Patents by Inventor Satoshi Hirano

Satoshi Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9570965
    Abstract: A rotor coil for a revolving armature includes a strand coil that includes a part arranged in a core slot of the rotor and is composed of a plurality of element wires; and a solid coil welded to an end of the strand coil wherein the end of the strand coil and an end of the solid coil are welded by friction stir welding. A manufacturing method of a rotor coil includes the step of performing friction stir welding wherein the friction stir welding is performed for the butt joint with the end of the strand coil arranged in an advancing side defined by a rotation direction of a tool and with the solid coil arranged in a retreating side.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: February 14, 2017
    Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventors: Ryosuke Umezu, Yasuaki Kageyama, Juichi Enyama, Seunghwan Park, Satoshi Hirano
  • Patent number: 9548606
    Abstract: According to one embodiment, the A/D conversion unit includes a ?? modulating device which samples the analog electric quantity provided by the electric power system with a predetermined modulation frequency and outputs a bit stream changing over time of single bit obtained by performing ?? modulation, and the digital operation processing unit includes one or more digital filters which inputs the bit stream from the ?? modulating device and of which frequency characteristics differ according to a type of protection control operation, and one or more operation processing elements which perform different kinds of protection control operation processing, based on the bit stream provided by the digital filter.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: January 17, 2017
    Assignees: KABUSHIKI KAISHA TOSHIBA, NATIONAL UNIVERSITY CORPORATION NAGOYA INSTITUTE OF TECHNOLOGY
    Inventors: Daiju Itagaki, Shogo Miura, Katsuhiko Sekiguchi, Satoshi Hirano
  • Patent number: 9524888
    Abstract: A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: December 20, 2016
    Assignee: NHK Spring Co., Ltd.
    Inventors: Takashi Kayamoto, Satoshi Hirano
  • Patent number: 9453596
    Abstract: A member with flow passage includes: a base member; a plate-like member including two flat plate portions that are positioned at both widthwise ends and have main surfaces passing over one and the same plane, and a convex portion that is provided between the two flat plate portions and has a cross section shaped in a thickness direction so as to protrude with respect to the flat plate portions, and forming the flow passage; and a metal deposit layer that is formed by, while main surfaces of the flat plate portions opposite to a top of the convex portion are facing the base member, accelerating powder of metal or alloy together with a gas, and spraying and depositing the powder in a solid-phase state on a surface of the plate-like member at the top side of the convex portion and a surface of the base member.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: September 27, 2016
    Assignee: NHK Spring Co., Ltd.
    Inventors: Yuichiro Yamauchi, Hidemitsu Hideshima, Satoshi Hirano
  • Publication number: 20160229389
    Abstract: Section acquisition systems, methods, and programs acquire a scheduled travel route of a vehicle driven by at least one of an internal combustion engine or a motor. The systems, methods, and programs divide the scheduled travel route that is in a range of a predetermined distance from a current location into a plurality of sections such that a difference in traffic congestion degree is distinguished, and divide the scheduled travel route that is not in the range of the predetermined distance from the current location into a plurality of sections such that a difference in travel load is distinguished.
    Type: Application
    Filed: June 18, 2014
    Publication date: August 11, 2016
    Applicants: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi HIRANO, Takayuki MIYAJIMA, Tomoki KODAN, Kuniaki TANAKA
  • Publication number: 20160223344
    Abstract: A travel information recording system for associating travel information on a vehicle obtained immediately after travel through a branch location with an appropriate road segment includes: travel segment specifying unit for specifying a travel segment that is a road segment in which a vehicle is traveling; and travel information recorder for recording travel information on the vehicle obtained during travel in the travel segment in association with the travel segment in a storage medium. In the case where there occurs a segment variation in which the travel segment is varied from one of several road segments branched off from a branch location, the travel information recorder acquires the travel information to be recorded in association with a post-variation segment, which is the travel segment after the segment variation, on the basis of the travel information obtained before the segment variation.
