Patents by Inventor Seok Won Lee

Seok Won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200217318
    Abstract: Disclosed is a liquid-ring compressor including a bypass pipe, in which the bypass pipe is directly mounted to a main body of the liquid-ring compressor, thereby greatly reducing costs incurred in the installation of a facility or a system including the liquid-ring compressor, and also economically reducing maintenance costs. The liquid-ring compressor includes a main body accommodating a shaft centrally mounted therein to receive rotational force from a driving motor, a rotor configured to rotate together with the shaft inside the main body, a suction port formed at a portion of the main body, a discharge port formed at another portion of the main body, a bypass pipe mounted between a position adjacent to the suction port in the main body and a position adjacent to the discharge port in the main body, and an opening/closing valve mounted in the middle of the bypass pipe.
    Type: Application
    Filed: March 4, 2019
    Publication date: July 9, 2020
    Inventor: SEOK WON LEE
  • Publication number: 20200203431
    Abstract: A three-dimensional semiconductor device is provided as follows. A substrate includes a contact region, a dummy region, and a cell array region. A stack structure includes electrodes vertically stacked on the substrate. The electrodes are stacked to have a first stepwise structure on the contact region and a second stepwise structure in the dummy region. Ends of at least two adjacent electrodes in the second stepwise structure have first sidewalls vertically aligned so that horizontal positions of the first sidewalls are substantially the same.
    Type: Application
    Filed: February 28, 2020
    Publication date: June 25, 2020
    Inventors: JOYOUNG PARK, Seok-Won Lee, Seongjun Seo
  • Publication number: 20200200172
    Abstract: Disclosed is a liquid-ring vacuum pump that enables a worker to inspect components provided in a main body from the outside using a see-through device without disassembling the main body and to easily remove foreign matter from the main body merely by demounting the see-through device from the main body. The liquid-ring vacuum pump includes a main body, which accommodates a shaft centrally mounted therein to receive rotational force from a driving motor and has a mounting hole formed therein so as to communicate with the interior of the main body, a rotor rotating together with the shaft inside the main body, a head unit coupled to at least one side of the main body, and a see-through device, which is detachably mounted in the mounting hole and includes a see-through window member to allow the interior of the main body to be inspected with the naked eye.
    Type: Application
    Filed: March 4, 2019
    Publication date: June 25, 2020
    Inventor: SEOK WON LEE
  • Patent number: 10690619
    Abstract: A method for measuring a concentration of an analyte in a bio-sample using an electrochemical bio-sensor according to an exemplary embodiment of the present invention is characterized by a step of obtaining predetermined features from induced currents obtained by applying a DC voltage according to chronoamperometry in which, after a whole blood sample is injected to the electrochemical bio-sensor, a concentration of an analyte is obtained from an induced current obtained by applying a DC voltage for a certain time and from all induced currents obtained by further applying several step-ladder perturbation potentials for a short time subsequent to the DC voltage for the certain time, and is also characterized by minimization of a measurement error caused by a hindering material by forming a calibration equation by combining the at least one feature in a function and optimizing various conditions of the bio-sample through DeletedTextsmultivariable analysis.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: June 23, 2020
    Assignee: I-SENS, INC.
    Inventors: Geun Sig Cha, Hakhyun Nam, Seok-Won Lee, Sung Hyuk Choi, Youngjea Kang, Myeongho Lee, Ho Dong Park, Sung Pil Cho
  • Patent number: 10641267
    Abstract: Disclosed is a component-replaceable water ring vacuum pump in which inner components within a head unit may be disassembled and replaced without separation of the head unit from a main body, thus shortening an operation time and improving operation efficiency through prevention of leakage of an inner liquid during a replacement process. The water ring vacuum pump includes a main body provided with a shaft, a rotor rotated together with the shaft within the main body, a head unit coupled to both sides of the main body, a guide bearing provided within the head unit, and a mechanical seal configured to block inner gas. A bearing bracket to support the guide bearing is detachably fastened to one side of the head unit by a bolt, and an inner cap and an outer cap are assembled to the inner and outer surfaces of the bearing bracket by fixing bolts.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: May 5, 2020
    Assignee: VACCOMP CO., LTD.
