Abstract: A blow-by gas collection passage (91) extends in a cylinder block (1) and a cylinder head (3). A crank chamber (61) is connected to an oil separator (92) through the blow-by gas collection passage (91). A cutout portion is formed in an upper end portion of a wall portion (97) of the blow-by gas collection passage (91), and the oil separator (92) contacts an upper surface of the cylinder head (3) to form a connection portion (98) through which the blow-by gas collection passage (91) is connected to a cam chamber (3A). Thus, new air in the cam chamber (3A) flows into the blow-by gas collection passage (91) at an inlet portion of the oil separator (92) through the connection portion (98) to dilute the blow-by gas.

Abstract: A method of manufacturing a ceramic sintered body, includes: a film forming step of forming, on a surface of a heat-resistant metal material, a metal coating film made of a metal material having a standard free energy of formation of metal carbides lower than that of the heat-resistant metal material; a molding step of disposing heat-resistant metal material provided with the coating film in the film forming step at a predetermined position in powder that serves as a starting material of a ceramic base, and molding a ceramic green body by press-molding the powder; and a sintering step of generating a ceramic sintered body by sintering the ceramic green body molded in the molding step.

Abstract: A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface.

Abstract: It is an object to provide a friction stir tool excellent in productivity, high temperature strength, and wear resistance at high temperatures. The friction stir tool is formed of a Co-based alloy comprising crystal grains containing a ?? precipitate phase dispersed and precipitated therein, and a crystal grain boundary region and a precipitate phase between adjacent crystal grains, in which the precipitate phase is at least one phase selected from a ? phase, a Laves phase and a carbide phase.

Abstract: A multilayered wiring board having a stack structure multilayered by alternately stacking a plurality of conductor layers and a plurality of resin insulation layers, wherein a solder resist is provided on at least one of a first main surface side and a second main surface side of the stack structure, a plurality of openings are formed in an outermost resin insulation layer that contacts with the solder resist, a plurality of the first main surface side connecting terminals or a plurality of the second main surface side connecting terminals being made of a copper layer as a main component and positioned in a plurality of the openings, terminal outer surfaces being positioned inwardly from an outer surface of the outermost resin insulation layer, and the solder resist extends into the plurality of openings and makes contact with an outer circumference portion of each of the terminal outer surfaces.

Abstract: A Ni-base alloy large-size member comprises a base material having strip-shaped carbide segregation, and a homogeneous modified layer formed on a welding groove surface by treatment using Friction stir processing and solution treatment. In addition, a Ni-base alloy welded structure is manufactured by welding the Ni-base alloy large-size member with other member constituting the Ni-base alloy welded structure, such as a member formed of ferrite steel or another Ni-base alloy large-size member under the condition that weld penetration depth is shallower than the thickness of the modified layer.

Abstract: A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.

Abstract: According to one embodiment, the A/D conversion unit includes a ?? modulating device which samples the analog electric quantity provided by the electric power system with a predetermined modulation frequency and outputs a bit stream changing over time of single bit obtained by performing ?? modulation, and the digital operation processing unit includes one or more digital filters which inputs the bit stream from the ?? modulating device and of which frequency characteristics differ according to a type of protection control operation, and one or more operation processing elements which perform different kinds of protection control operation processing, based on the bit stream provided by the digital filter.

Abstract: Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.

Abstract: It is an objective of the present invention to provide an effective use of the friction stir processing (FSP) technology for Ti-alloy turbine blades with a long radial length, and provide a Ti-alloy turbine blade having both high erosion resistance and high long term reliability. There is provided a turbine blade made of an ?-? titanium alloy having an average Vickers hardness of 320 Hv or less, the turbine blade having a leading edge, in which: the turbine blade includes, at the leading edge thereof, a first hardened surface region having a thickness of from 0.5 to 3.0 mm and having an average Vickers hardness of 340 Hv or more; and the first hardened surface region is formed by friction stir processing a surface region of the leading edge of the turbine blade.

Abstract: A disk brake includes a caliper body having a cylinder portion 25 with a cylindrical shape. The cylinder portion 25 has a bore 30 with a bottom 34 formed by integrally joining together an opening peripheral edge 98 at the bottom side of the cylinder portion 25 and a bottom cover member 92 to be fitted to the opening peripheral edge 98 through friction stir welding. The bottom cover member 92 has a disk shape and is friction-stir-welded along the outer periphery thereof. The terminating point of the friction stir welding is within the boundaries of the bottom cover member 92.

Abstract: A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A2 to a thickness corresponding to the area A2 is greater than the ratio of a total thickness of the second-type resin insulation layers located in an area A1 to a thickness corresponding to the area A1. The laminate structure is warped such that the laminate structure is convex toward the side where the second main face is present.

Abstract: Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer.

Abstract: To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer 25 having a plurality of openings 35, 36 is disposed on a top surface 31 side, and IC-chip connection terminals 41 and capacitor connection terminals 42 are buried in an outermost resin insulation layer 23 in contact with the solder resist layer 25. Each of the IC-chip connection terminals 41 and the capacitor connection terminals 42 is composed of a copper layer 44 and a plating layer 46 covering the outer surface of the copper layer 44. A conductor layer 26 present at the interface between the solder resist layer 25 and the resin insulation layer 23 is composed of a copper layer 27 and a nickel plating layer 28 covering the outer surface of the copper layer 27.

Abstract: An object of the present invention is to provide a method for producing a composite material that can prevent a powdered additive to be mixed from scattering and control a quantity of the additive dispersed in the composite material. A method for producing a composite material in which an additional material different from a base material is dispersed into a part of the base material comprises the steps of providing a wire rod formed by applying a metallic film to the additional material to be dispersed or by stuffing a metallic tube with the additional material to be dispersed, fixing the wire rod on a surface or into an inside of the base material, and applying stirring along the fixed wire rod with a tool for friction stirring to disperse the additional material into the part of the base material.

Abstract: In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening.

Abstract: A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface.

Abstract: A multilayered wiring board having a stack structure multilayered by alternately stacking a plurality of conductor layers and a plurality of resin insulation layers, wherein a solder resist is provided on at least one of a first main surface side and a second main surface side of the stack structure, a plurality of openings are formed in an outermost resin insulation layer that contacts with the solder resist, a plurality of the first main surface side connecting terminals or a plurality of the second main surface side connecting terminals being made of a copper layer as a main component and positioned in a plurality of the openings, terminal outer surfaces being positioned inwardly from an outer surface of the outermost resin insulation layer, and the solder resist extends into the plurality of openings and makes contact with an outer circumference portion of each of the terminal outer surfaces.

Abstract: An apparatus for a friction stir and a friction stir processing of the present invention suppress an occurrence of a surface defect in an area processed by the friction stir. The apparatus for the friction stir includes a tool having a columnar tip-side part, a rotating unit for rotating the tool on a central axis, a first pressing unit for pressing a tip of the tool rotated by the rotating unit against a work, a jig having a tool insertion hole into which the tip-side part of the tool is inserted so that the tip-side part of the tool is encircled around the jig, a second pressing unit for slidably pressing the jig against the work, and a press control unit for controlling the first pressing unit so that the tip-side part of the tool is gradually pulled out of the work by the first pressing unit while moving the tool and the jig relative to the work, in a state that the tool is rotated by the rotating unit and the tip of the tool has been sunk into the work to a predetermined depth by the first pressing unit.

Abstract: A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.