Abstract: An automated semiconductor parametric test system has a control module that is operable to concurrently control both operation of semiconductor test equipment and operation of parametric test instrumentation. A state oscillator module is controlled by the control module, and further may be operated by the control module in some embodiments to control the state of other system modules in synchronization with other system events. A parametric test equipment module facilitates control of the semiconductor parametric test equipment, and a test instrumentation module facilitates control of the parametric test instrumentation.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: An intelligent measurement modular semiconductor parametric test system comprises an engine control module. The engine control module is operable to communicate with a user via a user interface, and is further operable to communicate with and to control the state of at least one other module in the semiconductor parametric test system including pluggable modules. The engine control module is further operable to control test flow via a test monitor module based on data and control events received from an intelligent measurement module. Other modules in various embodiments comprise prober monitor modules.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: Methods, systems, and apparatuses provide dynamic creation and modification of wafer test maps. Test plans are defined for a testing session of a wafer lot. The test plan is associated with a number of seed map patterns. During a wafer lot testing session, test results are dynamically obtained and examined at run-time of a test. Moreover, the seed map patterns are overlaid on the test sites defined in the test plan. If the test result statistics are outside of defined threshold tolerance levels, then a new wafer test map is created or modified at run-time, according to corresponding seed map patterns. If seed map patterns are within the intersection of valid test sites, then seed map patterns are created at run-time.

Abstract: Methods, systems, and apparatuses provide dynamic creation and modification of wafer test maps. Test plans are defined for a testing session of a wafer lot. The test plan is associated with a number of seed map patterns. During a wafer lot testing session, test results are dynamically obtained and examined at run-time of a test. Moreover, the seed map patterns are overlaid on the test sites defined in the test plan. If the test result statistics are outside of defined threshold tolerance levels, then a new wafer test map is created or modified at run-time, according to corresponding seed map patterns. If seed map patterns are within the intersection of valid test sites, then seed map patterns are created at run-time.

Abstract: A method and system for generating control settings for a multi-parameter control system. The interdependencies of processing tools and the related effect on semiconductor wafers within a processing tool is factored into a mathematical model that considers desired and measured wafer quality parameters in the derivation of specific solutions of sets of possible quality parameter adjustments. A selection process determines a set of adjustments such as one that results in minimal changes to the process.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: Methods, systems, and apparatuses provide dynamic creation and modification of wafer test maps. Test plans are defined for a testing session of a wafer lot. The test plan is associated with a number of seed map patterns. During a wafer lot testing session, test results are dynamically obtained and examined at run-time of a test. Moreover, the seed map patterns are overlaid on the test sites defined in the test plan. If the test result statistics are outside of defined threshold tolerance levels, then a new wafer test map is created or modified at run-time, according to corresponding seed map patterns. If seed map patterns are within the intersection of valid test sites, then seed map patterns are created at run-time.

Abstract: A method and system for generating control settings for a multi-parameter control system. The interdependencies of processing tools and the related effect on semiconductor wafers within a processing tool is factored into a mathematical model that considers desired and measured wafer quality parameters in the derivation of specific solutions of sets of possible quality parameter adjustments. A selection process determines a set of adjustments such as one that results in minimal changes to the process.

Abstract: An apparatus, method, system, and signal-bearing medium may provide multiple maps, which may include multiple probing sequences to be called upon at run-time based on statistical thresholds or other selected criteria. Each map may include a series of locations on a wafer, the tests to perform at each location, and the measured results of each test. A parametric test system may perform the test at the associated location on the wafer. If the statistical threshold is exceeded or the selected criteria is met, the current map may be abandoned in favor of a different map.

Abstract: An intelligent measurement modular semiconductor parametric test system comprises an engine control module. The engine control module is operable to communicate with a user via a user interface, and is further operable to communicate with and to control the state of at least one other module in the semiconductor parametric test system including pluggable modules. The engine control module is further operable to control test flow via a test monitor module based on data and control events received from an intelligent measurement module. Other modules in various embodiments comprise prober monitor modules.

Abstract: An automated semiconductor parametric test system has a control module that is operable to concurrently control both operation of semiconductor test equipment and operation of parametric test instrumentation. A state oscillator module is controlled by the control module, and further may be operated by the control module in some embodiments to control the state of other system modules in synchronization with other system events. A parametric test equipment module facilitates control of the semiconductor parametric test equipment, and a test instrumentation module facilitates control of the parametric test instrumentation.

Abstract: A method and apparatus for monitoring characteristics of a fluid contained in a vessel includes a fluid displacer suspended in the vessel. The buoyant force acting on the fluid displacer is measured using a pair of force transducers and used to calculate fluid characteristics such as the height of the fluid in the vessel, fluid density, solute concentration, and/or the presence of fluid cascading from one section of the vessel to another.

Abstract: A method and apparatus for monitoring characteristics of a fluid contained in a vessel includes a pair of triangular fluid displacers suspended in the vessel. The buoyant forces acting on the fluid displacers are measured using force transducers and used to calculate fluid characteristics such as the height of the fluid in the vessel, fluid density, solute concentration, and/or the presence of fluid cascading from one section of the vessel to another.