    Inventor: Seok Won Lee
  • Patent number: 10622320
    Abstract: A semiconductor package may include a semiconductor chip; a molding portion configured to surround at least a side surface of the semiconductor chip; a passivation layer including a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, below the semiconductor chip; and a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-youn Kim, Seok-hyun Lee, Youn-ji Min, Kyoung-lim Suk, Seok-won Lee
  • Patent number: 10621165
    Abstract: The present invention suggests need supporting means generating apparatus and method which extract requirements from a user using a repertory grid which is a cognitive interview technique to generate supporting means thereof. The need supporting means generating apparatus of the present invention includes: a question message generating unit which generates at least one question message related with predetermined context information; an answer message obtaining unit which obtains at least one answer message with respect to the question message; a feature information extracting unit which extracts at least one feature information related with the context information based on the answer message; and a supporting means generating unit which generates at least one supporting means to support needs of a user based on the feature information.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: April 14, 2020
    Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Seok Won Lee, Dey Sangeeta
  • Publication number: 20200083296
    Abstract: A three-dimensional semiconductor device is provided as follows. A substrate includes a contact region, a dummy region, and a cell array region. A stack structure includes electrodes vertically stacked on the substrate. The electrodes are stacked to have a first stepwise structure on the contact region and a second stepwise structure in the dummy region. Ends of at least two adjacent electrodes in the second stepwise structure have first sidewalls vertically aligned so that horizontal positions of the first sidewalls are substantially the same.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 12, 2020
    Inventors: Joyoung PARK, Seok-Won LEE, Seongjun SEO
  • Publication number: 20190393749
    Abstract: A motor using a printed circuit board may include: a first base part forming a first circuit board on which a coil pattern is printed; a second base part forming a second circuit board on which the coil pattern is printed, the second base part spaced apart from the first base part; and a plurality of side parts forming side circuit boards on which the coil pattern is printed, the plurality of side parts connected to the first base part and the second base part, respectively, such that the coil pattern successively connects the first base part, the second base part, and the plurality of side parts.
    Type: Application
    Filed: November 30, 2018
    Publication date: December 26, 2019
    Inventors: Jun Hwan Park, Seok Won Lee
  • Patent number: 10483323
    Abstract: A three-dimensional semiconductor device is provided as follows. A substrate includes a contact region, a dummy region, and a cell array region. A stack structure includes electrodes vertically stacked on the substrate. The electrodes are stacked to have a first stepwise structure on the contact region and a second stepwise structure in the dummy region. Ends of at least two adjacent electrodes in the second stepwise structure have first sidewalls vertically aligned so that horizontal positions of the first sidewalls are substantially the same.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: November 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joyoung Park, Seok-Won Lee, Seongjun Seo
  • Publication number: 20190242910
    Abstract: The present invention relates to a kit for quantitative analysis of glycated hemoglobin (HbA1c), and the kit for quantitative analysis of HbA1c according to the present invention has excellent long-term stability of an enzyme reagent and thus has an effect of easily overcoming the disadvantages of the conventional reagents used in enzyme assays (e.g., storage, accuracy, portability, convenience of use, etc.).
    Type: Application
    Filed: August 10, 2017
    Publication date: August 8, 2019
    Inventors: Dongxuan Shen, Jihoon Kim, Joo Young Cho, Kap Soo Park, Hyeong Eun Kim, Hyun Kyu Cho, Seok Won Lee, Hakhyun Nam, Geun Sig Cha
  • Publication number: 20190240830
    Abstract: A cable conveying apparatus including a first feed robot configured to feed a box containing cable, a first transfer robot configured to take the cable out of the box fed by the first feed robot and insert the cable into a pallet, and a scanner placed in a path of one of the first feed robot, the first transfer robot, and the box, the scanner being configured to acquire information about the cable.
    Type: Application
    Filed: February 27, 2018
    Publication date: August 8, 2019
    Inventors: Chang Hwan LIM, Chang Eun LEE, Sung Soo KIM, Seok Won LEE
  • Patent number: 10371709
    Abstract: A modular automatic analyzer using a circular type cartridge enabling centrifugation according to an exemplary embodiment of the present invention includes: a main body frame; an X-axis conveying unit which reciprocally moves in an X-axis direction with respect to the main body frame; a circular type cartridge accommodating housing which is installed with respect to the X-axis conveying unit so as to be reciprocally movable in the X-axis direction by the X-axis conveying unit, a single rotation drive unit which is installed in the circular type cartridge accommodating housing and is rotated step by step at a predetermined interval or rotated at a high speed for centrifugation, a circular type cartridge which is installed at an upper surface of the circular type cartridge accommodating housing so as to be rotatably connected to the rotation drive unit and has wells disposed to be spaced apart from each other at predetermined intervals in a circumferential direction of a disc-shaped main body, a tip lifting uni
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 6, 2019
    Assignee: I-SENS, INC.
