Abstract: Disclosed herein is a method of preparing an isotropic pitch for carbon fiber having a high softening point, and more particularly, a method of preparing an isotropic pitch for carbon fiber by mixing petroleum residues with C9 fraction to form a mixture and then heating the mixture to perform heat polymerization. With the method of preparing an isotropic pitch according to the present invention, a separate catalyst is not required, and the isotropic pitch for carbon fiber having a low softening point may be prepared with a high yield even at a relatively low temperature.

Abstract: A Bluetooth device and a method of searching for a peripheral Bluetooth device using a previous search results are provided.

Abstract: The present invention relates to an image encoding method using an adaptive preprocessing scheme, including loading an input image for each frame, determining an encoding type of each of the frames, determining the size of a block to be encoded in each frame according to the determined encoding type, determining blocks that can be replicated from the blocks having the determined size and performing an intra-picture replication preprocessing or inter-picture replication preprocessing procedure on the determined blocks according to the encoding types of the frames, and encoding the frames on which the preprocessing procedure has been performed.

Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

Abstract: A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip.

Abstract: A stage device includes a stage configured to move in an X-axis direction and a Y-axis direction, an X-axis interference reflector spaced apart from the stage in the X-axis direction, a first X-axis interferometer disposed on the stage that is configured to measure an X-axis location of the stage using the X-axis interference reflector, and an optical movable element spaced apart from the stage in the Y-axis direction that is configured to shift in the X-axis direction a path of a light beam propagating in the Y-axis direction according to movement of the stage in the X-axis direction.

Abstract: The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

Abstract: Disclosed herein are a tunable capacitance control circuit and a tunable capacitance control method. The tunable capacitance control method is a tunable capacitance control method by a tunable capacitance control circuit including an MIM capacitor, a plurality of FET switches, and a control unit, wherein the control unit outputs control signals allowing only one of the plurality of (n) FET switches to be switched on and the remaining (n?1) FET switches to be switched off to the plurality of FET switches, thereby obtaining a desired tunable capacitance value.

Abstract: There are provided a dual mode communications device and a method of improving a data rate thereof. The dual mode communications device according to the embodiment of the present invention may include a selection unit 100 connecting antenna terminals to receive terminals or transmit terminals, a receive path circuit unit allowing RF receive signals from each of the first and second antennas to pass therethrough, a transmit path circuit unit providing RF transmit signals to the transmit terminals of the selection unit, an RF circuit unit converting the RF receive signals from the receive path circuit unit into baseband signals and converting the baseband signals to be transmitted into the RF transmit signals, and a baseband circuit unit performing control and signal processing of the selection unit in a single communications mode among a dual mode and a single mode.

Abstract: In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.

Abstract: A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and a coupling device configured to couple the fixing brackets to the fixing plate.

Abstract: A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. (In Chemical Formula 1, each of R1, R2, R3 and R5 independently represents an alkyl group of C1-30 or an cyclo alkyl group of C3-30 which respectively have one selected from the group consisting of hydrogen, an ether group, an ester group, a carbonyl group, an acetal, an epoxy group, a nitril group, an amine group, and an aldehyde group; each of R4, R6, R7 and R8 independently represents hydrogen or a methyl group; n represents an integer of 0 to 5; a represents a real number of 0.05 to 0.5; each of b, c and d respectively represents a real number of 0 to 0.7; and a+b+c+d=1).

Abstract: There is provided a variable capacitance circuit, including a capacitance circuit unit connected between a first terminal and a second terminal and providing a preset capacitance, a variable capacitance circuit unit including a first transistor connected to the capacitance circuit unit in series between the first terminal and the second terminal, the first transistor being operated according to a gate voltage, and a switching unit connected between a body of the first transistor and an input terminal of a preset body voltage, wherein the switching unit is turned off when the first transistor is turned on and turned on when the first transistor is turned off.

Abstract: An image processing apparatus includes an adaptive interpolation device which converts a MFA pattern image into a quincuncial pattern image based on difference values, and interpolates color channels and an NIR channel, based on difference values of the converted quincuncial pattern image in vertical and horizontal pixel directions; a frequency compensation device which obtains a high-resolution MFA image using high-frequency and medium-frequency components of a high-resolution base image, based on linear regression analysis and compared energy levels of MFA channel images to an energy level of a base image; and a channel interference suppression device which removes color distortion generated between each channel of the high-resolution MFA image, and another channel of the high-resolution MFA image and a base channel using a weighted average of pixel value differences between each channel of the high-resolution MFA image, and the other channel of the high-resolution MFA image and the base channel.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.

Abstract: Semiconductor packages capable of reducing a total height thereof and methods of manufacturing the semiconductor package are provided. The semiconductor package includes a semiconductor substrate having first and second surfaces opposite to each other, a semiconductor device formed on the first surface of the semiconductor substrate, pads formed on the first surface of the semiconductor substrate and electrically connected to the semiconductor device, and at least one printed circuit layer including a resin layer, via electrodes penetrating through the resin layer, and line layers formed on the first resin layer and connected to the via electrodes and attached onto the first surface of the semiconductor substrate. The via electrodes and the line layers are formed of the same type of material, and the via electrodes are electrically connected to the pads.

Abstract: There are provided a dual mode communications device and a method of improving a data rate thereof. The dual mode communications device according to the embodiment of the present invention may include a selection unit 100 connecting antenna terminals to receive terminals or transmit terminals, a receive path circuit unit allowing RF receive signals from each of the first and second antennas to pass therethrough, a transmit path circuit unit providing RF transmit signals to the transmit terminals of the selection unit, an RF circuit unit converting the RF receive signals from the receive path circuit unit into baseband signals and converting the baseband signals to be transmitted into the RF transmit signals, and a baseband circuit unit performing control and signal processing of the selection unit in a single communications mode among a dual mode and a single mode.

Abstract: Provided is an LCD capable of compensating for a resistance variation in a link unit. The resistance variations in the gate lines, data lines and common lines are reduced to minimize the signal distortion in the LCD. Accordingly, it is possible to enhance the image quality characteristics of the LCD. The resistance variation can be reduced by adjusting the number or the size of contact holes in the link unit.

Abstract: A double metal cyanide catalyst of the present invention having a controlled reactivity for preparing a polyol, which contains an ether ligand having a molecular weight of less than 200 and a glycol ligand having a molecular weight of less than 200 can be used in the preparation of a polyol having a unsaturation degree suitable for direct use for producing a polyurethane having suitable properties.

Abstract: A circuit for detecting a voltage change is described. The circuit includes a supply insensitive pulse generator that generates a pulse signal. The circuit also includes a time-to-digital converter coupled to the supply insensitive pulse generator. The time-to-digital converter generates a digital signal based on the pulse signal and a voltage. The circuit also includes a controller coupled to the time-to-digital converter that detects a voltage change based on the digital signal.