Abstract: A printed wiring board includes a resin insulating layer, pads formed on the resin insulating layer, an uppermost resin insulating layer formed on the resin insulating layer such that the uppermost resin insulating layer is covering the pads and has openings exposing the pads, respectively, via conductors formed in the uppermost resin insulating layer such that the via conductors are formed on the pads exposed from the openings in the uppermost resin insulating layer, respectively, and metal posts formed on the via conductors such that each of the metal posts has a portion on a surface of the uppermost resin insulating layer around the via conductors and a side surface having a flared bottom extending toward the uppermost resin insulating layer.

Abstract: A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

Abstract: A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad, and a solder resist layer formed on the insulating layer such that the solder resist layer has an opening entirely exposing an upper surface and a side surface of the conductor pad. The conductor layer is formed such that the conductor pad has a pad body extending along a surface of the insulating layer, and a protective layer covering an upper surface and a side surface of the pad body and including material different from material of the pad body, and the pad body of the conductor pad has a notch part formed at a peripheral edge portion of the pad body such that the notch part separates a lower surface of the pad body and the surface of the insulating layer and is filled with the protective layer.

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and having openings exposing the conductor pads, respectively, and plating bumps formed on the conductor pads such that each of the plating bumps includes a base plating layer formed in a respective one of the openings of the solder resist layer, and a top plating layer formed on the base plating layer. The plating bumps are formed such that the base plating layer has an upper surface and a side surface including a portion protruding from the solder resist layer and having a rough surface and that the top plating layer has a hemispherical shape and is covering only the upper surface of the base plating layer.

Abstract: A laser welding apparatus is equipped with a laser head that emits a laser beam and an airflow forming unit that forms sheet-shaped airflows, in which the airflows formed by the airflow forming unit traverse an optical path of the laser beam emitted from the laser head, the airflows traversing the optical path at multiple positions which are spaced from each other in a direction along the optical path in a same direction. The airflow forming unit has an opening between the airflows at the multiple positions, the opening penetrating in a direction in which the airflows traverse the optical path.

Abstract: A photograph shooting device or the like which enables detection of illegal shooting, and implement electronic application using this device. The device performs operation instruction on a subject (operation instruction unit), and determines whether the subject is a living body by shooting a moving image of the movement of the subject responding to operation instruction and analyzing the shot image (living body determination unit). The device shoots an application image that is a photograph used for an application procedure (application image shooting unit). The device compares image cut from moving image with the application image, and determines whether the shot persons match (same person determination unit). When the subject is determined to be the living body, and a subject responding to the operation instruction is determined to match the subject in the application image, the device outputs the application image to a prescribed server (data output unit).

Abstract: A wiring substrate includes an insulating layer having a through hole, a first conductor layer formed on a first surface of the insulating layer, a second conductor layer formed on a second surface of the insulating layer, an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers, and a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole. The interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 ?m to 2000 ?m in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.

Abstract: A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad, and a solder resist layer formed on the insulating layer such that the solder resist layer has an opening entirely exposing an upper surface and a side surface of the conductor pad. The conductor layer is formed such that the conductor pad has a pad body extending along a surface of the insulating layer, and a protective layer covering an upper surface and a side surface of the pad body and including material different from material of the pad body, and the pad body of the conductor pad has a notch part formed at a peripheral edge portion of the pad body such that the notch part separates a lower surface of the pad body and the surface of the insulating layer and is filled with the protective layer.

Abstract: A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

Abstract: A printed wiring board includes a resin insulating layer, pads formed on the resin insulating layer, an uppermost resin insulating layer formed on the resin insulating layer such that the uppermost resin insulating layer is covering the pads and has openings exposing the pads, respectively, via conductors formed in the uppermost resin insulating layer such that the via conductors are formed on the pads exposed from the openings in the uppermost resin insulating layer, respectively, and metal posts formed on the via conductors such that each of the metal posts has a portion on a surface of the uppermost resin insulating layer around the via conductors and a side surface having a flared bottom extending toward the uppermost resin insulating layer.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and having openings exposing the conductor pads, respectively, and plating bumps formed on the conductor pads such that each of the plating bumps includes a base plating layer formed in a respective one of the openings of the solder resist layer, and a top plating layer formed on the base plating layer. The plating bumps are formed such that the base plating layer has an upper surface and a side surface including a portion protruding from the solder resist layer and having a rough surface and that the top plating layer has a hemispherical shape and is covering only the upper surface of the base plating layer.

Abstract: A printed wiring board includes an insulating substrate having openings, a first conductor layer formed on a first surface of the insulating substrate, a second conductor layer formed on a second surface of the insulating substrate, magnetic material portions formed in the openings of the insulating substrate and having through holes extending from the first surface to second surface of the insulating substrate, and through-hole conductors formed on side walls of the through holes such that the through-hole conductors connect the first conductor layer and second conductor layer. The magnetic material portions include magnetic particles and resin such that the magnetic particles include particles forming the side walls and that gaps are formed between the particles and the resin, and each of the through-hole conductors includes a chemical copper plating film such that the chemical copper plating film is deposited in the gaps formed between the particles and the resin.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer such that the solder resist layer has first opening exposing the first pad and second opening exposing the second pad with diameter smaller than diameter of the first opening, and bumps including a first bump on the first pad and a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump has a base plating layer formed in the first opening and having raised portion, and a top plating layer formed on the base plating layer, and the second bump has a base plating layer formed in the second opening and having raised portion, and a top plating layer formed on the base plating layer.

Abstract: A wiring substrate includes an insulating layer having a through hole, a first conductor layer formed on a first surface of the insulating layer, a second conductor layer formed on a second surface of the insulating layer, an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers, and a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole. The interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 ?m to 2000 ?m in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole, and a second through-hole conductor including a metal film formed in the second through hole. The core substrate and the magnetic resin are formed such that a surface in the first through hole has a roughness that is larger than a roughness of a surface in the second through hole.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.