    Inventors: Kyungho Kim, Jae Phil Do, Jaewon Jung, Jung Uk Ha, Sang Taek Shin, Seok-Won Lee, Yungjoon Jin, Yusung Kim
  • Patent number: 10351067
    Abstract: A mobility device storage apparatus for a vehicle, may include a door having a storage space therein and a position releasing portion disposed in the storage space; and a tiltable storage device disposed in the storage space to be rotatable in a lateral direction, the tiltable storage device being tiltable in a vertical direction wherein a tilting motion of the tiltable storage device in the vertical direction is restricted by a tilting-up locking portion, wherein when the tiltable storage device is rotated in the lateral direction, the tilting-up locking portion is interlocked with the position releasing portion, wherein the tilting motion of the tiltable storage device in the vertical direction is unrestricted to allow the tiltable storage device to be tilted upward or downward.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: July 16, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corp.
    Inventors: Dong Han Koo, Seok Won Lee, Jae Young Choi, Jun Hwan Park
  • Patent number: 10315307
    Abstract: A wearable chair robot system is provided and includes a first link having a first end hinge-connected to a heel of a user and a second end rotating up and down about the first end distal to a foot of the user, and supported on the ground at a lower limit. The system further includes a second link having a first end hinge-connected to the user above the first end of the first link and a second end that extends distal to the user. A third link has a first end hinge-connected to the second end of the link and a second end hinge-connected to the second end of the first link. Further, a driving unit has a first end hinge-connected to the user above the first end of the second link and a second end extending downward and hinge-connected to the second end of the first link or the third link.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: June 11, 2019
    Assignee: Hyundai Motor Company
    Inventors: Seok Won Lee, Dong Han Koo
  • Patent number: 10286851
    Abstract: The present disclosure provides a storage apparatus for a mobility device in a vehicle, wherein the mobility device is stored in a vehicle door and the mobility device can be taken out directly from the vehicle door by maintaining the tilted state of the mobility device.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: May 14, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Dong Han Koo, Seok Won Lee, Jae Young Choi, Jun Hwan Park
  • Publication number: 20190081105
    Abstract: A three-dimensional semiconductor device is provided as follows. A substrate includes a contact region, a dummy region, and a cell array region. A stack structure includes electrodes vertically stacked on the substrate. The electrodes are stacked to have a first stepwise structure on the contact region and a second stepwise structure in the dummy region. Ends of at least two adjacent electrodes in the second stepwise structure have first sidewalls vertically aligned so that horizontal positions of the first sidewalls are substantially the same.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 14, 2019
    Inventors: Joyoung Park, Seok-Won Lee, Seongjun Seo
  • Publication number: 20190063434
    Abstract: Disclosed is a component-replaceable water ring vacuum pump in which inner components within a head unit may be disassembled and replaced without separation of the head unit from a main body, thus shortening an operation time and improving operation efficiency through prevention of leakage of an inner liquid during a replacement process. The water ring vacuum pump includes a main body provided with a shaft, a rotor rotated together with the shaft within the main body, a head unit coupled to both sides of the main body, a guide bearing provided within the head unit, and a mechanical seal configured to block inner gas. A bearing bracket to support the guide bearing is detachably fastened to one side of the head unit by a bolt, and an inner cap and an outer cap are assembled to the inner and outer surfaces of the bearing bracket by fixing bolts.
    Type: Application
    Filed: February 6, 2018
    Publication date: February 28, 2019
    Inventor: SEOK WON LEE
  • Publication number: 20190027451
    Abstract: A semiconductor package may include a semiconductor chip; a molding portion configured to surround at least a side surface of the semiconductor chip; a passivation layer including a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, below the semiconductor chip; and a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer.
    Type: Application
    Filed: January 12, 2018
    Publication date: January 24, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-youn KIM, Seok-hyun LEE, Youn-ji MIN, Kyoung-lim SUK, Seok-won LEE
  • Publication number: 20190009405
    Abstract: A wearable muscular strength assist apparatus and a method and a system of controlling the same are disclosed. The wearable muscular strength assist apparatus includes a main body for supporting the upper body of a wearer, a plurality of leg pulleys provided at the left and right sides of the main body, a plurality of links, each having one end for supporting a respective one of the legs of the wearer and the remaining end connected to a respective one of the leg pulleys so as to be interlocked therewith, a plurality of wires, each being connected to a respective one of the leg pulleys, and a driving unit provided at the main body and connected with the wires in order to provide the wires with tensile force for rotating the respective leg pulleys.
    Type: Application
    Filed: December 8, 2017
    Publication date: January 10, 2019
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hun Keon KO, Dong Jin HYUN, Seok Won LEE