Abstract: Provided are a method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device. The method includes forming an etch target layer on a substrate, forming thermally decomposable patterns spaced apart from each other on the etch target layer, forming a first mask pattern covering at least sidewalls of the thermally decomposable patterns, and removing the thermally decomposable patterns by a heating method to expose a sidewall of the first mask pattern.

Abstract: A method of fabricating a semiconductor device includes forming a device isolation layer in a substrate to define active regions, forming a conductive layer on the active regions, forming first mask patterns intersecting the active regions on the conductive layer, etching the conductive layer using the first mask patterns as etch masks to form bit lines, growing second mask patterns from top surfaces of the first mask patterns, and performing a patterning process using the second mask patterns as etch masks to form contact holes exposing the active regions between the bit lines.

Abstract: A substrate on which spacers are disposed in a certain arrangement state and an optical device using such a substrate are provided. A plurality of spacers are irregularly disposed on a substrate depending on a predetermined rule, so that overall uniform optical characteristics can be ensured without causing a so-called moire phenomenon or the like, while the spacers maintain the uniform cell gap in the construction of the optical device.

Abstract: A substrate having a spacer formed thereon, a method of making the same, and an optical device including the same are disclosed herein. In one embodiment, a substrate includes a base layer, and a black column spacer formed on the base layer, wherein the black column spacer has an optical density in a range of 1.1 to 4, and wherein the black column spacer having a curved portion, wherein a cross section of the curved portion having at least one region having curvature.

Abstract: A substrate and a method for producing the same are disclosed herein. In some embodiments, a substrate includes a base layer, a black layer formed on the base layer, and column spacers formed on the black layer, wherein a loss rate of spacers measured by a peel test is 15% or less. The substrate can have excellent adhesiveness of the spacer to the base layer or the black layer and ensuring appropriate darkening properties. The method can effectively produce such a substrate without adverse effects such as occurrence of foreign materials without separate treatment such as heat treatment.

Abstract: A method of fabricating a semiconductor device includes forming a device isolation layer in a substrate to define active regions, forming a conductive layer on the active regions, forming first mask patterns intersecting the active regions on the conductive layer, etching the conductive layer using the first mask patterns as etch masks to form bit lines, growing second mask patterns from top surfaces of the first mask patterns, and performing a patterning process using the second mask patterns as etch masks to form contact holes exposing the active regions between the bit lines.

Abstract: Disclosed are a coil assembly of a slotless motor, a housing, and a slotless motor including the same. According to the present invention, there is provided a coil assembly of a slotless motor which includes a plurality of first coil structures which have two first coil sides facing each other with a first space interposed therebetween and having a fan-shaped cross section in a width direction and have a first end turn bent in a first direction on at least one end in a longitudinal direction of the two first coil sides and a plurality of second coil structures which have two second coil sides facing each other with a second space interposed therebetween and having a fan-shaped cross section in a width direction and have a second end turn bent in a second direction on at least one end in a longitudinal direction of the two second coil sides, wherein the plurality of first coil structures and the plurality of second coil structures are coupled to each other to form a circular stator winding structure.

Abstract: A transparent light emitting device display comprising: a transparent substrate; a conductive metal pattern provided on the transparent substrate; a light emitting device provided on at least a part of the conductive metal pattern; a first transparent adhesive layer provided on the transparent substrate, the conductive metal pattern, and the light emitting device; a UV-cut film provided on the first transparent adhesive layer; and a second transparent adhesive layer provided on the UV-cut film.

Abstract: A substrate and a method for producing the same are disclosed herein. In some embodiments, a substrate includes a base layer, a black layer formed on the base layer, and column spacers formed on the black layer, wherein a loss rate of spacers measured by a peel test is 15% or less. The substrate can have excellent adhesiveness of the spacer to the base layer or the black layer and ensuring appropriate darkening properties. The method can effectively produce such a substrate without adverse effects such as occurrence of foreign materials without separate treatment such as heat treatment.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Abstract: A semiconductor memory device and associated methods, the device including first and second lower conductive lines extending in a first direction; a first middle conductive line on the first and second lower conductive lines and extending in a second direction; first and second memory cells between the first and second lower conductive lines and the first middle conductive line; an air gap support layer between the first and second memory cells; and a first air gap between the first and second memory cells and under the air gap support layer, wherein an upper surface of the air gap support layer lies in a same plane as the first and second memory cells, the first and second memory cells include first and second OTS layers and first and second phase-change layers, and the first air gap overlaps the first and second phase-change layers.

Abstract: A partition wall pattern film including a transparent substrate; a first electrode layer provided on the transparent substrate; a partition wall pattern provided on the first electrode layer; and a second electrode layer pattern provided on an entire upper surface of the partition wall pattern and at least a part of a lateral surface of the partition wall pattern.

Abstract: The present application relates to an ink composition for a secondary battery separator, a separator for a secondary battery including the same, and a method for preparing the same.

Abstract: The present specification relates to an apparatus for manufacturing a blanket, a method for manufacturing a blanket, a blanket manufactured using the same, a reverse offset printing roll provided with the blanket, and a reverse offset printing apparatus including the same.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

Abstract: An electrode substrate for a transparent light emitting device display according to an embodiment of the this application comprises: a transparent substrate; (M rows×N columns) light emitting device pad portions provided on the transparent substrate as a matrix; and a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion which are provided on the transparent substrate and connected to the light emitting device pad portions, respectively, in which each of the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion comprises a metal mesh pattern, and line resistance of the first common electrode wiring portion or the second common electrode wiring portion connected to the light emitting device pad portions constituting one row among the light emitting device pad portions satisfies Equation 1 above.

Abstract: The present specification relates to a heating element and a method for manufacturing the same.

Abstract: An electrode substrate for a transparent light emitting device display containing a transparent substrate; a wire electrode unit, which is provided on the transparent substrate and comprises a metal mesh pattern; and at least one light emitting device mounting unit provided on the transparent substrate, in which both an upper surface and a lateral surface of the metal mesh pattern of the wire electrode unit comprise a darkening layer pattern, and both an upper surface and a lateral surface of the light emitting device mounting unit do not comprise a darkening layer pattern.

Abstract: A substrate having a spacer thereon and an optical device including the same are disclosed herein. In some embodiments, a substrate includes a base layer, a transparent column spacer formed on the base layer, and a black layer present between the transparent column spacer and the base layer. In some embodiments, an alignment film is present on the spacer.

Abstract: A substrate, an optical device include the same, and a method of making the same are disclosed herein. In some embodiments, a substrate includes a base layer, a plurality of column spacers disposed on the base layer, and a ball spacer attached to or embedded in at least one of the plurality of column spacers. The spacers having excellent dimensional accuracy and adhesiveness on the substrate.