Abstract: A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.

Abstract: A galvano scanner that irradiates an object with a laser beam to perform machining, the galvano scanner comprising: an emission unit that emits the laser beam; a protective glass that protects the emission unit from a scattered matter generated in machining; and a glass holding mechanism that holds the protective glass, the protective glass at least including a triple structure in a vertical direction, the glass holding mechanism holding the protective glass that is the lowermost layer in the protective glass having the triple structure so that the protective glass that is the lowermost layer can be fallen off downward.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening formed in the core substrate such that the magnetic resin has second through holes formed therein, a first through-hole conductor formed in the first through hole of the core substrate and including a metal film formed in the first through hole of the core substrate, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin, respectively.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

Abstract: A laser welding apparatus is equipped with a laser head that emits a laser beam and an airflow forming unit that forms sheet-shaped airflows, in which the airflows formed by the airflow forming unit traverse an optical path of the laser beam emitted from the laser head, the airflows traversing the optical path at multiple positions which are spaced from each other in a direction along the optical path in a same direction. The airflow forming unit has an opening between the airflows at the multiple positions, the opening penetrating in a direction in which the airflows traverse the optical path.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer such that the solder resist layer has first opening exposing the first pad and second opening exposing the second pad with diameter smaller than diameter of the first opening, and bumps including a first bump on the first pad and a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump has a base plating layer formed in the first opening and having raised portion, and a top plating layer formed on the base plating layer, and the second bump has a base plating layer formed in the second opening and having raised portion, and a top plating layer formed on the base plating layer.

Abstract: The blower of the present invention comprises a gas blowing part which holds an impeller which blows gas, a motor part which holds a rotor which makes the impeller rotate, and a partition wall part which partitions the gas blowing part from the motor part. The top end part of the rotor in the axial direction passes through the partition wall part and supports the center of rotation part of the impeller present inside the gas blowing part. At the through hole of the partition wall part through which the top end part of the rotor in the axial direction passes, a noncontact type shaft seal is arranged. Further, the surface of the partition wall part facing the impeller is formed with a groove for trapping foreign matter.

Abstract: To provide a galvanometer scanner that increases reliability by reducing burden on a mechanism unit. A galvanometer scanner converts a command for machining position on a machining target to movement commands for a rotary motor, a rotary motor, and a direct drive mechanism. If the movement command for the direct drive mechanism contains a weak direct drive component depending on the movement command for the rotary motor, and falling within an amplitude range not exceeding a predetermined amplitude and within a frequency range not falling below a predetermined frequency, the galvanometer scanner removes the weak direct drive component from the movement command for the direct drive mechanism, and then outputs control signals corresponding to the movement commands for the rotary motors and the direct drive mechanism. The galvanometer scanner controls the rotary motors and the direct drive mechanism based on the control signals.

Abstract: A galvano scanner that irradiates an object with a laser beam to perform machining, the galvano scanner comprising: an emission unit that emits the laser beam; a protective glass that protects the emission unit from a scattered matter generated in machining; and a glass holding mechanism that holds the protective glass, the protective glass at least including a triple structure in a vertical direction, the glass holding mechanism holding the protective glass that is the lowermost layer in the protective glass having the triple structure so that the protective glass that is the lowermost layer can be fallen off downward.

Abstract: To provide a galvanometer scanner that increases reliability by reducing burden on a mechanism unit. A galvanometer scanner converts a command for machining position on a machining target to movement commands for a rotary motor, a rotary motor, and a direct drive mechanism. If the movement command for the direct drive mechanism contains a weak direct drive component depending on the movement command for the rotary motor, and falling within an amplitude range not exceeding a predetermined amplitude and within a frequency range not falling below a predetermined frequency, the galvanometer scanner removes the weak direct drive component from the movement command for the direct drive mechanism, and then outputs control signals corresponding to the movement commands for the rotary motors and the direct drive mechanism. The galvanometer scanner controls the rotary motors and the direct drive mechanism based on the control signals.

Abstract: A manufacturing apparatus for manufacturing a blower blade including a plurality of blade portions having the same shape and arranged around a rotation axis line includes a machining device for machining the blower blade and a control device for controlling the machining device. The control device includes a command creation unit for creating an operation command to the machining device according to a machining program and a machining parameter, a balance measurement unit for measuring balance of the blower blade, and a machining amount adjustment unit configured to individually adjust a machining amount of each of the blade portions without changing the machining program, based on data of the balance of the blower blade measured by the balance measurement unit so as to reduce unbalance of the blower blade. A manufacturing method using the above-described manufacturing apparatus is also provided.

Abstract: A method for manufacturing a printed wiring board includes forming a through hole in an insulating substrate such that the through hole penetrates through the substrate and has first tapered hole, second tapered hole and minimum diameter portion connecting the first and second tapered holes at a position displaced toward first or second surface of the substrate from a mid-point of the through hole in thickness direction of the substrate, and applying electrolytic plating to the substrate while flowing an electrolytic plating solution including a deposition inhibitor into the through hole from the first and second tapered holes and increasing an amount of the inhibitor adsorbing to electrolytic metal plating depositing at the minimum diameter portion such that electrolytic metal plating forms a closed portion closing the through hole substantially at the mid-point and fills the first and second tapered holes to form a through-hole conductor in the through hole.

Abstract: The blower of the present invention comprises a gas blowing part which holds an impeller which blows gas, a motor part which holds a rotor which makes the impeller rotate, and a partition wall part which partitions the gas blowing part from the motor part. The top end part of the rotor in the axial direction passes through the partition wall part and supports the center of rotation part of the impeller present inside the gas blowing part. At the through hole of the partition wall part through which the top end part of the rotor in the axial direction passes, a noncontact type shaft seal is arranged. Further, the surface of the partition wall part facing the impeller is formed with a groove for trapping foreign matter.

Abstract: An impeller (10) where each of the blades (34) includes a first part (14) which is positioned at a base end side of the hub (5) and a second part (24) which is positioned at a distal end side of the hub, the first part being formed by connecting a first hub surface curve (12) which extends along a hub surface of the hub and a first shroud surface curve (11) which extends along a shroud surface of the blade by a first group of lines (13), and the second part is formed by connecting a second hub surface curve (22) which extends along a hub surface of the hub and connects with the first hub surface curve and a second shroud surface curve (21) which extends along the shroud surface and connects with the first shroud surface curve by a second group of lines (23).

Abstract: A wiring board includes a first resin insulation layer, a conductive layer formed on the first insulation layer and including first and second conductive circuits formed adjacent to each other, and a second resin insulation layer formed on the first insulation layer and on the conductive layer such that the second insulation layer is filling a space between the first and second conductive circuits. The first and second conductive circuits are formed such that a distance between the first conductive circuit and the second conductive circuit is in a range of 10 ?m or less at the first insulation layer, and each of the first and second conductive circuits has a bottom portion in contact with the first insulation layer and an upper portion on the bottom portion such that the upper portion has a roughened sidewall and the bottom portion has a sidewall which is not roughened.

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.