Abstract: In one embodiment, a memory card comprises a card substrate, at least one memory chip attached to the card substrate, a control chip mounted on the memory chip, bonding wires electrically connecting the chips with the card substrate, a passive device attached to the card substrate near the memory chip, and a molded body encapsulating the memory chip, the control chip, the bonding wires and the passive device. In addition, the memory card comprises an adhesive spacer interposed between the same-sized chips to secure a wire loop of the bonding wires.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.

Abstract: A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the first semiconductor chip is attached to the upper surface of the substrate and the upper surface of the first semiconductor chip includes a plurality of first electrode pads, and a second semiconductor chip having an upper surface and a lower surface. The lower surface of the second semiconductor chip is attached to the upper surface of the first semiconductor chip, and the lower surface of the second semiconductor chip includes trenches that correspond to the locations of the first electrode pads on the upper surface of the first semiconductor chip.

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30-50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: A semiconductor package using a tape circuit board with a groove for preventing an encapsulant from overflowing and a manufacturing method for this package are disclosed. The semiconductor package comprises a semiconductor chip with a plurality of electrode pads formed on an active surface thereof; a tape circuit board including an insulating tape with a window formed in a center thereof; circuit patterns formed on an upper surface of the insulating tape, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads connected to the board pads; and a protection layer overlying the upper surface of the insulating tape, leaving the board pads and the conductive ball pads uncovered. The active surface of the chip is attached to a lower surface of the insulating tape and the electrode pads are exposed through the window and electrically connected to board pads.

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.