    Type: Application
    Filed: August 18, 2014
    Publication date: August 4, 2016
    Applicants: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenta SANAMI, Satoshi HIRANO, Takayuki MIYAJIMA, Tomoki KODAN, Kuniaki TANAKA
  • Publication number: 20160193689
    Abstract: A friction stir welding method for bonding a to-be bonded material, includes: a step of supplying nitrogen and introducing nitrogen into the to-be bonded material while melting the to-be bonded material; and a step of friction stir welding a portion of the non-bonded material in which the nitrogen is introduced. A friction stirring device for bonding a to-be bonded material, includes: a heating source for melting the to-be bonded material; a nitrogen supply source for supplying nitrogen to a melted portion of the to-be bonded material and introducing nitrogen into the to-be bonded material; and a friction stir tool for friction stir welding a portion of the non-bonded material in which the nitrogen is introduced.
    Type: Application
    Filed: September 11, 2013
    Publication date: July 7, 2016
    Applicant: HITACHI, LTD.
    Inventors: Itto SUGIMOTO, Satoshi HIRANO
  • Publication number: 20160167163
    Abstract: A friction stir welding method for welding a member to be welded, includes a step of heating the member to be welded by an applying heat source, a step of flattening a surface of the member to be welded that has been heated, by a smoothing component, and a step of performing friction stir welding to the surface of the member to be welded that has been flattened, by a rotating tool.
    Type: Application
    Filed: July 12, 2013
    Publication date: June 16, 2016
    Inventors: Ittou SUGIMOTO, Satoshi HIRANO
  • Patent number: 9278503
    Abstract: A friction stir welding structure is comprised of a first and a second member integrated into one piece by friction stir welding, and in which a thin section is formed along the friction stir weld section on at least one of either of the first and the second member.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: March 8, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Toshio Hori, Keiichi Uraki, Masato Higuma, Yujiro Kaneko, Satoshi Hirano, Akihiro Sato
  • Publication number: 20160033294
    Abstract: A travel assist system, a travel assist method, and a computer program that prevent frequent corrections of a travel plan due to variations in congestion information are provided. Congestion information is acquired from a VICS center. The current state of a vehicle is acquired. It is determined whether or not the congestion status of an expected travel route for the vehicle has been varied from the congestion information using a criterion based on the state of the vehicle. In the case where it is determined that the congestion status of the expected travel route has been varied, the travel plan 48 is corrected using the congestion status after the variation.
    Type: Application
    Filed: March 3, 2014
    Publication date: February 4, 2016
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Kenta SANAMI, Takayuki MIYAJIMA, Satoshi HIRANO, Akira MATSUDA, Tomoki KODAN, Kuniaki TANAKA
  • Patent number: 9237656
    Abstract: Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: January 12, 2016
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Shinnosuke Maeda, Tetsuo Suzuki, Takuya Hando, Atsuhiko Sugimoto, Satoshi Hirano, Hajime Saiki
  • Patent number: 9187706
    Abstract: A lubricating oil composition employable in combination with a low sulfur content fuel oil is preferably composed of a base oil having a sulfur content of at most 0.2 wt. %, an ashless dispersant comprising an alkenyl- or alkyl-succinimide or a derivative thereof, a metal-containing detergent containing an organic acid metal salt, a zinc dialkyldithiophosphate, a zinc dialkylaryldithiophosphate, and an oxidation inhibitor selected from the group consisting of a phenol compound, an amine compound, and a molybdenum-containing compound, wherein a ratio of the phosphorus content of the zinc dialkyldithiophosphate to the phosphorus content of the zinc dialkylaryldithiophosphate is in the range of 20:1 to 2:1.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: November 17, 2015
    Assignee: CHEVRONTEXACO CORPORATION
    Inventors: Satoshi Hirano, Shigeru Iwamoto, Morikuni Nakazato
  • Patent number: 9162251
    Abstract: A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: October 20, 2015
    Assignee: NHK Spring Co., Ltd.
    Inventors: Satoshi Hirano, Yuichiro Yamauchi, Masaru Akabayashi, Toshihiko Hanamachi
  • Publication number: 20150251196
    Abstract: A film forming method of forming a film by accelerating powder of a material with gas and spraying and depositing the powder onto a surface of a substrate with the powder being kept in a solid state includes: a substrate film forming step of forming a film. The film forming step includes jetting out the powder and inert gas from a nozzle towards the substrate, causing inside of the chamber to be under positive pressure by the inert gas, and depositing the powder on the surface of the substrate.
