Abstract: A method for measuring a concentration of an analyte in a bio-sample using an electrochemical bio-sensor according to an exemplary embodiment of the present invention is characterized by a step of obtaining predetermined features from induced currents obtained by applying a DC voltage according to chronoamperometry in which, after a whole blood sample is injected to the electrochemical bio-sensor, a concentration of an analyte is obtained from an induced current obtained by applying a DC voltage for a certain time and from all induced currents obtained by further applying several step-ladder perturbation potentials for a short time subsequent to the DC voltage for the certain time, and is also characterized by minimization of a measurement error caused by a hindering material by forming a calibration equation by combining the at least one feature in a function and optimizing various conditions of the bio-sample through Deleted Texts multivariable analysis.

Abstract: Provided are methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby. The device may include electrodes sequentially stacked on a substrate to constitute an electrode structure. each of the electrodes may include a connection portion protruding horizontally and outward from a sidewall of one of the electrodes located thereon and an aligned portion having a sidewall coplanar with that of one of the electrodes located thereon or thereunder. Here, at least two of the electrodes provided vertically adjacent to each other may be provided in such a way that the aligned portions thereof have sidewalls that are substantially aligned to be coplanar with each other.

Abstract: In a method of manufacturing a semiconductor device, a dielectric layer structure and a control gate layer can be formed sequentially on a substrate. The control gate layer can be partially etched to form a plurality of control gates. A gate spacer and a sacrificial spacer sequentially can be stacked on a sidewall of the control gate and on a portion of the dielectric layer structure. The dielectric layer structure can be partially etched using the sacrificial spacer and the gate spacer as an etching mask to form a plurality of dielectric layer structure patterns. The sacrificial spacer can be removed. An insulating interlayer can be formed on the substrate to form an air gap. The insulating interlayer can cover the dielectric layer structure pattern, the gate spacer and the control gate. The air gap can extend between the adjacent gate spacers and between the adjacent dielectric layer structure patterns.

Abstract: Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.

Abstract: A method of controlling the gait of a wearable robot using foot sensors of the robot. Whether or not the robot is walking is determined. When the robot is walking, whether the robot is supported on both feet or one foot using the foot sensors is determined. When the robot is walking and is supported on both feet, posture-maintaining control is carried out. When the robot is walking and is supported on one foot, support control is carried out over a supporting leg based on gravity compensation and load compensation. When the robot is walking and is supported on one foot, an imaginary repulsive force by which a swinging leg swings is generated.

Abstract: Three-dimensional (3D) semiconductor devices are provided. The 3D semiconductor device includes a plurality of dummy pillars penetrating each cell pad of an electrode structure and the electrode structure disposed under each cell pad. Insulating patterns of a mold stack structure for formation of the electrode structure may be supported by the plurality of dummy pillars, so transformation and contact of the insulating patterns may be minimized or prevented.

Abstract: To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.

Abstract: A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.

Abstract: Disclosed herein is an Intrusion Detection System (IDS) false positive detection apparatus and method. An IDS false positive detection apparatus includes a payload extraction unit for extracting payloads by dividing each packet corresponding to an IDS detection rule into a header and a payload. A false positive payload information generation unit generates false positive payload information required to identify a false positive payload by extracting a payload of a false positive packet based on results of packet analysis received from a manager. A false positive payload determination unit transmits results of a determination of whether each payload extracted by the payload extraction unit corresponds to a false positive payload, based on the false positive payload information, to the manager.

Abstract: A vertical memory device includes a substrate, a channel, gate lines and a connecting portion. A plurality of the channels extend in a first direction which is vertical to a top surface of a substrate. A plurality of the gate lines are stacked in the first direction to be spaced apart from each other and extend in a second, lengthwise direction, each gate line intersecting a set of channels and surrounding outer sidewalls of each channel of the set of channels. The gate lines forms a stepped structure which includes a plurality of vertical levels. A connecting portion connects a group of gate lines of the plurality of gate lines located at the same vertical level, the connecting portion diverging from the second direction in which the gate lines of the group of gate lines extend.

