Abstract: To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer 25 having a plurality of openings 35, 36 is disposed on a top surface 31 side, and IC-chip connection terminals 41 and capacitor connection terminals 42 are buried in an outermost resin insulation layer 23 in contact with the solder resist layer 25. Each of the IC-chip connection terminals 41 and the capacitor connection terminals 42 is composed of a copper layer 44 and a plating layer 46 covering the outer surface of the copper layer 44. A conductor layer 26 present at the interface between the solder resist layer 25 and the resin insulation layer 23 is composed of a copper layer 27 and a nickel plating layer 28 covering the outer surface of the copper layer 27.

Abstract: A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

Abstract: A member with flow passage includes: a base member; a plate-like member including two flat plate portions that are positioned at both widthwise ends and have main surfaces passing over one and the same plane, and a convex portion that is provided between the two flat plate portions and has a cross section shaped in a thickness direction so as to protrude with respect to the flat plate portions, and forming the flow passage; and a metal deposit layer that is formed by, while main surfaces of the flat plate portions opposite to a top of the convex portion are facing the base member, accelerating powder of metal or alloy together with a gas, and spraying and depositing the powder in a solid-phase state on a surface of the plate-like member at the top side of the convex portion and a surface of the base member.

Abstract: A friction stir welding structure is comprised of a first and a second member integrated into one piece by friction stir welding, and in which a thin section is formed along the friction stir weld section on at least one of either of the first and the second member.

Abstract: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

Abstract: Devices, methods, and programs determine whether a vehicle has exited a link based on map information. If so, the devices, methods, and programs acquire a travel traffic congestion level of the exited link based on travel information within the exited link, and determine whether the travel traffic congestion level of the exited link coincides with a distributed traffic congestion level at a time when the vehicle exited. If not, the devices, methods, and programs determine whether the traffic information has been updated and the distributed traffic congestion level has been changed within the exited link, and if so, acquire a distribution time rate of each distributed traffic congestion level within the exited link. The devices, methods, and programs determine a traffic congestion level of the exited link based on the distribution time rate of each acquired distributed traffic congestion level and the travel traffic congestion level of the exited link.

Abstract: A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

Abstract: The laminated body includes a ceramic base member having an insulating property, an intermediate layer including metal or alloy as a main component formed on a surface of the ceramic base member, and a metal film layer (a circuit layer and a cooling fin) formed on a surface of the intermediate layer by accelerating a powder of metal or alloy with a gas and spraying and depositing the powder on the surface of the intermediate layer as the powder is in a solid state.

Abstract: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

Abstract: Provided herein are lubricating oil compositions for high performance engines comprising a Group III base oil and a combination of ester base stocks, wherein the combination comprises (i) an ester base stock having a kinematic viscosity at 100° C. of about 2-10 cSt, (ii) an ester base stock having a kinematic viscosity at 100° C. of about 10 to 50 cSt, and (iii) an ester base stock having a kinematic viscosity at 100° C. of greater than about 100 cSt. The lubricating oil composition can further comprise at least one additive. Methods of making and using the lubricating oil compositions are also described.

Abstract: A lamination includes: a substrate formed of aluminum or aluminum alloy; an intermediate layer formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate; and a film layer formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer.

Abstract: In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening.

Abstract: A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.

Abstract: Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic oxide and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer.

Abstract: A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

Abstract: Devices, methods, and programs access map information including link information related to links that constitute a road, acquire a current location of a vehicle at unit time intervals, and acquire traffic information, which includes a distributed traffic congestion level of each link at predetermined time intervals. Each time the vehicle exits a link, the devices, methods, and programs sequentially store the exited link in an exited link train based on the map information. If the traffic information has been received, the devices, methods, and program store the distributed traffic congestion level included in the received traffic information as a traffic congestion level in association with a portion of the exited link train within a range from the current location at a received time point when the traffic information has been received to a location that is a predetermined distance behind the current location at the received time point.

Abstract: Devices, methods, and programs determine whether a vehicle has exited a link based on map information. If so, the devices, methods, and programs acquire a travel traffic congestion level of the exited link based on travel information within the exited link, and determine whether the travel traffic congestion level of the exited link coincides with a distributed traffic congestion level at a time when the vehicle exited. If not, the devices, methods, and programs determine whether the traffic information has been updated and the distributed traffic congestion level has been changed within the exited link, and if so, acquire a distribution time rate of each distributed traffic congestion level within the exited link. The devices, methods, and programs determine a traffic congestion level of the exited link based on the distribution time rate of each acquired distributed traffic congestion level and the travel traffic congestion level of the exited link.

Abstract: A friction stir tool excellent in productivity, high temperature strength, and wear resistance at high temperatures. The friction stir tool is formed of a Co-based alloy comprising crystal grains containing a ?? precipitate phase dispersed and precipitated therein, and a crystal grain boundary region and a precipitate phase between adjacent crystal grains, in which the precipitate phase is at least one phase selected from a ? phase, a Laves phase and a carbide phase.

Abstract: It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate; an intermediate layer formed on the surface of the ceramic substrate and having a metal-containing principal component metal layer and an active ingredient layer including metal, a metal oxide, or a metal hydride; and a metal coating formed on the surface of the intermediate layer by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state.

Abstract: A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A2 to a thickness corresponding to the area A2 is greater than the ratio of a total thickness of the second-type resin insulation layers located in an area A1 to a thickness corresponding to the area A1. The laminate structure is warped such that the laminate structure is convex toward the side where the second main face is present.