusted first ECG signal, the adjusted first ECG signal being based on the adjusted gain amplification value and the removed DC offset in the first ECG signal. The ECG sensor includes a digital signal processor configured to analyze and process the adjusted first ECG signal based on an algorithm and to output information. The analog front end device is configured to remove the DC offset in the first ECG signal during a first period, and remove a DC offset in a second ECG signal and simultaneously adjust a gain amplification value for the second ECG signal during a second period.

Abstract: A stage device includes a stage configured to move in an X-axis direction and a Y-axis direction, an X-axis interference reflector spaced apart from the stage in the X-axis direction, a first X-axis interferometer disposed on the stage that is configured to measure an X-axis location of the stage using the X-axis interference reflector, and an optical movable element spaced apart from the stage in the Y-axis direction that is configured to shift in the X-axis direction a path of a light beam propagating in the Y-axis direction according to movement of the stage in the X-axis direction.

Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

Abstract: An apparatus for fabricating semiconductor devices includes a chamber having a bottom plane, a side wall and a lid. An irradiating unit is at an interior of the chamber. A substrate mounting unit is between the bottom plane of the chamber and the irradiating unit. The irradiating unit includes an irradiating tube and a hole penetrating the central region of the irradiating tube. The irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is opened to the substrate mounting unit.

Abstract: A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip.

Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.

Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.

Abstract: A stage device includes an interference mirror extending in an X-axis direction and first through third flexure structures configured to restrict the interference mirror. The first flexure structure restricts the interference mirror in a Y-axis direction and a Z-axis direction. The second flexure structure restricts the interference mirror in the Y-axis direction and the Z-axis direction. The third flexure structure restricts the interference mirror in the X-axis direction and the Z-axis direction.

Abstract: An image processing apparatus includes an adaptive interpolation device which converts a MFA pattern image into a quincuncial pattern image based on difference values, and interpolates color channels and an NIR channel, based on difference values of the converted quincuncial pattern image in vertical and horizontal pixel directions; a frequency compensation device which obtains a high-resolution MFA image using high-frequency and medium-frequency components of a high-resolution base image, based on linear regression analysis and compared energy levels of MFA channel images to an energy level of a base image; and a channel interference suppression device which removes color distortion generated between each channel of the high-resolution MFA image, and another channel of the high-resolution MFA image and a base channel using a weighted average of pixel value differences between each channel of the high-resolution MFA image, and the other channel of the high-resolution MFA image and the base channel.

Abstract: The present invention provides an apparatus and method for personalized sensory media play based on the inferred relationship between sensory effects and user's emotional responses. The apparatus for sensory media play comprises a sensory media playing unit playing sensory media, an emotion inference unit inferring an emotional state of a user based on a compound emotional signal of the user measured at the time of playing the sensory media; and a sensory effect determining unit determining a sensory effect property of the sensory media based on the inferred emotional state of the user, where the sensory media playing unit plays the sensory media according to the sensory effect property determined.

Abstract: There are provided a power combiner implemented by a printed circuit board, a power amplifying module having the same, and a signal transceiving module.

Abstract: There is provided a dual communications network base station apparatus including: a first UTRA network transmitting and receiving first data including pairs information via a previously set first communications band; a second UTRA network transmitting and receiving second data including the pairs information via a second communications band different from the first communications band; a core network combining the first data and the second data by using the pairs information during wireless reception, dividing the first data and the second data including the pairs information according to a previously set division rate during wireless transmission, and providing the corresponding UTRA network with the divided first data and second data; and a server communicating data including the first and second data with the core network.

Abstract: A method and apparatus for reducing noise of a video image are provided. The method includes: reducing noise in a difference between a current frame and a previous frame in which temporal noise is reduced; detecting motion information about the current frame based on the difference in which the noise is reduced; reducing temporal noise in the current frame via a weighted sum of the current frame and the previous frame in which the temporal noise is reduced, according to the motion information; and reducing spatial noise in the current frame based on an edge direction of the current frame in which the temporal noise is reduced.

Abstract: Disclosed herein is a method of preparing an isotropic pitch for carbon fiber having a high softening point, and more particularly, a method of preparing an isotropic pitch for carbon fiber by mixing petroleum residues with C9 fraction to form a mixture and then heating the mixture to perform heat polymerization. With the method of preparing an isotropic pitch according to the present invention, a separate catalyst is not required, and the isotropic pitch for carbon fiber having a low softening point may be prepared with a high yield even at a relatively low temperature.

Abstract: A Bluetooth device and a method of searching for a peripheral Bluetooth device using a previous search results are provided.

Abstract: The present invention relates to an image encoding method using an adaptive preprocessing scheme, including loading an input image for each frame, determining an encoding type of each of the frames, determining the size of a block to be encoded in each frame according to the determined encoding type, determining blocks that can be replicated from the blocks having the determined size and performing an intra-picture replication preprocessing or inter-picture replication preprocessing procedure on the determined blocks according to the encoding types of the frames, and encoding the frames on which the preprocessing procedure has been performed.

Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

Abstract: A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip.

Abstract: A stage device includes a stage configured to move in an X-axis direction and a Y-axis direction, an X-axis interference reflector spaced apart from the stage in the X-axis direction, a first X-axis interferometer disposed on the stage that is configured to measure an X-axis location of the stage using the X-axis interference reflector, and an optical movable element spaced apart from the stage in the Y-axis direction that is configured to shift in the X-axis direction a path of a light beam propagating in the Y-axis direction according to movement of the stage in the X-axis direction.

Abstract: The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.