Abstract: An apparatus and method for detecting forgery/falsification of a homepage. The apparatus includes a homepage image shot generation module for generating homepage image shots of an entire screen of an accessed homepage. A character string extraction module extracts character strings from each homepage image shot using an OCR technique. A character string comparison module compares each of the extracted character strings with character strings required for determination of homepage forgery/falsification, thus determining whether the extracted character string is a normal character string or a falsified character string. A homepage falsification determination module determines whether the corresponding homepage has been forged/falsified, based on results of the comparison. A character string learning module learns the character string extracted from the homepage image shot, based on results of the determination, and classifies the character string as the normal character string or the falsified character string.

Abstract: A main hub, a sub hub, and a sensor node communicating in a wireless body area network (WBAN) including at least one sub hub, and a communication method thereof, are provided. A communication method of the main hub, includes assigning a beacon slot to the sub hub. The method further includes receiving, from the sub hub, a beacon signal based on the beacon slot. The method further includes verifying whether the sub hub includes data to be transmitted to the main hub based on the beacon signal. The method further includes receiving, from the sub hub, the data based on a result of the verification.

Abstract: A method includes determining whether a robot is walking and a direction in which the robot is walking; measuring an amount of time taken for a sole of a foot of the robot to step on the ground; calculating an imaginary reaction force applied to the sole using a trigonometric function having, as a period, the measured amount of time taken for the sole to step on the ground; and applying the calculated imaginary reaction force to a Jacobian transposed matrix and converting the imaginary reaction force into a drive torque for a lower extremity joint of the robot.

Abstract: A method includes: forming an imaginary wall at a position spaced apart and outward from feet of the robot when the robot is in a double-leg-support state; kinetically calculating a variation in a distance between a body of the robot and the imaginary wall and a variation in a speed of the body of the robot relative to the imaginary wall using an angle of a joint and lengths of links of the robot; applying the variation in the distance and the variation in the speed to an imaginary spring-damper model formed between the body of the robot and the imaginary wall, and calculating an imaginary reaction force required by the body of the robot; and converting the calculated reaction force into a drive torque required by the body of the robot using a Jacobian transposed matrix.

Abstract: To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.

Abstract: A system for controlling driving of a wearable robot may include a drive unit for operating a drive joint of the robot, a measurement unit for measuring an actual angle and an actual angular velocity of the drive joint in the robot, a sensing unit for determining a human torque applied by a wearing user to the drive joint, and a control unit for determining a target angular velocity of the robot by applying the determined human torque to an admittance model and for determining a required torque that may be input to the drive unit of the robot by applying an optimal control gain to a difference between the target angular velocity and the actual angular velocity of the robot.

Abstract: A robot gripper is provided comprising two robot arms, upper contact parts, and lower contact parts disposed at the ends of each of the two robot arms. The upper and lower contact parts are in contact with a top and a bottom of an article when gripping the article, The upper and lower contact parts are semispherical shaped and have predetermined radii. Sensor units are mounted on the upper contact parts and the lower contact parts. The sensor units measure vertical or horizontal forces applied to the upper contact parts or the lower contact parts when gripping the article. A control unit configured to determine whether the center of gravity of the article is located at a center position between the ends of the arms using vertical and horizontal distances between the ends of the arms and vertical components of the forces measured by the sensor units when gripping the article is provided.

Abstract: To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.

Abstract: A method includes: forming an imaginary wall at a position spaced apart and outward from feet of the robot when the robot is in a double-leg-support state; kinetically calculating a variation in a distance between a body of the robot and the imaginary wall and a variation in a speed of the body of the robot relative to the imaginary wall using an angle of a joint and lengths of links of the robot; applying the variation in the distance and the variation in the speed to an imaginary spring-damper model formed between the body of the robot and the imaginary wall, and calculating an imaginary reaction force required by the body of the robot; and converting the calculated reaction force into a drive torque required by the body of the robot using a Jacobian transposed matrix.

Abstract: A method includes determining whether a robot is walking and a direction in which the robot is walking; measuring an amount of time taken for a sole of a foot of the robot to step on the ground; calculating an imaginary reaction force applied to the sole using a trigonometric function having, as a period, the measured amount of time taken for the sole to step on the ground; and applying the calculated imaginary reaction force to a Jacobian transposed matrix and converting the imaginary reaction force into a drive torque for a lower extremity joint of the robot.