Semiconductor package
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Description
FIG. 1 is a perspective view showing our design;
FIG. 2 is a left-hand side view thereof, the right-hand side view being a mirror image thereof;
FIG. 3 is a front view thereof, the rear view being identical thereto;
FIG. 4 is a sectional view thereof;
FIG. 5 is a top view thereof; and,
FIG. 6 is a bottom plan view thereof.
Referenced Cited
Patent History
Patent number: D432097
Type: Grant
Filed: Jan 24, 2000
Date of Patent: Oct 17, 2000
Assignee: Samsung Electronics Co., Ltd. (Suwon)
Inventors: Young-Hee Song (Kyungki-Do), Hai-Jeong Sohn (Suwon), Se-Yong Oh (Seoul), Jun-Young Jeon (Seoul)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/117,450
Type: Grant
Filed: Jan 24, 2000
Date of Patent: Oct 17, 2000
Assignee: Samsung Electronics Co., Ltd. (Suwon)
Inventors: Young-Hee Song (Kyungki-Do), Hai-Jeong Sohn (Suwon), Se-Yong Oh (Seoul), Jun-Young Jeon (Seoul)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/117,450
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;