    Type: Application
    Filed: October 8, 2013
    Publication date: September 10, 2015
    Applicant: NHK SPRING CO., LTD.
    Inventor: Satoshi Hirano
  • Publication number: 20150188116
    Abstract: The present invention provides a joint structure, a joining method, a secondary battery, and a method for manufacturing a secondary battery, capable of improving routing performance and reducing electric resistance. The joint structure includes: a foil assembly 3 including a plurality of foils stacked one on top of the other; a connecting member 4 that fixes the foil assembly 3; and a holding member 5 disposed such that gaps in the foil assembly 3 in the stacking direction are brought into tight contact with each other between the connecting member 4 and the holding member 5. An upper surface 32 of the foil assembly 3, the connecting member 4, and the holding member 5 are joined integrally with each other to form a joint 6.
    Type: Application
    Filed: April 22, 2013
    Publication date: July 2, 2015
    Applicant: Hitachi, Ltd.
    Inventors: Akihiro Sato, Satoshi Hirano, Kenichi Okamoto, Tsunenori Yamamoto
  • Publication number: 20150189784
    Abstract: An electric circuit apparatus includes a power module (300) including a DC positive electrode branch terminal (315D) and a DC negative electrode branch terminal (319D), and a power board (700) which is configured to transfer a direct current and which includes a power board P bus bar and a power board N bus bar sealed by a resin member, which has an insulation property, in such a manner that a P terminal (701) and an N terminal (702) are exposed. The DC positive electrode branch terminal (315D) and the P terminal (701) are held by a flexion member (904) and are connected to each other via a metal joining member having a melting point lower than those of the both terminals. The DC negative electrode branch terminal (319D) and the N terminal (702) are connected to each other in a similar manner. Thus, a thermal influence on the resin member can be reduced and connection durability can be improved.
    Type: Application
    Filed: July 22, 2013
    Publication date: July 2, 2015
    Inventors: Satoshi Hirano, Akihiro Namba, Makoto Ogata, Takeshi Tokuyama, Kinya Nakatsu
  • Patent number: 9006580
    Abstract: Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: April 14, 2015
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Shinnosuke Maeda, Hajime Saiki, Satoshi Hirano
  • Patent number: 8991564
    Abstract: A disk brake includes a caliper body having a cylinder portion (25) with a cylindrical shape. The cylinder portion (25) has a bore (30) with a bottom (34) formed by integrally joining together an opening peripheral edge (98) at the bottom side of the cylinder portion (25) and a bottom cover member (92) to be fitted to the opening peripheral edge (98) through friction stir welding. The bottom cover member (92) has a disk shape and is friction-stir-welded along the outer periphery thereof. The terminating point of the friction stir welding is within the boundaries of the bottom cover member (92).
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: March 31, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Shinji Suzuki, Takahiro Tokunaga, Yuichi Kobayashi, Yasuhisa Omata, Jun Watanabe, Seunghwan Park, Akihiro Sato, Satoshi Hirano, Kazutaka Okamoto
  • Patent number: 8914226
    Abstract: Devices, methods, and programs access map information including link information related to links that constitute a road, acquire a current location of a vehicle at unit time intervals, and acquire traffic information, which includes a distributed traffic congestion level of each link at predetermined time intervals. Each time the vehicle exits a link, the devices, methods, and programs sequentially store the exited link in an exited link train based on the map information. If the traffic information has been received, the devices, methods, and program store the distributed traffic congestion level included in the received traffic information as a traffic congestion level in association with a portion of the exited link train within a range from the current location at a received time point when the traffic information has been received to a location that is a predetermined distance behind the current location at the received time point.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: December 16, 2014
    Assignee: Aisin AW Co., Ltd.
    Inventors: Takayuki Miyajima, Satoshi Hirano, Kiyokazu Okada
  • Patent number: 8859077
    Abstract: A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: October 14, 2014
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Shinnosuke Maeda, Tetsuo Suzuki, Satoshi Hirano