Abstract: In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

Abstract: A semiconductor device includes a substrate, a gate structure disposed on the substrate and which includes a gate insulating layer and a gate electrode layer, a first nitride layer disposed on the substrate and the gate structure and which includes silicon, and a second nitride layer that is disposed on the first nitride layer and has an atomic percentage of silicon less than that of the first nitride layer.

Abstract: Disclosed herein are a tunable capacitance control circuit and a tunable capacitance control method. The tunable capacitance control method is a tunable capacitance control method by a tunable capacitance control circuit including an MIM capacitor, a plurality of FET switches, and a control unit, wherein the control unit outputs control signals allowing only one of the plurality of (n) FET switches to be switched on and the remaining (n-1) FET switches to be switched off to the plurality of FET switches, thereby obtaining a desired tunable capacitance value.

Abstract: Disclosed herein is a variable capacitor module, including: a capacitor circuit part including a plurality of capacitor units connected in parallel with each other; and a switching circuit part including a plurality of switch units connected between the plurality of capacitor units, and varying a capacitance of the capacitor circuit part by selecting at least one capacitor unit according to operations of the switch units, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed.

Abstract: Disclosed herein is a variable capacitor module, including a variable capacitor circuit part including a first capacitor unit, a second capacitor unit connected in parallel with the first capacitor unit, and first and second switch units connected between the first and second capacitor units, and selecting at least one capacitor unit according to operations of the first and second switch units, wherein the variable capacitor circuit part is present in plural, and the plural variable capacitor parts are connected in parallel with each other, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed.

Abstract: A semiconductor package including a circuit board including a plurality of pads; a support structure disposed on the circuit board; and a plurality of semiconductor chips stacked on the circuit board and the support structure, each semiconductor chip including at least one pad. For each semiconductor chip, the at least one pad is aligned with a corresponding pad of the circuit board; and an electrical connection is formed between the at least one pad and the corresponding pad of the circuit board through the support structure.

Abstract: An image encoding method using a Binary Partition Tree (BPT) includes performing the BPT on a reference frame, detecting blocks, each having a difference in a pixel value exceeding a threshold value in a current frame, based on a result of the BPT of the reference frame, and performing the BPT of the current frame on the detected blocks. In accordance with the present invention, block partition is not applied to all frames, but a partial partition method based on a difference between the pixel values of a reference frame and a current frame to be encoded is provided. Accordingly, the encoding speed within the P frame or the B frame can be improved. Furthermore, the PSNR of a corresponding frame can be maintained within a specific range of the PSNR of a reference frame, and a compression effect can be improved.

Abstract: A solar cell includes: a semiconductor substrate having a first portion and a second portion; an emitter portion of the semiconductor substrate arranged on a front surface of the semiconductor substrate and extending to a rear surface of the first portion of the semiconductor substrate; a first electrode electrically connected to the emitter portion of the semiconductor substrate and arranged on the rear surface of the semiconductor substrate; and a second electrode electrically connected to the semiconductor substrate and arranged on the rear surface of the semiconductor substrate. The first portion of the semiconductor substrate is thinner than the second portion of the semiconductor substrate.

Abstract: Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.

Abstract: Provided are an image display apparatus and method which enables a user to quickly and easily obtain information related to an image currently being reproduced. The image display apparatus includes: a setting module setting a plurality of sub regions into which a predetermined image frame of an image being played back are divided according to color; and a mapping module mapping one or more thumbnail images of one or more relevant contents related to the image to one or more sub regions selected from the sub regions.

Abstract: The present invention relates to an image encoding method using an adaptive preprocessing scheme, including loading an input image for each frame, determining an encoding type of each of the frames, determining the size of a block to be encoded in each frame according to the determined encoding type, determining blocks that can be replicated from the blocks having the determined size and performing an intra-picture replication preprocessing or inter-picture replication preprocessing procedure on the determined blocks according to the encoding types of the frames, and encoding the frames on which the preprocessing procedure has been performed.

Abstract: A method and apparatus for reducing noise of a video image are provided. The method includes: reducing noise in a difference between a current frame and a previous frame in which temporal noise is reduced; detecting motion information about the current frame based on the difference in which the noise is reduced; reducing temporal noise in the current frame via a weighted sum of the current frame and the previous frame in which the temporal noise is reduced, according to the motion information; and reducing spatial noise in the current frame based on an edge direction of the current frame in which the temporal noise is reduced.

Abstract: A circuit for detecting a voltage change is described. The circuit includes a supply insensitive pulse generator that generates a pulse signal. The circuit also includes a time-to-digital converter coupled to the supply insensitive pulse generator. The time-to-digital converter generates a digital signal based on the pulse signal and a voltage. The circuit also includes a controller coupled to the time-to-digital converter that detects a voltage change based on the digital signal.

Abstract: The water-soluble resin composition for forming fine patterns comprises a water-soluble polymer represented by Chemical Formula 1 and a first water-soluble solvent. The composition is coated and heated on a photoresist layer having contact holes to reduce a size of the contact holes.

Abstract: Provided are a multimedia play apparatus and method. The multimedia play apparatus and method enable synchronization between an audio and a video through existing multimedia play time information, and even in a multimedia service that simultaneously provides multimedia and a message, the multimedia play apparatus and method enable synchronization between multimedia and a message that occurs by terminal characteristics between different environments and different users on the basis of existing multimedia play time information and multimedia meaning information. Moreover, by performing synchronization between multimedia and a message on the basis of the multimedia meaning information, the multimedia play apparatus and method can prevent the damage of a multimedia service that provides multimedia and a message together because of a spoiler corresponding to a malicious message.

Abstract: The present invention relates to a composition for inducing embryonic stem cell differentiation comprising a MEK/ERK (mitogen-activated protein kinase kinase/extracellular regulated kinase) signal transduction inhibitor and BMP (bone morphogenetic protein), and a method for inducing differentiation of embryonic stem cells into mesodermal cells using the same. Further, the mesodermal cells obtained by the above method are able to differentiate into various mesenchymal tissue cells. In particular, the present invention relates to a method for inducing differentiation into hemangioblast by culturing the mesodermal cells obtained by the above method in the presence of VEGF (vascular endothelial cell growth factor) and bFGF (basic fibroblast growth factor). The differentiated hemangioblasts can be further differentiated into vascular endothelial cells, vascular smooth muscle cells, and hematopoietic stem cells under various culture conditions.

Abstract: A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement.

Abstract: A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.

Abstract: A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.